Abstract: The invention concerns an inertial sensor or an actuator based on diamagnetic levitation, said inertial sensor or actuator comprising support means serving as main support body for an inertial sensor or for an actuator, a two dimensional array of permanent magnets and a diamagnetic element facing the said array characterized in that said diamagnetic material constitutes the inertial mass or the moving part of the actuator.

Abstract: A four-degrees-of-freedom (DOF) nonresonant micromachined gyroscope utilizes a dynamical amplification both in the drive-direction oscillator and the sense-direction oscillator, which are structurally decoupled, to achieve large oscillation amplitudes without resonance. The overall dynamical system is comprised of three proof masses. The second and third masses form the sense-direction oscillator. The first mass and the combination of the second and third masses form the drive-direction oscillator. The frequency responses of the drive and sense-mode oscillators have two resonant peaks and a flat region between the peaks. The device is nominally operated in the flat regions of the response curves belonging to the drive and sense-mode oscillators, where the gain is less sensitive to frequency fluctuations. This is achieved by designing the drive and sense anti-resonance frequencies to match.

Abstract: Systems and methods to obtain an ultrasonic image of a large detection area are disclosed. A system includes a source of ultrasound generating ultrasonic energy and projecting the ultrasonic energy from a projecting end and an adapter interfaced to the projecting end and ultrasonically coupling the source of ultrasound to a first surface of the structure to be imaged at an adjustable angle of incidence. A method includes ultrasonically coupling a source of ultrasonic energy to a first surface of a structure to be imaged with an adapter, the adapter adjustable to a select a first angle of incidence and a second angle of incidence, projecting ultrasonic energy into the structure, and detecting a reflected acoustic energy from the structure with an ultrasound camera. A first angle of incidence is selected to introduce a longitudinal wave into the structure, and a second angle of incidence is selected to introduce a shear wave into the structure.

Abstract: A method of balancing a movable rotating object having multiple radial projections, such as a ceiling fan, the method comprising the steps of: attaching to a non-rotating portion of the object a source that emits a focused light, directing the focused light at a target, and then attaching a weight to a location on one of the rotating projections. Then observing the orbit traced by the light source on the target, changing the location of the weight to another location on one of the radial projections, and then observing the change in the orbit on the target.

Abstract: A system and method for inputting motion measurement data into a computationally based device are provided. In a first version three-axis accelerometer determines components of an inertial force vector with respect to an orthogonal coordinate system. The accelerometer includes a sensor die made of a semiconductor substrate having a frame element, a proof mass element, and an elastic element mechanically coupling the frame and the proof mass. The accelerometer also has three or more stress-sensitive IC components integrated into the elastic element adjacent to the frame element for electrical connectivity without metal conductor traversal of the elastic element.

Abstract: In an inertial sensor, a mass is supported by a number of mass support structures positioned within an inner periphery of the mass. The mass support structures are affixed to a substrate by at least one anchor positioned proximate to the mass' center of mass. A number of sensing fingers are affixed to the mass support structures.

Abstract: In order to be able to determine the imbalance of rotors (2) with pocket hole bores with great precision in a bearing arrangement with a bearing mandrel (5) for holding a rotor (2), without journals but having a bore (6), in a balancing device, in which the bearing mandrel (5) has orifices (10, 20) for the passage of fluid, a fluid supply to a fluid chamber (40) disposed between the end of the pocket hole bore and the end of the bearing mandrel is provided to form a cushion of fluid with which the rotor is supported in the axial direction.

Abstract: An acceleration sensor includes a base portion shaped into the form of a frame, a weight portion located inside the base portion and disposed away from the base portion, a flexible beam portion disposed over an upper portion of the base portion and an upper portion of the weight portion and a stopper portion disposed above the base portion and disposed over the weight portion away from the weight portion, wherein the stopper portion restricts an amount of displacement of the weight portion in the direction of the stopper portion.

Abstract: Systems and methods for identifying thermal response of a test structure. An example of the system includes a device that generates a excitation beam, a scanning device that scans the thermal excitation beam over a test structure, and a detector that detects acoustic waves produced scanning by the test structure. The system also includes a display device that generates and displays an image based on the detected acoustic waves. A second detector detects a reflection of the beam off of the test structure and the display device generates and displays an image based on the detected reflection.

Abstract: The invention relates to pseudo porosity standards, and methods for their manufacture and use, which may substantially mimic the effect porosity has on ultrasonic sound as it passes through a composite laminate. An ultrasonic inspection reference standard for composite materials having porosity may include a member having at least one thickness and at least one discrete wire. The member may be manufactured from a fiber-free polymer resin using a stereo lithography process. The discrete wire may scatter and attenuate ultrasonic energy. The reference standard may replace more costly, porous, fiber-reinforced, composite reference standards in the aircraft industry and in other non-aircraft applications.

