Abstract: A non-conductive adhesive film for semiconductor packages and a method of manufacturing a semiconductor package using the non-conductive adhesive film are disclosed. The non-conductive adhesive film for semiconductor packages includes a base; and an adhesive layer disposed on one surface of the base and having a storage modulus in a range of 2 to 4 GPa at 25° C.

Abstract: A machine including a cradle configured to hold an electronic device. The machine also can include an alignment base comprising pins configured to engage with an alignment mechanism of an overlay applicator. The overlay applicator can include an overlay configured to be applied to a screen of the electronic device. The alignment base can include a first side and a second side adjacent to the first side. The pins can be located on the first side and the second side. Other embodiments are described.

Abstract: A method for producing absorbent sanitary articles having a central body, first and second side panels extending laterally outwardly of the central body, and at least one extension band having a distal edge to which at least one closing element is fixed.

Abstract: A preparation method of a garment with automatic opening, includes: firstly, a garment opening preform is manufactured, and then an automatic opening garment is prepared by using the preform. In the preform, one or more functional layers with predetermined shapes and sizes are connected to the positioning layer; when the clothing needs to be opened, the preform only needs to be connected with the area to be opened of the clothing, and the incision is made according to the position of the functional layers, so that the positioning is not required by a pair of incisions on the clothing, which is efficient, convenient, concise and easy to adjust, and provides a convenient and accurate template function for the opening of the clothing, namely, opening and using. The functional layer of the garment opening preform is made of hydrophilic material or hydrophobic material.

Abstract: A method for forming an aircraft component includes forming an inner portion of the aircraft component. The method further includes forming an outer layer of the aircraft component using extrusion of an elastomeric material. The method further includes coupling the outer layer of the aircraft component to the inner portion of the aircraft component.

Abstract: A method of joining overlapping thermoplastic membrane components in which a first thermoplastic membrane component and a second thermoplastic membrane component are positioned in overlapping relationship between a pair of complementary molding surfaces, with at least one of the complementary molding surfaces being defined by an electrically conductive metal susceptor. Heat is generated in the metal susceptor and transferred by thermal conduction from the metal susceptor to overlapping portions of the first and second thermoplastic membrane components to locally melt and coalesce at least a portion of the thermoplastic material of the first thermoplastic membrane component and at least a portion of the thermoplastic material of the second thermoplastic membrane component.

Abstract: The present disclosure provides a process for forming a laminate. The process includes (A) uniformly applying an isocyanate component to a first substrate, the isocyanate component containing an isocyanate compound; (B) uniformly applying an isocyanate-reactive component to a second substrate, the isocyanate-reactive component containing an amine-terminated compound; (C) bringing the first substrate and the second substrate together, thereby mixing and reacting the isocyanate component and the isocyanate-reactive component to form an adhesive composition between the first substrate and the second substrate; (D) curing the adhesive composition to bond the first substrate and the second substrate; and (E) forming the laminate.

Abstract: A system for producing a composite board made of plastic and paper includes a hot press assembly. The hot press assembly includes a first heated belt configured to apply heat and pressure to a composite sandwich. The composite sandwich includes a mat comprising a mixture of paper and plastic and at least one facer positioned above or below the mat. The hot press assembly further includes a roller configured to drive the belt to move the composite sandwich through the hot press assembly and a first non-stick belt configured to separate at least a portion of the composite sandwich from the heated belt as the composite sandwich is moved through the hot press assembly.

Abstract: The present invention relates to a method for applying a threadlike adhesive body to an adherend so that the applied threadlike adhesive body has a desired shape, the method including a step in which a temporary-support-supported threadlike adhesive body including a temporary support and the threadlike adhesive body applied thereto so as to have a shape reverse to the desired shape is applied by press-bonding a surface thereof where the threadlike adhesive body lies to the adherend.

Abstract: Continuously manufacturing a planar layered material by repeatedly performing a bank portion forming step of supplying a first liquid material to a first workpiece and forming a bank portion in a frame shape, filled portion forming step of supplying a second liquid material to an inner side of the formed bank portion and forming a filled portion, and a bonding step of bonding the first workpiece with the filled portion formed thereon and a second workpiece to each other, the planar layered material manufacturing method comprises a height measurement step of measuring, by a height measurement device, a height of the filled portion or the bank portion formed on the first workpiece, and a height adjustment step of adjusting a relative height between the filled portion and the bank portion on the basis of the height of the filled portion or the bank portion measured in the height measurement step.

Abstract: A composite manufacturing method includes the step of drawing a nonwoven fabric formed of continuous fibers through a slurry of discontinuous fibers suspended in a dispersive liquid to yield a fiber-modified interlayer comprising a network of said discontinuous fibers attached to said nonwoven fabric.

