Abstract: A plate heat exchanger comprises a plate package of permanently connected heat exchanger plates that defines a surrounding wall. Two mounting plates are permanently connected to an end surface of the plate package, in spaced relation to each other. Each mounting plate comprises opposing flat engagement surfaces and a peripheral edge that forms a perimeter of the mounting plate. Each mounting plate is arranged with one of its engagement surfaces permanently connected to the end surface, such that the peripheral edge partially extends beyond the outer periphery of the end surface, to define a mounting flange, and partially extends across the end surface in contact with the same. The mounting plates have a decreasing thickness towards the peripheral edge in predefined intersection regions, which are located where the peripheral edge intersects with the perimeter of the surrounding wall as seen in a normal direction to the end surface.

Abstract: Dryer appliances and methods for diagnosing restrictions in dryer appliance are provided. A method includes obtaining a plurality of temperature readings during each operation of the dryer appliance by intermittently measuring a temperature of inlet air to the dryer appliance. The method further includes obtaining a heater status for a heater of the dryer assembly during each measurement of the temperature. The method further includes estimating an effective opening size in the dryer appliance during each operation of the dryer appliance based on the temperature and heater status for each of the plurality of temperature readings.

Abstract: In one embodiment of the invention, an apparatus for a juicer includes: a cutting chamber; a squeezing chamber adjacent to the cutting chamber; wherein the cutting chamber includes a cutter; and wherein the squeezing chamber includes a press. In another embodiment of the invention, a method of assembling a juicer includes: providing a cutting chamber; placing at least one cutter in the cutting chamber; providing a squeezing chamber in a position adjacent to the cutting chamber; and providing a press in the squeezing chamber.

Abstract: A method and apparatus for rapid and selective heating of materials using variable frequency RF and microwaves. The apparatus uses variable frequency solid state electronics as a microwave power source, a novel microwave heating head to couple microwave energy to the target materials and a match-up network to tune the frequency and impedance match between the microwave source and the load. An electronic and computer measurement and control system is employed to monitor and control the microwave heating process. The method teaches the use of inductive microwave coupling for thin conductive materials such as metal film and impurity doped silicon wafers. The method also teaches the use of capacitive microwave coupling for dielectric material such as glass and ceramics. The method further teaches the use of rapid and selective heating of heterostructure for bonding and sealing of mems and integrated circuits.