Abstract: A method for producing a panel sandwich (2, 17, 40) for use as a wall, ceiling or floor panel (1, 16) comprising at least the following steps: providing a base panel (7, 20, 31) made of wood-based material, arranging a sound-insulating layer (9, 18) above the base panel (7, 20, 31), arranging a cover panel (11, 22, 38) above the base panel (7, 20, 31), pressing the sandwich, wherein an elastic plastic material is used to produce the sound-insulating layer (9, 18), wherein according to a first alternative of the invention, a closed-cell foam (9a) is arranged as the elastic plastic material, wherein the plastic material before being introduced into the sandwich panel has an elasticity modulus under pressure of 0.25 MPa to 1.5 MPa, according to a second alternative of the invention, the elastic plastic material applied is a self-adhesive plastic material (18c) which connects the base panel (20) to the cover panel (22), is elastic when set, has an elasticity modulus under pressure of 0.25 MPa to 1.

Abstract: A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector that assists separating the die from the wafer; a support unit supporting a substrate where the die is to be attached; a bonding unit that picks up the die from the wafer and attaches the picked-up die to the substrate; an ejector buffer unit that receives the die ejector; and a replacing unit that transfers the die ejector between the ejector holder and the ejector buffer unit.

Abstract: A bonding device includes: a plurality of laser oscillators that oscillate laser beams; a plurality of guide beam parts that guide the laser beams oscillated from the laser oscillators; a bonding tool that is irradiated and heated by the laser beams guided from the guide beam parts so that an electronic part held on the bonding tool is heated by the laser beams and is bonded to a base plate. The bonding tool is segmented into a plurality of heat regions, each of the heat regions is irradiated by the laser beams that are guided through the guide beam parts so that some of the heat regions are heated at a temperature different from other heat regions, and an insulation part is disposed at a middle section between two of the heat regions, the insulation part suppressing a heat transfer between the heat regions.

Abstract: A method for forming a vehicle body, comprising: forming a rigid tub; mating the rigid tub to a first mold for a superstructure of the vehicle body; and subsequently rigidifying material in the first mold while part of that material is in contact with the tub to thereby form the superstructure of the vehicle body integral with the tub.

Abstract: Disclosed herein is a process to produce a laminate comprises coating at least an outer surface of a dynamically vulcanized alloy film with an adhesive composition to produce the laminate, wherein the adhesive layer has a thickness of less than or equal to about 5 microns, wherein the dynamically vulcanized alloy film comprises a thermoplastic elastomer composition containing a thermoplastic resin as a continuous phase, and a rubber composition dispersed therein, as a dispersed phase. A laminate and a pneumatic tire comprising the laminate are also disclosed.

Abstract: A method for fabricating flexible display module mainly includes following steps: providing a transparent carrier with a carrying-surface and a back-surface opposite to the carrying-surface; forming a photosensitive-release-film on the carrying-surface; providing a flexible substrate on the photosensitive-release-film; forming a pixel array on the flexible substrate; during or after forming the pixel array, conducting irradiation on the photosensitive-release-film from the back-surface of the transparent carrier to weaken bonding force between the photosensitive-release-film and the transparent carrier or simultaneously weaken both the bonding force between the photosensitive-release-film and the transparent carrier and the structure strength of the photosensitive-release-film; and then, removing the flexible substrate from the transparent carrier, in which at least one portion of the photosensitive-release-film is peeled off from the carrying-surface and remains on the flexible substrate.