Abstract: A system and method for identifying latent reliability defects (LRD) in semiconductor devices are configured to perform one or more stress tests with one or more stress test tools on at least some of a plurality of wafers received from one or more in-line sample analysis tools to determine a passing set of the plurality of wafers and a failing set of the plurality of wafers, perform a reliability hit-back analysis on at least some of the failing set of the plurality of wafers, analyze the reliability hit-back analysis to determine one or more geographic locations of one or more die fail chains caused by one or more latent reliability defects (LRD), and perform a geographic hit-back analysis on the one or more geographic locations of the one or more die fail chains caused by the LRD.

Abstract: A dynamic impedance imaging system includes a dynamic impedance imaging sensor, an impedance detection and flow rate measurement module and an electrical impedance tomography (EIT) instrument. The impedance detection and flow rate measurement module is configured to detect an abnormal particle flowing through the dynamic impedance imaging sensor to obtain a flow rate of the abnormal particle, and generate a synchronous trigger signal. The EIT instrument is configured to inject a sinusoidal excitation current into the dynamic impedance imaging sensor under the trigger of the synchronous trigger signal, perform multi-channel interleaved sampling for the abnormal particle according to the flow rate to acquire multi-channel sampled data, and calibrate the multi-channel sampled data to implement impedance tomography imaging for the abnormal particle.

Abstract: An electronic apparatus includes: an electronic module; and a flexible substrate electrically connected to the electronic module. The flexible substrate includes: a base film; a plurality of first contact pads arranged at one end on the base film in a first direction, and electrically connected to the electronic module; a plurality of second contact pads arranged at an other end on the base film in the first direction; a plurality of first wires arranged on the base film, and each electrically connecting one of the first contact pads and one of the second contact pads together; and a plurality of third contact pads arranged on the base film, each of the third contact pads being positioned along the first direction between one of the first contact pads and one of the second contact pads, and being electrically connected to one of the first wires.

Abstract: A photonic device and a continuous-wave THz signal generator using such photonic device. The photonic device includes an input waveguide arranged to receive input waves of at least two input frequencies and to generate photons at an output frequency associated with the at least two input frequencies; an output waveguide coupled to the input waveguide and arranged to collect the generated photons at the output frequency; wherein the output waveguide is further arranged to facilitate an amplification of the generated photons as the generated photons propagates along the output waveguide and arranged to output an amplified signal at the output frequency.

Abstract: A board-like connector, a single-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of single-arm bridges spaced apart from each other and an insulating layer. Each of the single-arm bridges includes a carrier, a cantilever extending from and being coplanar with the carrier, an abutting column, and an abutting end portion, the latter two of which extend from the cantilever and are respectively arranged at two opposite sides of the cantilever. The insulating layer connects the carriers of the single-arm bridges, and the abutting column of each of the single-arm bridges protrudes from the insulating layer. The abutting column and the abutting end portion of each of the single-arm bridges are configured to abut against two boards, respectively.

Abstract: A measuring method is provided. A probe and a first sensor are disposed over a jig including a bar protruding from the jig. The probe is moved until a first surface of the probe is laterally aligned with a second surface of the bar facing the jig. A first distance between the second surface of the bar and the first sensor is obtained by the first sensor. The probe and the first sensor are disposed over a magnetron. Magnetic field intensities at different elevations above the magnetron are measured by the probe. A method for forming a semiconductor structure is also provided.

Abstract: The present disclosure relates to a navigation system for placing a medical device into a patient. The system may include an external unit configured to be disposed on a chest of the patient, the external unit having: a radiating element configured to produce a first radio frequency (“RF”) signal; and a plurality of three-axis sensors configured to receive a second RF signal. The system may also include a medical device such as a catheter. The catheter may have: a first antenna configured to receive the first RF signal and produce an alternating current; a rectifier configured to convert the alternating current into a direct current; a frequency generator configured to produce a second RF signal that is received by the plurality of three-axis sensors. The RF signals received by the plurality of three-axis sensors may be used to determine a position of the catheter relative to the external unit.

Abstract: A hybrid optical-electrical automated testing equipment (ATE) system can implement a workpress assembly that can interface with a device under test (DUT) and a load board that holds the DUT during testing, analysis, and calibration. A test hand can actuate to position the DUT on a socket and align one or more alignment features. The workpress assembly can include two optical interfaces that are optically coupled such that light can be provided to a side of the DUT that is facing away from the load board, thereby enabling the ATE system to perform simultaneous optical and electrical testing of the DUT.

Abstract: A system for tracking a below-ground transmitter from an aerial receiver. The receiver has an antenna assembly, a processor, and a propulsion system. The antenna assembly detects the magnetic field from an underground transmitter and generates an antenna signal. The processor is programmed to receive the antenna signal and generate a command signal, which moves the receiver to a position above the transmitter. Once in the desired position, which may be a reference plane at a fixed elevation, the antenna assembly measures the magnetic field to determine the location of the drill bit along borepath.

Abstract: An information handling system includes a data radio connected to an antenna system, and a proximity sensor connected to a proximity sensor probe. An antenna controller (AC) may determine whether a capacitance measurement coarsely indicates a specific antenna configuration or a coarse fault; and configure, when the capacitance measurement indicates a coarse fault, a data radio to operate at a failsafe radio transmit power level; determine, when the capacitance measurement indicates the specific antenna configuration, whether a detail capacitance measured with respect to the antenna system indicates proper antenna configuration or an out-of-range value; configure, when the detail capacitance indicates proper antenna configuration, the data radio to operate normally; and configure, when the detail capacitance indicates an out-of-range value, the data radio to operated in a mode where a performance parameter of the data radio is particularly monitored.

