Patents Examined by Jinhee J Lee
  • Patent number: 8009410
    Abstract: In at least one embodiment, a keyfob assembly comprising a housing and a battery chamber is provided. The housing includes a plurality of electrical components positioned therein for transmitting radio frequency (RF) signals to a vehicle. The battery chamber is positioned within the housing and includes at least one removable battery operably coupled to the electrical components for powering the electrical components. The battery chamber is capable of being slideably removed from the housing to facilitate battery exchange.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: August 30, 2011
    Assignee: Lear Corporation GmbH
    Inventors: Frank Goemmel, John Burca
  • Patent number: 8009434
    Abstract: A touch control panel for use with a coffeemaker is disclosed. In the touch control panel, a PC board unit provided with backlight plates and a printed panel are secured to an inner side of a front decorative cover, made of a transparent material, with threaded fasteners. Protrusions formed on the front decorative cover and on an upper front decorative cover are engaged with corresponding cavities on a back panel. A back panel cover is engaged in the back panel at a location adjacent to a rear side of the PC board unit. An upper decorative strip and a lower decorative strip are affixed to an outer side of the front decorative cover. The touch control panel is secured to a front side of an upper body and of a lower body of the coffeemaker to serve both decorative and functional purposes.
    Type: Grant
    Filed: July 29, 2008
    Date of Patent: August 30, 2011
    Assignee: Uni-Splendor Corp.
    Inventor: Yu-Yuan Lin
  • Patent number: 8004851
    Abstract: A method for easily making a barrier for preventing overflow of interlayer insulating resin in a cable-fitted multi-layer FPC that uses bumps for connecting the layers, and a barrier having a structure that can easily be made. In a method for manufacturing a multi-layer flexible printed circuit board including a circuit section, a cable section that is connected to the circuit section, the circuit section having a multi-layer structure of insulating resin arranged between multiple layers of metal foil, a barrier, that stops the insulating resin from overflowing, has a two-row configuration and is formed on a metal foil that constitutes an outermost conductive layer in the multi-layer flexible printed circuit board, and the metal foil and the insulating resin are laminated to form the multi-layer flexible printed circuit board.
    Type: Grant
    Filed: February 24, 2005
    Date of Patent: August 23, 2011
    Assignee: Nippon Mektron, Ltd.
    Inventors: Fumio Akama, Ryoichi Yoshimura, Hideaki Tanaka, Hitoshi Uchida, Koji Okano
  • Patent number: 8000092
    Abstract: A display apparatus having an improved supporting configuration of a display part, which includes a display to display an image thereon and a pair of bases which are coupled to the display to rotate around an axis of upward and downward directions with respect to a vertical line of the display.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: August 16, 2011
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventor: Kwey-hyun Kim
  • Patent number: 7961480
    Abstract: The present invention relates to a device for housing and connection of accessories, particularly for low-voltage automatic switches, comprising an integrated wiring support. In particular, the housing and connection device (1) has a shaped structure (10) comprising an integrated wiring bus for electrical connection of the accessories. The shaped structure (10) moreover comprises one or more seats (20, 21, 22, 23, 24) for housing the accessories.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: June 14, 2011
    Assignee: ABB S.p.A.
