Patents Examined by Jerry C. Norris
  • Electronic packages and components thereof formed by substrate-imprinting
    Patent number: 7371975
    Abstract: A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Conductor features of different geometries may be formed by imprinting them simultaneously on one or both surfaces of an imprintable tape. Fabrication apparatus and methods, as well as application of the imprinted package to an electronic assembly, are also described.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: May 13, 2008
    Assignee: Intel Corporation
    Inventors: Thomas S. Dory, Michael Walk