Patents Examined by Jerrt Redman
  • Structure and method of fitting door moldings
    Patent number: 5671565
    Abstract: The present invention is constructed so that, in a structure for fitting a door molding which is provided for covering a gap between a door outer panel and a window glass, the door molding is fitted on an upper portion of the door outer panel by a thermosetting structural adhesive material. The door molding can be simply fitted on the door outer panel only by heating the thermosetting structural adhesive material. Moreover, after fitting, a firm fitting state can be maintained by the thermosetting structural adhesive material.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: September 30, 1997
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventor: Yoshinobu Furuse