    Inventors: Stefano Besana, Antonello Antoniazzi
  • Patent number: 7952885
    Abstract: A control device includes a number of individual flexible printed circuit boards that are preferably laminated on an aluminum base plate. A molded seal is used to reliably seal the edge areas of the partially flexible printed circuit board and these edge areas are formed to assist in creating the seal. The device is suited for mechatronic control units and is particularly suited for control devices that are mounted in a transmission or engine of a motor vehicle.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: May 31, 2011
    Assignee: Siemens Aktiengesellschaft
    Inventors: Josef Loibl, Karl Smirra
  • Patent number: 7948771
    Abstract: An electrical component (100) includes a housing (1), a number of terminals (2) molded within housing and at least one electrical element (3). The housing has at least a side wall (11) having a number of recesses (112) and an internal cavity (15). Each terminal has a first end (23) extending to a bottom of the side wall and formed with a platform portion (231) located onto the bottom of the side wall and aligned with the corresponding recess. The electrical element has a number of wires (321) wrapped thereon. One end of the wire extends outward the cavity through the recess and is soldered onto the corresponding platform portion.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: May 24, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hong-Bo Zhang, Zheng-Hua Xu, Chao-Dong Huang
  • Patent number: 7944706
    Abstract: An electrical unit includes one of a large current relay, a circuit protection fuse, and an operation time display section fixed on a circuit board having an external connector. The electrical unit is incorporated in a case having an opening, and the electrical unit is sealed by a sealing resin which fills the case. An operation time display section sealed in the case extends from the sealing resin at the opening of the case.
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: May 17, 2011
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventor: Kenichi Fujino
  • Patent number: 7940530
    Abstract: A circuit board arrangement includes a first printed circuit board having a first edge connector and a second printed circuit board having a second edge connector. The first edge connector includes a plurality of fingers, with each finger having at least one first conductor pad. The second edge connector includes a plurality of openings positioned generally in line with each other and a plurality of second conductor pads. Each opening has a corresponding finger positioned therein. Each second conductor pad is positioned adjacent a corresponding opening and corresponding first conductor pad.
    Type: Grant
    Filed: October 2, 2006
    Date of Patent: May 10, 2011
    Assignee: Deere & Company
    Inventors: Jeffrey Scott Duppong, Dale Arthur Janssen, Amanda Renee Wyland, Richard James Livdahl, Vincent Guy Segal, Travis Lee Johnston, Nathan Matthew Hawk
  • Patent number: 7923645
    Abstract: A first patterned etch stop layer and a first patterned conductor layer are laminated by a dielectric material to a second patterned etch stop layer and a second patterned conductor layer. As the etch stop metal of the first and second patterned etch stop layers is selectively etchable compared to a conductor metal of the first and second patterned conductor layers, the first and second patterned etch stop layers provide an etch stop for substrate formation etch processes. In this manner, etching of the first and second patterned conductor layers is avoided insuring that impedance is controlled to within tight tolerance.
    Type: Grant
    Filed: June 20, 2007
    Date of Patent: April 12, 2011
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, Robert F. Darveaux
  • Patent number: 7920385
    Abstract: A plurality of terminal boards (30A, 30B) for electrically interconnecting a plus electrode and a minus electrode of a solar cell module and cables (90) for external connection corresponding to the both electrodes are placed on a base plate (11), and two corresponding terminal boards (30A, 30B) are bridged by a bypass diode (50). The respective terminal boards (30A, 30B) juxtaposed on the top surface of the base plate (11) are collectively supported and fixed by a retaining plate (60). Accordingly, the generation of an undue strain in the bypass diode (50) can be avoided even in the case of fixing the terminal boards (30A, 30B) to the base plate (11) with the terminal boards (30A, 30B) bridged by the bypass diode (50) beforehand.
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: April 5, 2011
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Hiroyuki Yoshikawa, Makoto Higashikozono
  • Patent number: 7898821
    Abstract: The invention relates to an apparatus and arrangement for shielding a light emitting diode against electrostatic discharges during usage. On a printed circuit board (103, 203) there is placed a light emitting diode (108, 208), and on the component side of the circuit board (103, 203), there is arranged a photoconductor layer (102, 202). In the photoconductor layer (102, 202), there is induced electroconductive material (110, 210), and the electroconductive material is connected to the ground plane (111) of the circuit board in order to conduct the electrostatic discharge from the photoconductor layer (102, 202) to the ground plane.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: March 1, 2011
    Assignee: Nokia Corporation
    Inventors: Ari Pekkarinen, Pasi Saukonoja, Jari Jekkonen
  • Patent number: 7885079
    Abstract: A flexible electronic assembly including a flexible circuit board and at least one electronic component is provided. The flexible circuit board includes at least one dielectric film layer and at least one patterned conductive layer disposed on the dielectric film layer. The electronic component is disposed on the flexible circuit board and electrically connected to the flexible circuit board. The flexible angle of the flexible electronic assembly is greater than 5 degrees.
