Abstract: The invention comprises improvements in inert anode electroplating processes that make possible the utilization of typically inexpensive and otherwise advantageous cation-yielding compounds for replenishing the plating bath, compounds that typically are not well suited for such use in prior art systems due to their relatively low dissolution rate which typically requires their use in powder form, and the tendency of the powder particles to aggregate. Exemplary applications for the improved plating process are in Cu-, Ni-, and Pd-plating, and exemplary cation-yielding compounds or CuO, NiO, PdO, Cu(OH).sub.2,Ni(OH).sub.2, and Pd(OH).sub.2. The improvements according to the invention comprise agitating the powder/electrolyte mixture or slurry in a reactor vessel separate from the plating tank, and maintaining the cation concentration in the plating tank within predetermined limits. Agitation typically requires power input to the slurry of at least about 2.