Abstract: A micromachined device for filtering mechanical vibrations caused by an external disturbance is disclosed. The device can include a first electrostatic vertical comb drive assembly having a first array of stationary elements and a second array of movable elements correspondingly interspersed with the first array. The device can also include a plurality of springs, each springs coupled between a support frame and a proof mass. The first drive assembly can be configured for motion in the z-direction. The device can include a sensor for sensing a position of the proof mass relative to the support frame by measuring displacement between each of the stationary and movable elements. The device can further include a second electrostatic vertical comb drive assembly. The device can have multiple electrostatic comb drive assemblies. An optional feedback network signal processes a displacement measurement to control one of the drive assemblies.

Abstract: The present disclosure relates to an ultrasonic sensor used, for example, in the form of an ultrasonic vehicle parking aid provided with a sensor having an ultrasonic membrane and optionally a board provided with mounted required electronics and a coupling for an electric plug-in connection which are arranged therein, wherein said coupling is placed on a separate coupling housing and the sensor housing is combinable with different coupling housings.

Abstract: An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.

Abstract: A structure for supporting a vibrator 1 is provided. The structure comprises a substrate 12 and bonding wires 14A, 14B fixed to the substrate 12 and connected with the vibrator 1. The vibrator 1 is supported with the bonding wires so that the vibrator 1 is not directly contacted with the substrate 12. “fd” and “fw” satisfy the following formula (1). “fd” represents a resonance frequency of a driving vibration mode of the vibrator and “fw” represents a characteristic frequency of a vibration mode of the bonding wire at room temperature. (fd/2)×1.05?fw, or, fw?(fd/2)×0.95.

Abstract: There is provided a semiconductor-type three-axis acceleration sensor having a high shock resistance, a small difference between outputs of piezo resistors of X-axis, Y-axis and Z-axis, a small size, high sensitivity and a high output. A flexible arm is composed of flexible widening parts and a flexible parallel part. The flexible widening part has a maximum stress part. The piezo resistors are arranged on an upper surface of the flexible arm so that a terminal of the piezo resistor is positioned at the maximum stress part. The Z-axis piezo resistors are positioned close to the width centerline of the flexible arm, while the X-axis and Y-axis piezo resistors are apart from the width centerline. Moreover, the Z-axis piezo resistors are shifted in the longitudinal direction of the flexible arm from the maximum stress part so as to reduce the output difference between the X-axis, Y-axis and Z-axis piezo resistors.

Abstract: An integral connectorless hermetically sealed high-temperature piezoelectric sensor housing and cable assembly includes signal conditioning/processing circuitry having a charge amplifier-differential amplifier combination with integral trim capacitor and/or a voltage divider network in at least one signal processing path to provide the ability to custom adjust input impedances and balance common-mode signals to compensate for inequalities caused by inherent parasitic capacitances and specific structural constraints of the sensor assembly.

Abstract: An acoustic wave sensor system for monitoring the etch rate or etch ability of a selective material has an acoustic wave sensing device having a piezoelectric substrate and at least one electrode coupled to the substrate for generating a propagating acoustic wave and for detecting changes in frequency or other propagation characteristics of the acoustic wave. A selective material is disposed on the substrate. Changes in propagation characteristics of the wave caused by etching of the selective material by an etchant can be analyzed to evaluate the etching rate or etch ability of the selective material. The sensing system can have a wireless sensing device which device is mountable in an oil filter system for monitoring the corrosion of the engine. The sensing device can be configured as BAW, SH-SAW, SH-APM, FPM devices or other acoustic wave devices.

Abstract: A semiconductor device includes a lead frame. The lead frame has a chip mounting section and a plurality of leads. The chip mounting section has a base section, an insulation film covering the base section, a plurality of inter-connect sections, and a chip mounting area. The leads surround the chip mounting section. The semiconductor device also includes a first semiconductor chip having a plurality of first electrode pads. The semiconductor device also includes first bonding wires for connecting the first electrode pads to the inter-connect sections. The semiconductor device also includes a second semiconductor chip which has a cavity and a plurality of second electrode pads. The first semiconductor chip and the first bonding wires are received in the cavity. Second bonding wires connect the inter-connect sections exposed from the second semiconductor chip to the leads. Third bonding wires connect the second electrode pads to the leads. The semiconductor device also includes a sealing section.

Abstract: A gyro sensor having a vibrator and a start circuit generates an oscillation encouraging signal by boosting a first voltage to a voltage of the signal in response to a start signal of a start frequency sent from the start circuit. The vibrator is vibrated in response to the oscillation encouraging signal. When the vibrator is self-excited, the vibrator outputs a first detecting signal indicating an oscillating amplitude and oscillating frequency in the vibration of the vibrator. The sensor boosts the first voltage to a second voltage in response to the first detecting signal and generates a driving signal of a driving frequency and the second voltage. The self-excitation of the vibrator is continued in response to the driving signal. The vibrator outputs a second detecting signal indicating a yaw added to the vibrator. The sensor generates a sensor signal corresponding to the yaw from the second detecting signal.

Abstract: An apparatus in one example comprises a vibrating beam that comprises a nodal point for oscillation in any one or more of a plurality of substantially perpendicular directions for driving into oscillation and sensing angular rate of the vibrating beam. The vibrating beam comprises an aperture that allows a frame to support the vibrating beam near the nodal point.