Abstract: A physical quantity sensor includes: an oscillating body having a support section and a movable section which is connected to the support section through connection portions, in which the movable section has a first movable portion and a second movable portion; a first fixed electrode which is disposed to face the first movable portion; a second fixed electrode which is disposed to face the second movable portion; and a dummy electrode which is disposed to face the second movable portion so as not to overlap the second fixed electrode and has the same potential as potential of the oscillating body, in which the first fixed electrode is disposed such that a portion thereof overlaps the support section when viewed in a plan view.

Abstract: A method for forming an MEMS inertial sensor is provided, comprising: providing a first substrate having a first surface and a second surface, wherein providing the first substrate comprises providing a first base substrate and forming at least one conductive layer; providing a second substrate having a third surface and a fourth surface; bonding the first surface of the first substrate and the third surface of the second substrate together to form a first bonding interface; thinning the first base substrate from the second surface of the first substrate to remove part of the first base substrate; and forming a movable element of the MEMS inertial sensor, wherein the at least one conductive layer comprises a shielding layer, and the shielding layer is located between the first base substrate and the first bonding interface.

Abstract: In a method for open loop operation of a capacitive accelerometer, a first mode of operation comprises electrically measuring a deflection of a proof mass (204) from the null position under an applied acceleration using a pickoff amplifier (206) set to a reference voltage Vcm. A second mode of operation comprises applying electrostatic forces in order to cause the proof mass (204) to deflect from the null position, and electrically measuring the forced deflection so caused. In the second mode of operation the pickoff amplifier (206) has its input (211) switched from Vcm to Vss, using a reference control circuit (209), so that drive amplifiers (210) can apply different voltages Vdd to the proof mass (204) and associated fixed electrodes (202).

Abstract: A MEMS sensor includes a MEMS layer, a cap layer, and a substrate layer. The MEMS layer includes a suspended spring-mass system that moves in response to a sensed inertial force. The suspended spring-mass system is suspended from one or more anchors. The anchors are coupled to each of the cap layer and the substrate layer by anchoring components. The anchoring components are offset such that a force applied to the cap layer or the substrate layer causes a rotation of the anchor and such that the suspended spring-mass system substantially remains within the original MEMS layer.

Abstract: A signal is sent into a structure at an angle substantially parallel to a ramp of the structure using a transducer array positioned at a first surface of the structure. An ultrasound response signal is formed at a second surface of the structure. The ultrasound response signal is received at the transducer array.

Abstract: A physical quantity sensor includes: an angular velocity detection element; an acceleration detection element; a bonding wire through which a detection signal of the acceleration detection element propagates; and a shield unit that is located between the angular velocity detection element and the bonding wire and is connected to a fixed potential. The angular velocity detection element and the acceleration detection element are disposed to be deviated in a height direction. At least a part of the shield unit is disposed between the angular velocity detection element and the acceleration detection element.

Abstract: A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.

Abstract: A microelectromechanical system (MEMS) device includes a substrate and a movable element at least partially suspended above the substrate and having at least one degree of freedom. The MEMS device further includes a protrusion extending from the substrate and configured to contact the movable element when the movable element moves in the at least one degree of freedom, wherein the protrusion comprises a surface having a water contact angle of higher than about 15° measured in air.

Abstract: In some embodiments, a micro electro mechanical system (MEMS) includes a proof mass, sense electrodes, sense circuitry, and a frequency matching circuitry. The proof mass is configured to move responsive to stimuli. The sense electrodes are configured to generate a signal responsive to the proof mass moving. The sense circuitry is coupled to the sense electrodes. The sense circuitry is configured to receive the generated signal and further configured to process the generated signal. The frequency matching circuitry is configured to apply a DC voltage to the sense electrodes. The DC voltage is configured to change a stiffness of a spring of the proof mass. According to some embodiments, the change in the stiffness of the spring matches a resonance frequency between a sense mode and a drive mode. According to some embodiments, the sense electrodes are a comb structure.

Abstract: A microelectromechanical gyroscope includes: a substrate; a stator sensing structure fixed to the substrate; a first mass elastically constrained to the substrate and movable with respect to the substrate in a first direction; a second mass elastically constrained to the first mass and movable with respect to the first mass in a second direction; and a third mass elastically constrained to the second mass and to the substrate and capacitively coupled to the stator sensing structure, the third mass being movable with respect to the substrate in the second direction and with respect to the second mass in the first direction.

Abstract: Exemplary approaches herein provide a barbed tape and security sensor assembly. In one approach, a barbed tape and security sensor assembly includes a vibration detection system including a sensor wire and a sensor housing, the sensor wire configured to be secured to a barrier for detecting vibration in the barrier. The barbed tape and security sensor assembly further includes a barbed tape directly coupled to the sensor housing or the sensor wire by a bracket.

