Patents Examined by John D. Cherry
  • Wafer pickup system
    Patent number: 5647626
    Abstract: A non-vacuum semiconductor pick-up and transfer apparatus for handling semiconductor wafers. A flat tapered blade, with front and rear arcuate abutment surfaces adapted to hold a wafer, is provided. In use the blade is thrust between spaced wafers supported in a holder, lifted to retain the wafer between the abutment surfaces, and removed from the holder. The thin and tapered blade shape minimizes damage to the associated wafers in the event of a misalignment of the blade with the wafers.
    Type: Grant
    Filed: December 4, 1995
    Date of Patent: July 15, 1997
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Feng Chen, Jun-Sheng Hsu, Shih-Ming Pan, Knight-Tian Ou