Abstract: A thermosetting adhesive paste exhibiting a high thermal conductivity suitable for die attach applications.

Abstract: An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.

Abstract: Aqueous laminating construction adhesive compositions incorporating a one-part adhesive copolymer, the copolymer being a vinyl ester/acrylic copolymer containing from about 0.1% to about 20%, by weight based on copolymer weight, of a copolymerized polar monomer, the copolymer having a Tg from about 10° C. to about −35 C. are provided which exhibit a good balance of high temperature and ambient temperature adhesion performance in a one-part adhesive composition.

Abstract: To produce a mechanically firm glued connection between two surface regions of surfaces to be connected, a method is provided which provides each of the surfaces with surface regions having a peak-to-valley thickness of less than 0.3 &mgr;m and the surface regions are brought together in such a way that an intermediate space, which is filled with the glue, is produced therebetween and the space has a small average thickness of less than 0.31 &mgr;m and extends over a surface area of at least 20×20 &mgr;m2. The glue is preferably brought into the intermediate space by capillary action and contacts of high quality can be achieved with this method.

Abstract: A method for creating peelable or frangible seals comprising the steps of: 1) selecting a first planar film with a polyethylene based resin disposed on its surface; 2) defining a frangible sealing zone on a surface of the first planar film; 3) heat sealing a second planar film to the frangible zone where the second planar film has a seal surface comprising a plurality of polymers; and 4) cooling the first and second planar films and frangible zone. A seal is created whereby peeling away the second planar film causes a rupture in the polymers disposed on the second planar film's surface.

Abstract: Curable compositions include at least one monomer compound having both (meth)acrylic ester functionality and an allylic phenyl ether functional group on the same molecule, the allylic phenyl ether functional group having at least one unsubstituted position on the phenyl ring which is ortho or para to the allylic ether group, and a free radical catalyst system. The composition may also includes a latent thermally activated acid generator. Claisen Rearrangement of radically polymerized polymers produced from the compositions may be induced at temperatures of about 100° C. or more to give crosslinked products of improved thermal resistance.

Abstract: A curable polymeric composition which is a liquid at 20° C. and which comprises 25 to 60% by weight of a resin component which comprises an epoxy, 5 to 25% by weight of a curing agent which comprises two components, a first component which is a cycloaliphatic amine or an aromatic amine, and a second component which is a polyamide amine, and 20 to 65% by weight of an inert inorganic filler. The curable composition can be used in a method of protecting a substrate such as a pipe or a pipe joint from corrosion or mechanical damage. In the method, the curable composition is first applied to the substrate, polymeric covering layer is applied over the curable composition with an innermost layer of a heat-activatable sealant in intimate contact with the curable composition, and the curable composition is then cured. During the curing process, the heat-activatable sealant, e.g. a hot melt adhesive, remains in contact with the curable composition and interacts therewith.

Abstract: A method for improving the adhesion of an elastomeric, polymeric material to a support element while being shaped and vulcanized thereon, in which the support element is wetted in the region of the adhesion zone with a liquid composition of an adhesion promoter, the coating thus formed is solidified, and the elastomeric material is subsequently shaped on and solidified by vulcanization, an aqueous and/or alcohol solution of a thiocyanatosilane being used as the adhesion promoter.

Abstract: A curable, high temperature, carbonaceous, cement paste composition comprising a catalyst; a carbon filler present in an amount of about 20 to about 60 wt. %; a polymerizable monomeric system present in an amount of about 7 to about 30 wt. % comprising a dialkyl ester of an aromatic tetracarboxylic acid, an aromatic diamine, and a monoalkyl ester of an acid selected from the group consisting of 5-norbornene-2,3-dicarboxylic acid and phthalic acid; and a furan solvent present in an amount of about 20 to about 60 wt. %. The most preferred embodiment comprising a monomeric system comprising a dimethyl ester of 3,3′,4,4′-benzophenonetetracarboxylic acid, 2,2′-bis (4-[4-aminophenoxyl]phenyl)propane and a monomethyl ester of 5-norbornene-2,3-dicarboxylic acid with furfuryl alcohol and a catalytic solution of about 50% ZnCl2, has a glass transition temperature of about 280° C. after curing by heating at about 2° C./minute to about 240° C. and holding for about 2 hours.

Abstract: Separate adhesive is avoided in the manufacture of a thermal ink jet printhead by positioning a thermoplastic nozzle plate (1) on a semiconductor circuit chip (3) and electrically firing the ink ejection resistors (5) in a controlled amount to melt the lower surface in contact with the chip while not damaging the body of the nozzle plate. The resistors are fired in their intended pattern of operation during use so not to damage the resistors. Additional resistors may be added just for this bonding operation if needed with particular chip designs.

Abstract: An acoustic liner employable in jet engine housing construction for sound absorption such as for inclusion in nacelle components. The liner has a solid backface sheet having a surface to which is attached a first side of a honeycomb core structure. Attached to the opposing second side of the honeycomb core structure is a mesh structure to which is attached a perforated face sheet to be exposed to the exterior. As is thus apparent, the liner of the present invention provides a mesh situated below a protective perforate sheet. This construction produces an acoustic liner having substantially the efficiency of a linear liner system and the durability of a perforate face sheet system.

