Abstract: An improved adhesion-preventative physical barrier, wound dressing and drug delivery system comprising an oxidized cellulose film made up of multiple layers of a cellulose fabric or like material and a cellulose film. A method for forming an improved oxidized cellulose film and for using the same to prevent the formation of postsurgical adhesions and/or to dress a wound and/or to deliver one or more drugs.

Abstract: Systems, methods and apparatus are disclosed for bonding a plurality of substrates via a solventless, curable adhesive. At least one of the substrates has a deformation temperature below the activation temperature of the adhesive. A workpiece is assembled from a plurality of substrates with the curable adhesive disposed therebetween. Pressure is applied to the workpiece and the workpiece is irradiated with variable frequency microwave energy. The workpiece is swept with at least one window of microwave frequencies selected to heat the adhesive without heating the substrates above their respective deformation temperatures.

Abstract: Adhesion of shaped thermoplastic elastomer articles is promoted without the need for special primers or other supplemental resin additives by incorporating in an enamel coating composition, an adhesion promoting amount of a carboxyl-modified poly (alpha-olefin) polymer resin. In accordance with a preferred embodiment, the enamel coating composition is a corrosion-resistant cresol-formaldehyde/epoxy resin coating containing from about 0.1% to about 3% by weight of a maleic anhydride-modified polypropylene resin adhesion promoter. The compositions and bonding methods described are useful to provide bonded structures of shaped thermoplastic elastomers, such as SEBS, PBR and EPDM copolymers, heat sealed to metallic substrates, especially metal closures for food containers destined for exposure to high temperature filling, sterilization and retort processing conditions.

Abstract: Modified soy protein adhesives are provided which have increased bonding abilities. The adhesives are prepared by forming a dispersion of soy protein, water, and a modifier selected from two classes of modifiers. The preferred modifiers are urea, sodium dodecylbenzene sulfonate, sodium dodecyl sulfate, and guanidine hydrochloride. The resulting dispersion is stirred, freeze-dried, and milled into a powder to be stored until use. The adhesives of the invention have superior bonding qualities while being safe for the environment. The urea-modified, GH-modified, SDS-modified, and SDBS-modified soy protein adhesives have higher water resistance than non-modified soy protein adhesives.

Abstract: A process for producing a composite article from at least one polar thermoplastic, in particular an engineering thermoplastic, and from at least one foamed or unfoamed polyurethane elastomer, where a molding is firstly molded from the thermoplastic, and some or all of this is provided with an adhesion promoter based on acrylic-resin lacquer or polyurethane-resin lacquer comprising solvents, and then a coating which may be in full-surface or strip form or at least one other molding made from the polyurethane elastomer is used for overmolding, and the thermoplastic material is thus bonded to the polyurethane material.

Abstract: A pressure sensitive adhesive consisting of a polyurethane foam is used for adhering decorative parts to automobiles and other vehicles. The adhesive is characterized by high tensile strength and elongation, excellent peel strength and good thermal and mechanical stress tolerance.

Abstract: A process for bonding filament with aqueous based polyethylene terephthalate or polyurethane bonding agents via a foam delivery system is disclosed. The process includes the steps of: (a) providing a filament; (b) providing a foam prepared by foaming a solution comprising an agent selected from the group consisting of polyethylene terephthalate or polyurethane bonding agents; (c) applying a foam to said filament; and (d) drying and curing said filament.

Abstract: The invention provides a method for imparting topographical or protective features to a substrate by contacting a sheet material comprising a thermoplastic layer with a substrate and heating the sheet material to an elevated temperature. The invention also provides a sheet material which comprises at least one layer consisting essentially of one or more thermoplastic, melt-flowable polymers that are semi-crystalline at room temperature.

Abstract: The present invention relates to an environmentally safe water based construction adhesive suitable for binding two (2) substrates together under conditions wherein moisture resistance is a requirement.

Abstract: An assembly and method for connecting two substrates utilizes a nonconductive laminant that is compatible when wet with a conductive paste when wet. Thus, the curing of the nonconductive laminant and the conductive paste may be performed together. The nonconductive laminant also cures in a shorter time than those previously available, thus the stress on the semiconductor device created by exposure to the cure temperature is additionally reduced.

