Abstract: There is disclosed in one example a computing apparatus, including: a fiber-optic transmitter including a laser source; an input waveguide to receive a modulated laser pulse from the laser source; an output waveguide to direct the modulated laser pulse to an external communication element; and an isolator bridge optically coupled to the input waveguide and output waveguide, the isolator bridge including an input lens, an input-side folding prism, an isolator element, an output-side folding prism, and an output lens, wherein an input light pulse through the input lens is to be redirected by the input-side folding prism through the isolator element to the output-side folding prism, and redirected by the output-side folding prism through the output lens.

Abstract: A pupil replication waveguide for a projector display includes a slab of transparent material for propagating display light in the slab via total internal reflection. A diffraction grating is supported by the slab. The diffraction grating includes a plurality of slanted fringes in a substrate for out-coupling the display light from the slab by diffraction into a blazed diffraction order. A greater portion of the display light is out-coupled into the blazed diffraction order, and a smaller portion of the display light is out-coupled into a non-blazed diffraction order. A refractive index contrast profile of the diffraction grating along a thickness direction of the diffraction grating is symmetrical, and a refractive index contrast is larger at a middle than at both sides of the refractive index contrast profile, whereby the portion of the display light out-coupled into the non-blazed diffraction order is decreased.

Abstract: An optoelectronic apparatus is presented. In embodiments, the apparatus may include a package including a substrate with a first side and a second side opposite the first side, wherein the first side comprises a ball grid array (BGA) field. The apparatus may further include one or more integrated circuits (ICs) disposed on the first side of the substrate, inside the BGA field, that thermally interface with a printed circuit board (PCB), to which the package is to be coupled, one or more optical ICs coupled to the second side and communicatively coupled with the one or more ICs via interconnects provided in the substrate, wherein at least one of the optical ICs is at least partially covered by an integrated heat spreader (IHS), to provide dissipation of heat produced by the at least one optical IC.

Abstract: Examples herein relate to optical systems. In particular, implementations herein relate to an optical system including a bidirectional optical link such as an optical fiber. The optical system includes a resonator tuned to filter a resonant wavelength of light emitted by an optical source. The optical source may be configured to emit light having multiple wavelengths, and the resonator may be configured to receive light emitted by the optical source. The optical system may further include a photodetector to receive the resonant wavelength and measure a power of the resonant wavelength. The optical system may further include a controller coupled to the optical source. The controller may receive the measured first power of the resonant wavelength and change the state of the optical source when the measured power of the resonant wavelength is outside a per-wavelength threshold range.

Abstract: A cladding mode light removal structure includes: an input-side exposure portion where a covering is removed from an end of an input-side optical fiber to expose a cladding of the input-side optical fiber; an output-side exposure portion where a covering is removed from an end of an output-side optical fiber to expose an output-side cladding of the output-side optical fiber; a fusion splice portion at which the input-side exposure portion and the output-side exposure portion are connected by fusion splice; a fiber housing portion having an accommodation space that receives the input-side exposure portion, the output-side exposure portion, and the fusion splice portion; a high refractive index resin having a refractive index equal to or higher than that of the cladding exposed at the input-side exposure portion; and a low refractive index portion of a medium.

Abstract: A fiber optic element of a fiber scanning system includes a motion actuator having longitudinal side members, an internal orifice, a first support region, a central region, and a second support region. The fiber optic element also includes a first fiber optic cable passing through the internal orifice and having a first fiber joint as well as a second fiber optic cable passing through the internal orifice. The second fiber optic cable has a second fiber joint disposed in the central region and spliced to the first fiber joint, a second coupling region, a light delivery region, and a light emission tip. The light delivery region is characterized by a first diameter and the light emission tip is characterized by a second diameter less than the first diameter.

Abstract: A semiconductor device includes a first chip, a dielectric layer over the first chip, and a second chip over the dielectric layer. A conductive layer is embedded in the dielectric layer and is electrically coupled to the first chip and the second chip. The second chip includes an optical component. The first chip and the second chip are arranged on opposite sides of the dielectric layer in a thickness direction of the dielectric layer.

Abstract: An optical circuit includes a substrate, a waveguide, and a mirror. The substrate includes a first surface. The waveguide includes a first core. The first core is formed of a semiconductor material. The waveguide is over a first surface of the substrate. The mirror reflects light emitted from the waveguide in a direction away from the first surface of the substrate. The mirror is a concave mirror. The waveguide includes a region that functions as an SSC.

Abstract: A small core-diameter graded-index optical fiber include a core layer and a cladding having an inner cladding layer, a depressed cladding layer, and an outer cladding layer from inside to outside thereof. The core layer has a parabolic refractive index profile with a distribution index in a range of 1.9-2.1, a radius in a range of 10-21 ?m, and a ?1 max in a range of 0.7-1.7% at a core layer center, and is a silica glass layer co-doped with germanium, phosphorus, and fluoride. The inner cladding layer is a pure silica layer or an F-doped silica glass layer, and has a unilateral width in a range of 0.5-5 ?m and a ?2 in a range of ?0.4-0%. The depressed cladding layer has a unilateral width in a range of 2-10 ?m and a ?3 in a range from ?0.8% to ?0.2%. The outer cladding layer is a pure silica glass layer.

Abstract: An apparatus for cooling an electronic image assembly with ambient gas and circulating gas is disclosed. A first fan may be positioned to force the circulating gas around the electronic image assembly in a closed loop while a second fan may be positioned to cause a flow of ambient gas. A structure is preferably positioned to allow the circulating gas to cross the flow of the ambient gas while substantially prohibiting the circulating gas from mixing with the ambient gas. A pair of manifolds may be placed along the sides of the electronic image assembly and may be in gaseous communication with a plurality of channels placed behind the electronic image assembly. A heat exchanger may be used in some exemplary embodiments.