Abstract: A C-shaped clamp cut from a PVC tube having a longitudinal axis and comprising a circular ring of a predetermined diameter and having side edges and a predetermined radial wall thickness extending through a predetermined width between the side edges and a slit cut across the width of the ring to define jaws on either side of the slit. A plurality of the circular clamps are utilized in a method for fabricating a counter top. Edge trims strips are adhesively laminated together on a shelf while held by clamps for curing and later adhesively secured to the periphery of a counter top panel, again held in place by clamps including corner clamps. In an another version, two panels are held in edge to edge contact by either abutments on the panels or by a stringer held in a bowed configuration by a combination of abutting clamps Handles are provided to facilitate manual opening of the clamps.

Abstract: A bonded structure of an Al alloy pressed plate, in which another member is bonded onto the surface of the Al alloy pressed plate that has a lubricant layer by use of an epoxy resin based adhesive. The adhesive contains an epoxy resin, a dehydrated phosphate and a latent curing agent. The epoxy resin comprises a polyester type epoxy resin and at least one resin selected from the group consisting of a bisphenol epoxy resin, a rubber-modified bisphenol epoxy resin, and a urethane-modified epoxy resin.

Abstract: The present invention is directed to a method for improving the adhesion between a conductive laminate and a substrate material. In a preferred embodiment of the present invention, the conductive laminate is a copper film and the substrate material comprises polyphenylene ether resin. The method involves admixing a copolymer of a vinyl aromatic compound and an .alpha.,.beta.-unsaturated cyclic anhydride with the polyphenylene ether resin. The copolymer of a vinyl aromatic compound and an .alpha.,.beta.-unsaturated cyclic anhydride is preferably a polystyrene maleic anhydride copolymer or a rubber modified polystyrene maleic anhydride copolymer.

Abstract: A pressure-sensitive adhesive excellent in the heat resistance and the heat-conductivity comprising a photopolymerization product of a composition containing a) 100 parts by weight of an acrylic monomer mixture or the partial polymerized product thereof, b) from 0.01 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) from 10 to 300 parts by weight of a ceramic powder made up of a covalent bond substance having the total valence electron number of 8 and having a wurtzite type or zincblende type crystal structure or a substance of a hexagonal system or a graphite structure, and d) from 0.01 to 5 parts by weight of a photopolymerization initiator; an adhesive sheet using the pressure-sensitive adhesive; and a fixing method of electronic parts and heat-radiating members using them.

Abstract: A bridging agent for improving the bond between incompatible component layers of laminates comprising one or more N-substituted melamine compounds. The bridging agent is comprised of an N-substituted melamine, an N-substituted melamine formaldehyde resin, a hybrid N-substituted melamine resin, or mixtures of these resins. The bridging agent improves bonding between laminate layers known not to bond well together such as between a styrenated polyester top coat and a melamine impregnating resin. As a result of improving the bond between the incompatible component layers, the bridging agent improves the blister resistance and cove forming characteristics of the laminate. The bridging agent can be used to improve bonding both with and without an overlay paper layer.

Abstract: A conformable tape for bonding a lens block to ophthalmic lens blanks is provided. The tape comprises a polymeric backing and a pressure-sensitive adhesive. In a first preferred embodiment the surface of the backing is a blend of an olefin polymer with a polymer having acidic functionality. The blend may be formed as the backing layer, i.e., directly on the adhesive layer of the tape, or as the outer surface layer of a multilayered backing. In a second embodiment, the surface of the backing is a copolymer of an olefin monomer with a monomer having pendant acidic functionality. A lens block may be adhered to an ophthalmic lens blank by applying a section of the tape described above to an ophthalmic lens so that the pressure sensitive adhesive of the tape contacts the lens; conforming the tape to the compound surface of the lens; and attaching a lens block to at least a portion of the polymer backing layer.

Abstract: The present invention is a weld bonding method providing adhesion by both an adhesive and resistance spot welding, and includes application of an adhesive including a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more additives selected from the group consisting of conductive metals, metal oxides, metal carbides, metal nitrides, metal borides, and metal silicides, which are in the from of powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of 0.5 .mu.m or more and a size of 30 .mu.m or less.

Abstract: A method for applying pressure sensitive adhesive (PSA) directly to one or both surfaces of carpet underlayment pads in which a liquid PSA polymer composition is first applied as a layer to a release substrate. The polymer layer is dried, forming a dried PSA film on the release substrate. The dried PSA film is then laminated to one or both surfaces of a carpet underlayment pad. Alternately, the film can be encased in a second substrate for storage and future application to a carpet underlayment pad.

Abstract: The pH-modified monomer and polymer compositions are useful as biomedical and surgical adhesives, sealants, implants and bioactive agent release carriers or matrices. They comprise a monomer or polymer; and an effective amount of an acidic or basic pH modifier effective to modify the pH of an immediate in vivo environment of the composition to a pH range at which the polymer biodegrades at a different rate than at physiologic pH. The invention also relates to in vivo applications in which surfaces are joined or treated with such pH-modified biocompatible compositions.