Abstract: A composite sensor includes a first shield pattern that functions as a noise shield of a circuit board, a second shield pattern that functions as a noise shield of a first sensor, and a third shield pattern that functions as a noise shield of a second sensor. The first shield pattern has an impedance lower than the second shield pattern and the third shield pattern. The second shield pattern and the third shield pattern are electrically connected to each other through the first shield pattern. Accordingly, deterioration of detection accuracy caused by electrical noise is restricted.

Abstract: The accelerometers disclosed herein provide excellent sensitivity, long-term stability, and low SWaP-C through a combination of photonic integrated circuit technology with standard micro-electromechanical systems (MEMS) technology. Examples of these accelerometers use optical transduction to improve the scale factor of traditional MEMS resonant accelerometers by accurately measuring the resonant frequencies of very small (e.g., about 1 ?m) tethers attached to a large (e.g., about 1 mm) proof mass. Some examples use ring resonators to measure the tether frequencies and some other examples use linear resonators to measure the tether frequencies. Potential commercial applications span a wide range from seismic measurement systems to automotive stability controls to inertial guidance to any other application where chip-scale accelerometers are currently deployed.

Abstract: A rotation rate sensor includes a first rotationally suspended mass that exhibits a first axis of rotation. The first mass includes a first rotation-rate-measuring element that captures a first rate of rotation about the first axis of rotation and that outputs the first rate of rotation in a first signal. The sensor further includes a second rotationally suspended mass that exhibits a second axis of rotation and is arranged parallel to the first axis of rotation. The second mass includes a second rotation-rate-measuring element that captures a second rate of rotation about the second axis of rotation and that outputs the second rate of rotation in a second signal. The sensor further includes a propulsion device that propels the first and second mass and an evaluating device that outputs a difference of the signals as a third rate of rotation to be measured.

Abstract: A flexible electronic device includes a flexible electronic circuit and a flexible microfluidic sensor homogeneously integrated into the flexible circuit. The flexible sensor includes a flexible microfluidic structure, a first material, a second material, and an electrode arrangement. At least one of the first and second materials is a fluid. The structure defines at least one microfluidic chamber. The first and second materials are disposed in the chamber. The second material has a physical property and an electrical property different from the first material. The electrode arrangement includes at least one pair of electrodes spaced apart from each other with at least a portion of the at least one chamber located functionally directly therebetween such that at least one electronic property measured across the pair is based on a relationship between the second material and the electrode pair. The relationship is based on a physical condition of the microfluidic structure.

Abstract: A MEMS sensor has at least a movable element designed to oscillate at an oscillation frequency, and an integrated measuring system coupled to the movable element to provide a measure of the oscillation frequency. The measuring system has a light source to emit a light beam towards the movable element and a light detector to receive the light beam reflected back from the movable element, including a semiconductor photodiode array. In particular, the light detector is an integrated photomultiplier having an array of single photon avalanche diodes.

Abstract: A method and a system for acquiring the natural frequency of a diaphragm, wherein, the method comprises: selecting test frequency points in a closed space, converting an electric signal into an acoustic signal, directing sound into the closed space, and acquiring the acoustic pressure of each test frequency point; adjusting the electric signal until the acoustic pressure of each test frequency point is the same; converting the adjusted electric signal into an acoustic signal; acquiring the displacement generated by the vibration of the diaphragm; and taking the frequency corresponding to the maximum displacement of the diaphragm as the natural frequency of the diaphragm. By adopting the method and system, the natural frequency of the diaphragm is determined by acquiring the maximum displacement of the diaphragm. Moreover, the process of acquiring the natural frequency of the diaphragm is not affected by surrounding environment, and therefore the acquired result is more accurate.

Abstract: A MEMS acceleration device for measurement of the acceleration along three axes. The device includes capacitors, which capacitance changes under the influence of an acceleration acting upon the device. The change of capacitance for acceleration parallel to the substrate are, normally used with distinct capacitors. This device combines capacitors for using the change in capacitance for sensing in two independent and different directions parallel to the substrate thereby reusing the capacitor. Thereby allowing shrinking of the device while maintaining substantially the same sensitivity.

Abstract: An inertial force sensor includes a detecting device which detects an inertial force, the detecting device having a first orthogonal arm and a supporting portion, the first orthogonal arm having a first arm and a second arm fixed in a substantially orthogonal direction, and the supporting portion supporting the first arm. The second arm has a folding portion. In this configuration, there is provided a small inertial force sensor which realizes detection of a plurality of different inertial forces and detection of inertial forces of a plurality of detection axes.

Abstract: A system is provided that includes a mechanical resonator, and an analog circuit coupled to the mechanical resonator. The analog circuit is arranged to receive a mechanical resonator measurement signal having a quadrature error from the mechanical resonator, and to extract a quadrature error signal from the mechanical resonator measurement signal using a quadrature clock. A digital quadrature controller is coupled to the analog circuit and is arranged to generate a quadrature error compensation signal from the extracted quadrature error signal and apply the quadrature error compensation signal to the mechanical resonator or the mechanical resonator measurement signal to reduce quadrature error in the mechanical resonator measurement signal error.