Abstract: A patch panel may include a tray that is slidable between a retracted position and an extended position on tray supports and features for holding the tray in the retracted position and in the extended position. The patch panel may also include a cassette that is slidable on cassette supports, latches for engaging the cassette to block movement of the cassette and features for disengaging the latches.

Abstract: A Mach-Zehnder modulator includes: first and second resistive elements each having first and second contact areas, the first and second contact areas of the first resistive element being arranged in a direction of a first axis, the first and second contact areas of the second resistive element being arranged in a direction of a second axis; a common conductor connecting the first contact areas of the first and second resistive elements with each other; first and second waveguide structures each including a waveguide portion extending in a direction of a third axis intersecting the first and second axes; a first signal conductor connected to the waveguide portion of the first waveguide structure and the second contact area of the first resistive element; and a second signal conductor connected to the waveguide portion of the second waveguide structure and the second contact area of the second resistive element.

Abstract: In various embodiments, optical fibers may be placed into V-shaped grooves in a substrate. A lid may then be placed on top of the optical fibers to hold them accurately in place, and the lid may be attached to the substrate using a reflow solder technique. Epoxy may then be applied as a strain relief. Because the V-shaped grooves and optical waveguides are manufactured with precision on the same substrate, precise alignment between these two may be achieved. Because the epoxy is applied after reflow, the epoxy may not be exposed to reflow temperatures, which might otherwise cause the epoxy to distort during the cure process.

Abstract: The apparatus and methods include moving an optical fiber over a fiber path that includes a marking location at which resides a printer unit. The moving optical fiber has an amount of undamped fiber vibration that can exceed a fiber vibration tolerance at high fiber speeds. The printer unit is configured to dispense ink onto the optical fiber to form wet ink marks along the optical fiber as it moves past the marking location. The wet ink marks are dried and counted for quality control. The marked optical fiber is then covered with an overcoat to protect the ink marks. A position sensor measures an amount of vibration of the optical fiber substantially at the marking location. One or more vibration dampers disposed along the fiber path are used to reduce the fiber vibration below the fiber vibration tolerance. This allows for high-speed marking of the optical fiber.

Abstract: A confocal optical system-based measurement apparatus includes: a light source; a light projecting optical fiber group; a light receiving optical fiber group; a spectroscope; and a confocal optical system configured to condense each of a plurality of beams from a plurality of light projecting optical fibers to irradiate a sample therewith, and cause a plurality of beams from a plurality of condensing points on the sample to form images on the plurality of light receiving optical fibers, respectively, wherein the light projecting optical fiber group includes the plurality of light projecting optical fibers configured to receive light from the light source, the light receiving optical fiber group includes the plurality of light receiving optical fibers configured to guide received light to the spectroscope, the shape of an end face of the light projecting optical fiber group and the shape of an end face of the light receiving optical fiber group are in a mirror image relationship, and in the light projecting op

Abstract: A silicon-based edge coupler for coupling a fiber with a waveguide includes a cantilever member being partially suspended with its anchored end coupled to a silicon photonics die in a first part of a silicon substrate and a free end terminated near an edge region separating a second part of the silicon substrate from the first part. The edge coupler further includes a mechanical stopper formed at the edge region with a gap distance ahead of the free end of the cantilever member. Additionally, a V-groove is formed in the second part of the silicon substrate characterized by a top opening and a bottom plane symmetrically connected by two sloped side walls along a fixed Si-crystallography angle. The V-groove is configured to support a fiber with an end facet being pushed against the mechanical stopper and a core center being aligned with the free end of the cantilever member.

Abstract: An optical-fiber ribbon having excellent flexibility, strength, and robustness includes optical fibers having a sacrificial, outer release layer that facilitates separation of an optical fiber from the optical-fiber ribbon without damaging the optical fiber's glass core, glass cladding, primary coating, secondary coating, and ink layer, if present.

Abstract: Disclosed herein are cable systems that include a cable defining a sensing path and comprising a working strand and one or more sensing strands, a signal source to impart a test signal between a first terminal and a second terminal, a sensor to detect the test signal, a transmitter to transmit the test signal to a receiver, and an indicator to generate a display indicative of the test signal. Certain preferred embodiments describe sensing strands that are arranged in alternating concentric layers and/or extend lengthwise in loops. Such configurations facilitate the detection of breakage, insults, excess tension, or excess bending in the cable. The sensing strands may include a fixed resistor to establish a known resistance and facilitate the detection of small resistive changes.

Abstract: The present disclosure provides a photocurable coating composition, including: (a) a (meth)acrylate monomer or oligomer with at least four functional groups; (b) a difunctional (meth)acrylate monomer, (c) a monofunctional (meth)acrylate monomer, and (d) an initiator. The difunctional (meth)acrylate monomer is present in an amount of 30 to 70 wt % based on the total weight of the photocurable coating composition. The present disclosure also provides an optical film having a microstructure layer made from the photocurable coating composition. The optical film can be as a light guide film in a back light module of a display.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to through-silicon vias (TSV) for heterogeneous integration of semiconductor device structures and methods of manufacture. The structure includes: a plurality of cavity structures provided in a single substrate; at least one optical device provided on two sides of the single substrate and between the plurality of cavity structures; and a through wafer optical via extending through the substrate, between the plurality of cavity structures and which exposes a backside of the at least one optical device.