Abstract: A process for obtaining a product gas and product LNG having pressure P1 close to the atmospheric pressure from lean LNG, includes: a) branching the lean LNG to obtain a first flow and a second flow; b) cooling the second flow by using a refrigerant; c) branching a liquid flow derived from the cooled second flow to obtain refrigerant LNG and remaining LNG; d) subjecting the remaining LNG to pressure reduction and gas-liquid separation to obtain a gas phase flow and a liquid phase flow (product LNG) having pressure P1; e) subjecting the refrigerant LNG to pressure reduction; f) using a flow from the step e as the refrigerant; g) joining, before or after the step f, the gas phase flow having pressure P1 to a flow from the step e; h) liquefying a flow resulting from the steps f and g by pressure increase and cooling (through heat exchange with the first flow); i) increasing the first flow in pressure before the step h; j) obtaining the product gas by regasifying the first flow after the steps h and i; and k) joi

Abstract: An adsorptive cooling system includes two highly adsorptive structures positioned to receive thermal energy from a thermal energy source, each highly adsorptive structure includes a substrate and a metal-organic framework (MOF) coupled to the respective substrate and adapted for adsorbing and desorbing a refrigerant under predetermined thermodynamic conditions. The adsorptive cooling system includes a cooling unit and a circulation system adapted for circulating the refrigerant from one of the highly adsorptive structures to the cooling unit to provide cooling from the thermal energy source and to return the refrigerant from the cooling unit to the same or other highly adsorptive structure. Each substrate may include a plurality of microchannels, providing ingress and egress paths for a refrigerant, defined by grooves in a surface of the substrate nearest the MOF and/or surfaces of a plurality of microcapillaries of the substrate. The microchannels provide ingress and egress paths for a refrigerant.

Abstract: A stacked-plate heat exchanger may include a plurality of stacked plates. The plurality of stacked plates may include a plurality of first stacked plates and a plurality of second stacked plates stacked alternately one on top of another. Pairs of adjacent stacked plates may each delimit one of a first cavity for the passage of a first fluid and a second cavity for the passage of a second fluid in an alternating manner. The heat exchanger may also include a support structure that may support the plurality of stacked plates in an edge region to stabilize the second cavity. The plurality of stacked plates may each include a first opening and at least two second openings arranged around the first opening. The heat exchanger may also include a plurality of webs each arranged between two adjacent second openings. The plurality of webs may form the support structure.

Abstract: A chilled beam includes a body having a first side and a second side opposite to the first side. The chilled beam also includes a first mounting bracket coupled to the first side and configured to rotate against a first bias of the first mounting bracket in response to a first force against the first mounting bracket. The chilled beam also includes a second mounting bracket coupled to the second side and configured to rotate against a second bias of the second mounting bracket in response to a second force against the second mounting bracket.

Abstract: A heat exchanger header includes a primary fluid duct extending between a fluid port and a first branched region, a plurality of secondary fluid ducts fluidly connected to the primary fluid duct at the first branched region, wherein an overhang region is formed laterally between adjacent ones of the plurality of secondary fluid ducts, and wherein each of the plurality of secondary fluid ducts extends between the first branched region and a second branched region, a plurality of tertiary fluid ducts fluidly connected to each of the plurality of secondary fluid ducts at the second branched regions, a primary horn integrally formed with and extending from the overhang region, an at least one secondary horn integrally formed with and extending from one of the plurality of tertiary fluid ducts, and a sacrificial support structure extending between the primary horn and the at least one secondary horn.

Abstract: A heat conduction device includes a heat source portion, a temperature control surface, and heat transfer portions. The heat source portion is configured to generate at least hot heat or cold heat. The temperature control surface is sectioned into a plurality of temperature control sections, and at least some of the plurality of temperature control sections are disposed away from the heat source portion. The plurality of heat transfer portions connect the heat source portion and the plurality of the temperature control sections to transfer heat between the heat source portion and the plurality of temperature control sections. The plurality of temperature control sections are separated from each other based on a distance from the heat source portion.

Abstract: In order to reduce the adverse effect from a thermal medium splashing as a result of a vapor chamber bursting, this protective structure is provided with a perforation member comprising an end section that: comprises an upper surface and a lower surface; either comes into contact with a first surface, which is either the upper surface or the lower surface, or is located near the first surface, before a flat vapor chamber in contact with an electronic component is overheated by heat from the electronic component; and breaks an outer member of the vapor chamber and penetrates into the interior when the vapor chamber is overheated by the heat.

Abstract: Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.

Abstract: A heat exchange cell includes a helically-shaped heat exchanger, in which a first heat transfer fluid circulates; a first heat exchange chamber in which a first collection chamber is defined; a second heat exchange chamber in which a second collection chamber is defined; and a fluid outlet passage from the second heat exchange chamber. The first and second heat exchange chambers are separated by a first separating element comprising a substantially plate-shaped body and by at least a second separating element so as to define at least one passage of fluid between the first and the second collection chamber of the second heat transfer fluid. A pair of axial separator baffles extend axially between the second separating element and the rear wall of the containment casing, and are configured to separate a first portion of the second collection chamber from a second portion of the second collection chamber.