    Type: Grant
    Filed: September 29, 2006
    Date of Patent: February 8, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Jung Chen, Jian-Chiun Liou, Yu-Hung Chuang
  • Patent number: 7881067
    Abstract: A circuit board assembly (100) includes a circuit board (10) and at least one electrical element (20). The circuit board includes a dielectric substrate (12) including a supporting surface (13), and at least one connecting part (14) formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media (28). At least one air-exhaust hole (16) extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media.
    Type: Grant
    Filed: September 26, 2007
    Date of Patent: February 1, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Fu-Yen Tseng
  • Patent number: 7859851
    Abstract: A flexible printed circuit board and a bracket structure for the hard disk drive. The flexible printed circuit board includes a base layer, a circuit layer provided on the base layer, a cover layer provided on the circuit layer, and a filter layer interposed between the base layer and the circuit layer. Also, the bracket structure includes a flexible printed circuit board for driving an actuator, a bracket connected to the flexible printed circuit board, and a filter interposed between the flexible printed circuit board and the bracket. Thermal asperity caused by fine particles in the hard disk drive is prevented so that performance deterioration of the hard disk drive is prevented and reliability thereof is improved.
    Type: Grant
    Filed: December 8, 2005
    Date of Patent: December 28, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-chul Shin, Byoung-gyou Choi, Jeong-seon Kim, Jun-young Lee
  • Patent number: 7852637
    Abstract: A one-piece expansion card retainer may be installed in either of two positions to accommodate both full-height and low-profile expansion cards. The bi-positional expansion card retainer exerts flexional force on an expansion card to help maintain the expansion card in its proper position during shipment of an electronic device.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: December 14, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ronald Paul Dean, Jonathan D Bassett, James Bullington
  • Patent number: 7839654
    Abstract: Improved noise isolation for high-speed digital systems on packages and printed circuit boards is provided by the use of mixed alternating impedance electromagnetic bandgap (AI-EBG) structures and a power island configured to provide ultimate noise isolation. A power island is surrounded by a plurality of mixed AI-EBG structures to provide a power distribution network. In this structure, the gap around the power island provides excellent isolation from DC to the first cavity resonant frequency which is determined by the size of the structure and dielectric material. One AI-EBG structure provides excellent isolation from the first cavity resonant frequency of around 1.5 GHz to 5 GHz. The other AI-EBG structure provides excellent noise isolation from 5 GHz to 10 GHz. Through use of this novel configuration of AI-EBG structures, a combination effect of the hybrid AI-EBG structure provides excellent isolation far in excess of 10 GHz.
    Type: Grant
    Filed: February 28, 2007
    Date of Patent: November 23, 2010
    Assignee: International Business Machines Corporation
    Inventor: Jinwoo Choi
  • Patent number: 7835158
    Abstract: Embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: November 16, 2010
    Assignee: Micron Technology, Inc.
    Inventor: Thomas Kinsley
  • Patent number: 7830667
    Abstract: Disclosed is a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. A method for producing the flexible wiring substrate is also disclosed.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: November 9, 2010
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventor: Hiroaki Kurihara
  • Patent number: 7821796
    Abstract: Reference plane voids with a strip segment for improving transmission line integrity over vias permits routing critical signal paths over vias, while increasing via insertion capacitance only slightly. The transmission line reference plane defines voids above (or below) signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. In order to provide increased routing density, signal paths are routed over the voids, but disruption of the signal paths by the voids is prevented by including a conductive strip through the voids that reduces the coupling to the signal-bearing PTHs and maintains the impedance of the signal path conductor.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: October 26, 2010
    Assignee: International Business Machines Corporation
    Inventors: Sungjun Chun, Anand Haridass, Roger D. Weekly