Patents Examined by Joel M Attey
  • Patent number: 12222781
    Abstract: Computer processing systems are cooled and the otherwise wasted heat is extracted for space heating by providing a cooling dielectric liquid in a tank which passes from a manifold at the bottom of the tank through an array of tubular housings each having open top and bottom ends and containing row of the circuit boards. The housings sit on a divider sheet which has arrays of openings aligned with the housings allowing the liquid to pass from the manifold under little or no pressure so that the liquid flows through the housings by convection and stratifies to generate a layer of heated liquid above the open tops of the housings which can be tapped off to a heat exchanger. A heat pump acts on the cooling liquid to transfer heat to a heat transfer liquid which can be further heated by a boiler and transferred to existing heat dissipating loads.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: February 11, 2025
    Assignee: 10130163 Manitoba Ltd.
    Inventors: Stephane Gauthier, Oscar Miller, Hartley Torrealba, Anna Le Wong
  • Patent number: 12222166
    Abstract: A heat-transfer member (1) is used in a cooling system in which an alcohol serves as a coolant. The heat-transfer member (1) has: a heat-receiving surface (11) configured such that it can receive heat from a heat-generating body; and a heat-dissipating surface (12) configured such that it can dissipate, to the coolant, the heat received at the heat-receiving surface (11). The heat-dissipating surface (12) has a plurality of pores (121) whose average pore diameter is 5 nm or more and 1,000 nm or less. A cooling system can be configured by causing the coolant to contact the heat-dissipating surface (12) of the heat-transfer member (1).
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: February 11, 2025
    Assignees: Kyushu University, National University Corporation, UACJ Corporation
    Inventors: Yasuyuki Takata, Koji Takahashi, Biao Shen, Junji Nunomura, Yoichiro Bekki, Akihiro Fukatsu
  • Patent number: 12215938
    Abstract: A heat exchanger includes a first header including a fluid inlet and a second header positioned downstream of the first header with respect to a first flow path of a first fluid and including a fluid outlet. The heat exchanger further includes a core extending from the first header to the second header and a mount structure extending between the first header and the second header. The core includes a plurality of core tubes. The mount structure is integrally formed with a subset group of diverted tubes of the plurality of core tubes and includes one or more internal flow passages that are connected to the subset group of diverted tubes such that the one or more internal flow passages are in flow communication with the first header and the second header in parallel to a non-diverted portion of the core.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: February 4, 2025
    Assignee: Hamilton Sundstrand Corporation
    Inventor: John Giuliano
  • Patent number: 12209824
    Abstract: A heat exchanger with a housing (3) that contains a set of channels (12); an inlet collector (4) having an inlet collector chamber (9) with an inlet (5), wherein the inlet collector chamber (9) includes first flow distribution means (10) configured to distribute a flow originating from the inlet (5) evenly over the set of channels (12); and an outlet collector (6). The first flow-rate distribution means (10) consist of a single body (15) that comprises two flow-conducting surfaces (16), which are symmetrical with respect to each other according to the first plane of symmetry and the second plane of symmetry, and which two flow-conducting surfaces (16), as seen from the inlet (5), are inclined downward in a first direction perpendicular to the first plane of symmetry and/or in a second direction perpendicular to the second plane of symmetry.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: January 28, 2025
    Assignee: ATLAS COPCO AIRPOWER, NAAMLOZE VENNOOTSCHAP
    Inventor: Johan De Herdt
  • Patent number: 12191231
    Abstract: A rotary machine includes an electric motor, an impeller to be rotated by driving the electric motor and suck in and compress a gas, and a housing that houses the impeller and includes a suction port for the gas. The rotary machine further includes heat dissipation fins provided on the housing and disposed to be heat-exchangeable with the gas passing through the suction port, and an inverter connected to the housing and that controls the electric motor.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: January 7, 2025
    Inventors: Shun Nakayama, Yuji Sasaki
  • Patent number: 12185497
    Abstract: A fluid immersion cooling system has a fluid tank containing a hydrocarbon dielectric fluid as a coolant fluid. One or more components of an electronic system is immersed in the coolant fluid. A gas cylinder contains a non-flammable, compressed filling gas. The temperature of the coolant fluid is monitored during operation of the electronic system. The filling gas is released from the gas cylinder and into the fluid tank when the temperature of the coolant fluid rises to a trigger temperature that is set based on the flash point of the coolant fluid. The filling gas covers a surface of the coolant fluid to block oxygen from interacting with vapors of the coolant fluid to prevent combustion.
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: December 31, 2024
    Assignee: Super Micro Computer, Inc.