Abstract: A method for surface mounting electrical components to a substrate, such as a printed circuitboard, involves use of an anisotropically conductive adhesive or Z-Axis adhesive between facing conductive surface areas on the component and substrate. Pressure is applied to the conductive adhesive by a nonconducting adhesive that is first cured between oppositely facing nonconductive surface areas of the component and substrate. This fixes the thickness of each layer of the conductive adhesive at a dimension no greater than its design conductive thickness. In a first submethod, the nonconducting adhesive is a fast setting adhesive subjected to mechanical pressure only as it is assembled on the substrate prior to the subsequent curing of the conductive adhesive. In a second submethod, it is a high shrinkage adhesive that applies compressive force between the component and substrate as it cures and shrinks dimensionally while at a temperature below the subsequent curing temperature of the conductive adhesive.

Abstract: A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.

Abstract: A combination of a specific first coupling agent, second coupling agent, and carrier solvent is synergistically effective as a primer for improving the adhesion of silicone compositions, especially hydrosilation cured silicone gels, to polymer surfaces. The first coupling agent is a titanium-, boron-, or zirconium-containing coupling agent, or a combination of such. The second coupling agent is a silane coupling agent.

Abstract: Moisture-curable silicone sealing compositions that are tacky and self-supporting at room temperature prior to cure. When measured at 25°±1° C. at a frequency of 0.1 rad/sec, the compositions have a storage shear modulus of at least 9.0 KPa, a loss shear modulus of at least 4.0 KPa, and a viscosity of at least 98.5 KPa Sec.

Abstract: Packing material with good gas barrier properties comprising a first and a second layer of a fibrous material or, e.g. paper or cardboard, and a layer of a water based polymer, e.g. polyvinyl alcohol, placed between and in direct contact with the layers of fibrous material and functioning both as a gas barrier and as a binding agent in the packaging material. The packaging material is produced through bringing together and binding together with each other a first and a second strip or sheet of a fibrous material by means of a layer of a water based polymer, e.g polyvinyl alcohol, applied between and in direct contact with the strips or sheets. The surplus water in the thus applied polymer layer is absorbed by the fibrous material in one and/or the other strip or sheet to form the intermediate layer functioning as gas barrier and binding agent.

Abstract: Oligomeric materials contain ultraviolet light absorbing compounds that are covalently bound to the oligomer backbone through an ester or amide linkage. These ultraviolet light absorbing oligomers may be combined with polymers such as polyolefins to provide protection against the harmful effects of ultraviolet light.

Abstract: A binder is applied to particles which are then combined with fibers to bind the particles to the fibers. The particles have functional sites for forming a hydrogen bond or a coordinate covalent bond. The fibers have hydrogen bonding functional sites. The binder comprises binder molecules, the binder molecules having at least one functional group that is capable of forming a hydrogen bond or a coordinate covalent bond with the particles, and at least one functional group that is capable of forming a hydrogen bond with the fibers. A substantial portion of the particles that are adhered to the fibers may be adhered in particulate form by hydrogen bonds or coordinate covalent bonds to the binder, and the binder in turn may be adhered to the fibers by hydrogen bonds. Fibers containing particles bound by this method are easily densified.

Abstract: A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.

Abstract: A process for preparing recyclable fiber composites, comprising bonding fibers with a polymeric bonding agent applied as an aqueous polymer dispersion to said fibers, the polymeric bonding agent comprising at least one addition polymer which, in the state of an aqueous dispersion, has a film forming capability at the temperature at which the addition polymer is combined with said fibers, and said aqueous polymer dispersion, when subjected to a change in pH, is converted into an aqueous solution of the addition polymer. The aqueous addition polymer of the addition polymer dispersion can contain protic acid groups, and the state of the dispersion can be converted to an aqueous addition polymer solution by raising the pH of the aqueous medium. Alternatively, the addition polymer may contain basic groups, in particular, amino groups, and its state as a dispersion can be converted into an aqueous addition polymer resolution by lowering the pH of the aqueous medium.

Abstract: An electrical part mounting apparatus includes a pressure measuring member for measuring the pressure of a pressure head, and a moving speed control member for controlling the moving speed of the pressure head. Accordingly, the electrical part mounting apparatus can freely change the pressure and the moving speed of the pressure head to desired values, and is suitable for connection between electrical parts.