Patents Examined by Jeremy Evan Sylvester
  • Patent number: 12002806
    Abstract: The semiconductor substrate has a first principal surface and a second principal surface. The base contact layer is arranged between the base layer and the first principal surface, and forms a part of the first principal surface. The anode contact region is arranged between the anode layer and the first principal surface, forms a part of the first principal surface, and has a second conductivity type impurity concentration peak value higher than that of the anode layer. The anode contact region includes a first anode contact layer having a lower net concentration and a higher first conductivity type impurity concentration than the base contact layer.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: June 4, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Koichi Nishi, Shinya Soneda, Takahiro Nakatani