    Inventors: Yueh-Ming Liu, Hsiao-Chung Chen, Chia-Wei Chen, Yu-Hsiang Huang, Chia-Che Chang, Hua-Kai Tong, Tan-Hsin Chang, Yu-Chuan Chang, Ming-Yu Chen, Yu-Yen Hsiung, Kun-Chieh Liao
  • Patent number: 12181232
    Abstract: Disclosed in the present invention are a header assembly for a heat exchanger, and a heat exchanger. The header assembly includes: a header, having: a header wall, and a recess on the header wall or an opening penetrating the header wall at an end of the header wall; an end cap disposed at the end of the header wall to close the end of the header, the end cap having a hole, the opening or recess being at a side of the end cap that faces an end face of the end of the header wall; a distribution pipe, comprising a distribution part and a connection part, the connection part projecting from the end cap through the hole of the end cap from the distribution part; and a positioning member having a first end and a second end, the first end of the positioning member being connected to the connection part of the distribution pipe, and the second end of the positioning member being engaged in the opening or recess of the header wall of the header.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: December 31, 2024
    Assignee: DANFOSS A/S
    Inventors: Huan Jin, Weijun Wu
  • Patent number: 12173968
    Abstract: A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: December 24, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Chi-Lung Chen
  • Patent number: 12163739
    Abstract: A heat transfer device includes three plates sandwiched together to form a vapor chamber or similar device. The three plates may be sealingly joined at a closed periphery to define a closed volume that contains a working fluid. One or more of the three plates may include structure to support capillary or other working fluid flow in the closed volume, e.g., a center plate may include openings and/or other structure to permit working fluid flow through and/or along the plate. An outer one of the plates may include an opening through which working fluid may be introduced into the closed volume. After filling with working fluid, the plates may be sealingly joined at one or more joints that extend chordwise across the closed periphery, e.g., so a portion of the plate that defines the opening can be removed from the device.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: December 10, 2024
    Assignee: Aavid Thermalloy, LLC
    Inventors: John R. Cennamo, Christopher McPherson
  • Patent number: 12158309
    Abstract: A heat pipe including a pipe body, a first capillary structure and a second capillary structure. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The first capillary structure is disposed in the evaporation portion. The second capillary structure is disposed in the condensation portion and is connected to an end of the condensation portion that is located away from the evaporation portion. The second capillary structure is not in direct contact with the first capillary structure.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: December 3, 2024
    Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei Liu, Xue Mei Wang
  • Patent number: 12152842
    Abstract: A highly efficient heat exchanger member is realized by providing, to a metal surface, a characteristic that is not found in the metal itself with a coating film excelling in thermal conductivity. A heat exchanger member is made of metal, and includes a carbon-containing oxide film (112B) provided on the metal surface and having fine concave-convex portions (112C). An average spacing between apexes of convex portions of the fine concave-convex portions (112C) is greater than or equal to 40 nm and less than or equal to 120 nm, and an average value of differences in height between apexes of adjacent convex portions and bottom points of concave portions is greater than or equal to 30 nm and less than or equal to 250 nm.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: November 26, 2024
    Assignee: YAMAICHI SPECIAL STEEL CO., LTD.
    Inventors: Hideharu Tajima, Motoki Takagawa
  • Patent number: 12156380
    Abstract: A housing structure includes a first cover and a second cover. The first cover includes a first substrate and two first side plates. The second cover includes a second substrate and two second side plates. The two first side plates and the two second side plates are spliced between the first substrate and the second substrate, such that an accommodating space is formed between the first cover and the second cover.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: November 26, 2024
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Ming Hung Shih
  • Patent number: 12135173
    Abstract: A heat exchanger includes an outer packaging member. The outer packaging member is configured to allow a heat transfer medium flowed to an inside of the outer packaging member from a heat transfer medium inlet to pass through the inside and flow out from a heat transfer medium outlet. The outer packaging member is made of outer packaging laminate materials each including a metal heat transfer layer and a resin thermal fusion layer provided on one surface of the heat transfer layer. The outer packaging laminate materials are superimposed one on the other. The thermal fusion layers are integrally bonded along peripheral edge portions of the outer packaging laminate materials. The heat transfer layer and the thermal fusion layer of the outer packaging laminate material are laminated via an inner adhesive agent layer made of an acid-modified polyolefin-based adhesive agent containing an acid-modified polyolefin-based resin.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: November 5, 2024
    Assignee: Resonac Packaging Corporation
    Inventors: Koji Minamitani, Terutoshi Kumaki
  • Patent number: 12135161
    Abstract: A cooler including a cabinet defining an interior volume for storing a perishable product. A cold plate is disposed within the cabinet, and the cold plate is configured to absorb heat within the cabinet. The cooler further includes a defrosting system that includes a sensor configured to detect a presence of frost on a surface of the cold plate, a heating element affixed to the surface of the cold plate that is configured to at least partially melt frost on the cold plate, and a control unit configured to selectively activate and deactivate the heating element when the presence of frost is determined by the sensor.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: November 5, 2024
    Assignee: PepsiCo, Inc.