Abstract: Provide is a refrigerator provided with a defrosting device capable of enhancing the defrosting efficiency. The refrigerator includes main body, storage compartment provided inside the main body, an evaporator provided in the storage compartment and configured to generate cold air, a first flow path allowing air to be guided in a first direction for the air to be supplied to the storage compartment during a cooling operation, a defrosting heater configured to generate heat for defrost, a second flow path allowing air to be guided in a second direction opposite to the first direction for the air to be circulated around the evaporator during a defrosting operation, a fan allowing air having received heat from the defrosting heater to be circuited around the evaporator through the second flow path, and a flow path resistance portion provided on the second flow path to increase a flow path resistance in the first direction.

Abstract: A cooling system for a photovoltaic panel including micro flat heat pipes (HP) integrated with thermoelectric generators (TEG) and a cooled water reservoir for cooling the working fluid in heat pipes. The cooled water in the reservoir is pumped from the condensate pan of an air conditioner. Experimental results show that cooling system reduced the average temperature of the panel by as much as 19° C. or 25%. Further, the output power of the photovoltaic panel increased by 44% when the photovoltaic panel was used in a very hot climate (30-40° C.). An additional two watts of power was generated by the TEGs.

Abstract: An apparatus for producing a purified, pressurized liquid carbon dioxide stream includes a distillation column (B) having packing (C) therein and a sump (D) below the packing, the distillation column in fluid communication with the liquid carbon dioxide supply tank for receiving the liquid carbon dioxide stream and the packing stripping volatile impurities from the liquid carbon dioxide stream; a heater (E) in contact with the liquid carbon dioxide stream in the sump (D) for vaporizing the liquid carbon dioxide stream in the sump; a vent in the distillation column (B) from which a first vaporized portion (G) of carbon dioxide vapor in the sump (D) is withdrawn from the distillation column: and a conduit (I) in fluid communication with the sump (D) and from which a second vaporized portion (H) of the carbon dioxide vapor in the sump is withdrawn into the conduit (I) to be introduced into the carbon dioxide vapor feed stream.

Abstract: A vehicle including a refrigerated compartment having a chamber and a cooling system for cooling the chamber and methods of controlling the cooling system is provided. The vehicle includes a controller that controls a supply of power from a battery of the vehicle to the cooling system based on at least one output signal received from a vehicle component.

Abstract: Embodiments of the disclosure relate generally to thermal control and management in hardware devices. A thermal control system includes a thermal node, a thermal bridge, and a thermal controller. The thermal node is configured to receive heat generated in a device. The thermal controller is configured to in response to an environment temperature of the thermal controller being greater than a first threshold temperature, cause heat transfer from the thermal node to a first heat sink and prevent heat transfer from the thermal node to a second heat sink. The thermal controller is also configured to, in response to the environment temperature of the thermal controller being greater than a second threshold temperature, cause heat transfer from the thermal node to the second heat sink and prevent heat transfer from the thermal node to the first heat sink.

Abstract: The ceiling concealed air-conditioning apparatus includes: a body containing a heat exchanger, a fan and an opening port; a decorative panel disposed below the body and configured to cover a periphery of the opening port; and a suction grille including, a rotary shaft attachable to the decorative panel and being configured to cover the opening port, wherein the suction grille includes: a locking element mounted on the suction grille so that it can slide and configured to be locked with the decorative panel; plate springs on respective sides of the locking element perpendicular to a sliding direction of the locking element and extending vertically in opposite directions; and spring supports configured to support both end faces of the respective plate springs at different positions, the plate springs include a long plate spring and a short plate spring placed such that the long plate spring engages the decorative panel first.

Abstract: An air-cooled condenser system for steam condensing applications in a power plant Rankine cycle includes an air cooled condenser having a plurality of interconnected modular cooling cells. Each cell comprises a frame-supported fan, inlet steam headers, outlet condensate headers, and tube bundle assemblies having extending between the headers. The tube bundle assemblies may be arranged in a V-shaped tube structure. A plurality of deflection limiter beams are arranged coplanar with the tube bundles. Top ends of each deflection limiter beam are slideably inserted in an associated floating end cap affixed to an upper tubesheet which moves vertically relative to the beams via thermal expansion/contraction concomitantly with the tubes. The deflection limiter beams provides guided restraint system for expansion/contraction of the tube bundles which prevents out of plane tube bowing.

Abstract: A baffle for a block-type heat exchanger comprising a baffle plate. The baffle plate comprises a first surface and a second surface being parallel to a baffle plane located between the first surface and the second surface. The baffle plate comprises a first longitudinal edge, a second longitudinal edge, a first transverse edge and a second transverse edge. The baffle comprises a resilient member at the second longitudinal edge. The baffle comprises a reinforcement extending away from the baffle plane.

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Abstract: A protection device 1 for a heat exchanger, comprising a grid 10 with an upstream surface 11 and a downstream surface 12, both located on opposite sides of the grid 10, the grid 10 being attachable to the heat exchanger 40 with attachment means 11 so that the downstream surface 12 can face a side of the heat exchanger 40, wherein the protection device 1 further comprises a shock absorber 20 attached to the grid 10 so that the shock absorber 20 least partly protrudes from the downstream surface 12 of the grid 10.

Abstract: A heat exchanger includes a fluid reservoir having a peripherally extending foot, a header having a mounting tab bent to engage the foot of the fluid reservoir to couple the header to the fluid reservoir, and a retaining feature configured to prevent disengagement of the mounting tab of the header from the foot of the fluid reservoir. The retaining feature overlays at least a portion of an outer surface of the mounting tab while otherwise restrained by a portion of the fluid reservoir in order to prevent the disengagement of the mounting tab from the foot.