Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

Abstract: Illustrative embodiments provide techniques for fabricating semiconductor structures having bottom isolation and enhanced carrier mobility for both nFET and pFET devices. For example, in one illustrative embodiment, a semiconductor structure includes a semiconductor substrate, a first dielectric layer disposed on the semiconductor substrate, a bottom source/drain region disposed on the first dielectric layer and isolated from the semiconductor substrate by the first dielectric layer, a second dielectric layer disposed on the bottom source/drain region and a top source/drain region disposed on the second dielectric layer and isolated from the bottom source/drain region by the second dielectric layer. The bottom source/drain region comprises a compressive pFET epitaxy and the top source/drain region comprises a tensile nFET epitaxy.

Abstract: A light-emitting panel has a light-emitting region and a non-light-emitting region, and at least one portion of a boundary of the light-emitting region is zigzag-shaped. The light-emitting panel includes: a base substrate, sub-pixels disposed in the light-emitting region on the base substrate: a first encapsulation layer disposed on a side of the plurality of sub-pixels away from the base substrate, and at least one first barrier wall disposed on the first encapsulation layer. Orthogonal projections of the sub-pixels on the base substrate are within an orthogonal projection of the first encapsulation layer on the base substrate. The first barrier wall is located in the non-light-emitting region, and is disposed at a side of the at least one zigzag-shaped portion of the boundary of the light-emitting region proximate to the non-light-emitting region. A refractive index of the first barrier wall is greater than a refractive index of the first encapsulation layer.

Abstract: An organic light-emitting diode (OLED) display panel, a manufacturing method thereof, and an OLED display device are provided. At least one of a substrate or a backplate in the OLED display panel has a reduced thickness, thereby increasing light transmittance of an electronic element area. Furthermore, an area where a camera lens is disposed can display normally and an under-display camera can be realized without defining a hole. Therefore, a screen-to-body ratio is increased, and a technical problem is solved: in conventional OLED display panels, the hole needs to be defined on the area where the camera lens is disposed, leading to a display effect being affected.

Abstract: A display panel and a method of manufacturing thereof are provided. A hole injection layer, a hole transport layer, a light emitting layer, and a planarization layer are formed by an inkjet-printing method. Specifically, solvents including hole injecting layer material, hole transporting layer material, light emitting layer material, and planarization layer material are evaporated by vacuum drying so as to uniformize the surface of the entire layer, thereby improving light uniformity. Moreover, a notch of the light emitting layer can be effectively filled by disposing a planarization layer on the light emitting layer, so a uniform layer can be formed, which can reduce the current accumulated at the notch. Therefore, the light uniformity of the display panel is improved, and the risk of leakage current at the notch is also reduced.

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

Abstract: The present disclosure discloses a protective film, a display module, a display assembly, a method for preparing the display assembly and a display device. The protective film is configured to be attached to a surface on a display side of the flexible display substrate before a mother set is cut. The protective film includes a base material layer, a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is located on the side, facing the flexible display substrate, of the base material layer; the viscosity of the first adhesive layer is 0.5 gf/inch to 1.5 gf/inch; the second adhesive layer is located on the side, facing the flexible display substrate, of the base material layer, is independently arranged relative to the first adhesive layer; and the viscosity of the second adhesive layer is 3 gf/inch to 4 gf/inch.

Abstract: A display device includes a display panel, a back plate disposed below the display panel, and a deformation prevention structure disposed below the back plate. The display panel, the back plate, and the deformation prevention structure are bendable in at least one bendable area. The deformation prevention structure has higher modulus than either the display panel or the back plate in the at least one bendable area. The display device is not deformed even after being repeatedly bent.

Abstract: A display panel including a metal film, an adhesive layer disposed on the metal film, a first resin substrate disposed on the adhesive layer, light-emitting elements disposed above the first resin substrate, and a second resin substrate disposed above the light-emitting elements. The adhesive layer includes contact portions in contact with the metal film and gaps are present between the contact portions where the adhesive layer is not in contact with the metal film.

Abstract: The present application provides a display panel, a manufacturing method and an intelligent wearable device of flexible organic light-emitting diode (OLED). The display panel includes a conductive layer and a metallic anode layer disposed at one side of the conductive layer, wherein a material of the conductive layer is a mixture of silver-nanowires and polymethyl methacrylate (PMMA).

Abstract: A flexible organic light-emitting diode (OLED) device includes a flexible substrate, a buffer layer, an inorganic layer, a first gate insulating layer, a second gate insulating layer, an inter-layer dielectric layer, a passivation layer, a pixel definition layer, a driving transistor, an OLED, a data voltage lead, and a driving voltage lead. The driving voltage lead is connected to the driving voltage terminal through a first hole which penetrates the second gate insulating layer, the first gate insulating layer, the inorganic layer, and the buffer layer, and through a second hole which penetrates the inter-layer dielectric layer. The data voltage lead and the driving voltage lead are arranged in different layers in a bendable inactive area. Compared with the related art, the layout space is omitted or saved in the present disclosure, which shortens the bezel effectively.

Abstract: A method of obtaining an elongate carrier (12) to which a plurality of circuits (14) are fixed at their outer portions. The central portions (141) of the circuits are removed while the outer portions remain fixed to the carrier. A circuit (14) is fastened to a carrier (12) where electrical conductors extend from conducting pads of the circuit through holes (121) in the carrier to conducting pads of the carrier on an opposite side of the carrier.

Abstract: The preset disclosure provide a display panel and a manufacturing method thereof and a display device. The display panel includes a display area and a peripheral area located in a periphery of the display area; wherein a stress absorption structure is provided in the peripheral area of the display panel.

Abstract: A flexible array substrate, a method for manufacturing the same, and a display panel are provided. The flexible array substrate adopts a structure of a double-layer metal layer to enclose an organic layer in a bending area, which can improve bending stress of a metal trace during bending and reduce probability of fracture; and the metal trace adopting the double-layered design reduces abnormality of a circuit caused by breakage of the metal trace in the bending area and improves product quality.

Abstract: A light-emitting diode (LED) package includes: a reflective structure including a cavity, a bottom portion having a through hole, and a sidewall portion surrounding the cavity and the bottom portion and having an inclined inner side surface; an electrode pad inserted into the through hole; an LED on the bottom portion in the cavity, the LED including a light-emitting structure electrically connected to the electrode pad and a phosphor formed on the light-emitting structure; and a lens structure filling the cavity and formed on the reflective structure.