    Inventors: Praveen Kumar Nooli, John Michael Hartney, Gurmeet Singh Bhutani, Andrew Hoffman, Joseph E. Stapleton, Atul Tripathi
  • Patent number: 12130056
    Abstract: A thermoelectric assembly includes a thermoelectric module having a hot side and a cold side, where a heat sink is coupled with the hot side of the thermoelectric module and a cold sink is coupled with the cold side of the thermoelectric module. A gasket is disposed between the heat sink and the cold sink and extends around a portion of the thermoelectric module. A vapor barrier is attached to and covers an outer surface of the gasket to prevent water vapor from penetrating the outer surface of the gasket.
    Type: Grant
    Filed: September 25, 2023
    Date of Patent: October 29, 2024
    Assignee: TE Technology, Inc.
    Inventors: Michael J. Nagy, Zakary S. McLennan, Paul G. Lau
  • Patent number: 12117244
    Abstract: A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: October 15, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Chi-Lung Chen
  • Patent number: 12116146
    Abstract: A system for thermal management ground service equipment and a method of use is disclosed. The system may include ground service equipment, wherein the ground service equipment may be configured to manage a temperature of a power source of an electric aircraft. The ground service equipment may include a coolant source, wherein the coolant source may include a reservoir containing a coolant. The ground service equipment may include a coolant heating system, wherein the coolant heating system may be configured to increase thermal energy of the coolant. The coolant heating system may include an electric resistance heating element. The system may include a controller communicatively connected to the ground service equipment, wherein the controller may be configured to receive an optimal temperature of the coolant and control the electric resistance heating element of the coolant heating system to increase the thermal energy of the coolant to the optimal temperature.
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: October 15, 2024
    Assignee: BETA Air, LLC
    Inventors: John Charles Palombini, Jake Pill
  • Patent number: 12111073
    Abstract: A cooling system for a photovoltaic panel including micro flat heat pipes (HP) integrated with thermoelectric generators (TEG) and a cooled water reservoir for cooling the working fluid in heat pipes. The cooled water in the reservoir is pumped from the condensate pan of an air conditioner. Experimental results show that cooling system reduced the average temperature of the panel by as much as 19° C. or 25%. Further, the output power of the photovoltaic panel increased by 44% when the photovoltaic panel was used in a very hot climate (30-40° C.). An additional two watts of power was generated by the TEGs.
    Type: Grant
    Filed: May 10, 2024
    Date of Patent: October 8, 2024
    Assignee: Imam Abdulrahman Bin Faisal University
    Inventor: Fahad G. Al-Amri
  • Patent number: 12108570
    Abstract: The vapor chamber includes a container having a cavity formed of one plate-shaped body to which a heating element is thermally connected and another plate-shaped body facing the one plate-shaped body, a working fluid enclosed in the cavity, and a wick structure that is enclosed in the cavity and separated from the container. The container includes a support part protruding from an inner surface of the other plate-shaped body toward the one plate-shaped body, the support part being formed of a recessed part provided to an outer surface of the other plate-shaped body. At the rising base portion of the support part from the inner surface of the other plate-shaped body, the defined angle between the support part and the inner surface of the other plate-shaped body is an obtuse angle.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: October 1, 2024
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu Inagaki, Kenya Kawabata, Hirofumi Aoki
  • Patent number: 12092406
    Abstract: A two-phase immersion-type heat dissipation structure is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate and a plurality of non-vertical fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other. The non-fin surface is configured to be in contact with a heating element immersed in a two-phase coolant. The fin surface is connected with the non-vertical fins, a cross-sectional contour of one of the non-vertical fins has a top end point and a bottom end point connected with the fin surface, and the top and bottom end points are opposite to each other. A length of a cross-sectional contour line defined from the top end point to the bottom end point is greater than a perpendicular line length of a perpendicular line defined from the top end point to the fin surface.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: September 17, 2024
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Ching-Ming Yang, Chun-Te Wu, Tze-Yang Yeh