Abstract: An apparatus and method of embedding an optical fiber within a substrate. The apparatus includes a bonding device and a conveyance device. The bonding device bonds a foil layer to the substrate to seal the optical fiber within a groove of the substrate. The conveyance device moves the substrate and the bonding device relative to each other. Relative motion between the substrate and the bonding device draws the optical fiber into the groove and the foil layer over the optical fiber at a collection point.

Abstract: The invention provides automated spacer processing systems and methods. The systems and methods involve at least one robot arm that is configured to process spacers for multiple-pane insulating glazing units. In some embodiments, the systems also include an insulating glazing unit assembly line and a spacer conveyor system. Additionally or alternatively, the systems may include a sealant applicator.

Abstract: The present invention relates to a method of producing a cellulose-based product (103,700), wherein the method comprises the steps of: (i) providing at least two layers including one first (104a) and one second (104b) layer, and wherein said first (104a) and second layer (104b) each comprise cellulose fibers, and wherein at least one side of said first (104a) and/or said second (104b) layer is pre-treated with an adhesive coating, (ii) arranging said at least two layers including the one first (104a) and the one second (104b) layers in a superimposed relationship to each other in a forming mold (102) of a form press (101), thereby generating a stack (104) of said at least two layers including the one first (104a) and the one second (104b) layers, wherein said first (104a) and second (104b) layers are oriented within the stack (104) such that said at least one pre-treated side of said respective first (104a) and/or second (104b) layer is facing towards the superimposed layer, (iii) form pressing said stack (10

Abstract: A method can be used to form a plastic filler neck for a vehicle. The method includes providing a fuel injection pipe comprising a polyamide material containing nanoclay and having a single layer structure in cross-section, inserting and fastening a retainer into an internal space of a tip of the fuel injection pipe to support a refueling gun, directly fastening a cap holder to the tip of the fuel injection pipe, and mounting an air drain casing to an outer diameter portion of the cap holder fastened to the fuel injection pipe using a mounting bracket.

Abstract: The present invention relates to an adhesive film comprising an adhesive layer; a photothermal conversion layer containing a light absorber and a thermally decomposable resin; and an adhesive base film layer disposed between the adhesive layer and the photothermal conversion layer, wherein the adhesive base film layer contains a multifunctional epoxy resin, a binder resin, a curing agent, and a curing catalyst. The adhesive film according to the present invention may be able to simplify a processing process of a substrate, and prevent damage to the substrate and circuits or elements formed on the substrate.

Abstract: A method of manufacturing a microfluidic analytical device comprising providing a top lamination layer and a bottom lamination layer, wherein each of the top lamination layer and bottom lamination layer comprises an outer layer and an inner layer, cutting out one or more channel spaces from the at least one of the top lamination layer and the bottom lamination layer, wherein the one or more channel spaces form a microfluidic path, positioning at least one middle layer between the top lamination layer and the bottom lamination layer, such that each of the two inner layers face the at least one middle layer, and subjecting the top lamination layer and the bottom lamination layer to a process, wherein the process allows both the inner layers to permeate substantially through the at least one middle layer.

Abstract: An apparatus for a direct transfer of a semiconductor device die from a wafer tape to a substrate. A first frame holds the wafer tape and a second frame secures the substrate. The second frame holds the substrate such that a transfer surface is disposed facing the semiconductor device die on a first side of the wafer tape. A needle is disposed adjacent a second side of the wafer tape opposite the first side. A length of the needle extends in a direction toward the wafer tape. A first needle actuator is used to adjust an angle of the needle to align the die, wafer tape, and transfer surface at which point the needle presses on the second side of the wafer tape to press a semiconductor device die of the one or more semiconductor device die into contact with the transfer surface of the substrate.

Abstract: Provided are methods and devices for supporting of variety of different pre-cured composite stringers after forming and prior to curing. A post-forming processing device comprises a base with a channel for receiving hat portions of different stringers. The device also comprises a support structure, at least partially extending within the channel. The support structure is configured to conform to different hat portions and to retain the shape of these hat portions. For example, the support structure is made from a flexible material, which conforms to any shape variations. In some examples, the support structure is made from a jamming material that is reshaped together with each of the pre-cured composite stringers. A post-forming processing device is used for supporting different pre-cured composite stringers while various operations are performed on these stringers, such as stringer trimming, inspection, installation of bladders and noodles, and the like.

Abstract: Methods and systems for the fabrication of composite materials are generally described. Certain inventive methods and systems can be used to fabricate composite materials with few or no defects. According to certain embodiments, composite materials are fabricated without the use of an autoclave. In some embodiments, composite materials are fabricated in low pressure environments.