Abstract: A metal support element having electronic components or circuit supports, in particular hybrid circuits, the connections of which are guided through from the component side, via a plurality of connector pins melted into glass passthroughs, to the opposite side of the support element. The connector pins are glass-mounted into pin blocks produced independently of the support element. The pin blocks are inserted into associated cutouts of the support element and fastened therein. The arrangement and number of the connector pins in the pin blocks can thereby be flexibly adapted to particular requirements with no need for modifications to the design of the support element. The material and the geometrical properties of the pin blocks can be optimally adapted to the glass-mounting process of the connector pins, while the material of the support element can be matched to the coefficient of thermal expansion of the attached circuit support.