Abstract: A method to determine noise parameters of a scalable device, is presented in which the determination of the noise parameters of the scalable device is independent of the model adopted for the device. The scalable device is connected as part of a test circuit including a noise source, a recirculator, a first power detector and a second power detector. The first power detector is connected to the recirculator and between the noise source and the scalable device and the second detector is connected to the device under test.

Abstract: A gas sensor includes: a substrate; a first conductor and a second conductor that are disposed on the substrate; an insulating layer; and an adsorbent layer. The insulating layer covers the first conductor and the second conductor, and has a first opening that allows a part of a surface of the first conductor to be exposed therethrough and a second opening that allows a part of a surface of the second conductor to be exposed therethrough. The adsorbent layer contains a conductive material and an organic adsorbent that can adsorb a gas. The adsorbent layer is in contact with the first conductor and the second conductor respectively through the first opening and the second opening.

Abstract: A method of manufacturing a housing and a housing for an inductive sensor having at least one sleeve-like housing part and at least one beaker-like end cap for a sensor element, wherein the beaker-like end cap, wherein the end cap is composed of plastic, wherein the end cap is arranged in the sleeve-like housing part, wherein the end cap has a peripheral annular pressing surface that has an excess size with respect to an inner diameter of the housing part along an outer diameter of the sleeve-like section so that a press fit is formed between the sleeve like housing part and the end cap, and wherein a jacket-like outer surface of the sleeve-like section of the end cap does not have a step that projects beyond the inner diameter of the sleeve-like housing part.

Abstract: A physical property of a test sample with a conductive or semi-conductive material (line/area/volume) is obtained. Periodic Joule heating is induced within the test sample by passing an AC current across a first pair of probe terminals electrically connected to the test sample, measuring the voltage drop across a second pair of probe terminals electrically connected to the test sample at one and three times the fundamental excitation frequency of the current-conducting terminals, and calculating the temperature-modulated property/properties of the test sample as a function of the potential drop measurement(s). This includes: a) determining a value proportional to the TCR of the test sample, b) a geometric parameter of the test sample (affected by coupling of its TCR to heat transport to/from the test sample), or c) the true resistivity of the test sample at the ambient experimental temperature by subtracting measurable and accountable TCR offset(s).

Abstract: This document describes techniques and apparatuses including a solder joint damage-prevention mode for a computing device. In general, the computing device may enter the solder joint damage-prevention mode to transfer heat to solder joints and prevent failure mechanisms such as fracture, creep, and/or fatigue. The solder joint damage-prevention mode may rely upon one or more operations, including identifying a state of the computing device in or following which damage to the solder joints has an increased likelihood and, in response, activating a thermal-conditioning system. The thermal-conditioning system may, in general, increase a temperature of the solder joints to improve mechanical robustness of the solder joints.

Abstract: An inspection terminal provided in a test device has a main body portion including a support portion that is curved; a plate-shaped portion integrally connected to the support portion and extending in a first direction; a tip portion integrally connected to the plate-shaped portion and having a larger dimension in a second direction intersecting with the first direction than that of the plate-shaped portion in the second direction; and a slit formed from the tip portion to the plate-shaped portion so as not to reach the support portion of the inspection terminal. The tip portion of the inspection terminal has a first contact portion and a second contact portion that are separated from each other by way of via the slit, and each contact portion is brought into contact with an external terminal of a semiconductor package, and an electrical test of the semiconductor package is performed.

Abstract: A capacitive imaging glove includes electrodes implemented throughout the capacitive imaging glove and drive-sense circuits (DSCs) such that a DSC receives a reference signal generates a signal based thereon. The DSC provides the signal to a first electrode via a single line and simultaneously senses it. Note the signal is coupled from the first electrode to the second electrode via a gap therebetween. The DSC generates a digital signal representative of the electrical characteristic of the first electrode. Processing module(s), when enabled, is/are configured to execute operational instructions (e.g., stored in and/or retrieved from memory) to generate the reference signal, process the digital signal to determine the electrical characteristic of the first electrode, and process the electrical characteristic of the first electrode to determine a distance between the first electrode and the second electrode, and generate capacitive image data representative of a shape of the capacitive imaging glove.

Abstract: Disclosed herein is an apparatus that includes a first semiconductor chip, and a first TSV penetrating the first semiconductor chip. The first semiconductor chip includes a first resistor coupled between a first power supply and a first node, a switch circuit coupled between the first node and the first TSV, a pad electrode operatively coupled to the first node, and a constant current source operatively coupled to either one of the first node and the pad electrode.

Abstract: A test apparatus for testing a foreign object detection (FOD) capability of a wireless power transmitter. The test apparatus includes a wireless power test receiver and at least one temperature sensor configured to sense a temperature of a foreign object between the wireless power test receiver and the wireless power transmitter during wireless power transfer between the wireless power transmitter and the wireless power test receiver. The test apparatus also includes a memory configured to store temperatures sensed by the at least one temperature sensor over a test period in which the wireless power transfer occurs and temporal information regarding times the temperatures are sensed, and a processor configured to calculate, based on the temperatures and the temporal information, a predicted temperature of the foreign object at a future point in time after the test period, and to determine a test result based on the predicted temperature.

Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.