Abstract: In a step for bonding a color filter to a solid-state color-image sensor chip with an adhesive which is curable not only by light or more particularly ultraviolet-ray irradiation but also by heating, pre-curing or partial curing is effected by irradiating light rays after the color filter and the chip has been pressed against each other and correctly aligned with each other in a bonding device and then the chip with the partially-bonded color filter is removed from the bonding device and complete curing of the adhesive is accomplished by heating. According to one embodiment of the present invention the bonding step is carried out in an atmosphere containing the oxygen so that the adhesive which has been squeezed out from the space between the color filter and the chip may be prevented from being cured and subsequently removed in a simple manner.

Abstract: A solid-state photoelectric transducer comprises a plurality of output units for photoelectrically converted signals which units are constructed of: a plurality of photoelectric converter elements, a plurality of signal accumulators for accumulating signals output from said photoelectric converter elements corresponding to an amount of light incident on said photoelectric converter elements, each of said signal accumulators being connected with an associated one of said photoelectric converter elements; a plurality of devices for returning the signal accumulators from a signal accumulating state to an initial state, each of said devices being connected with an associated one of the signal accumulators; a plurality of signal amplifiers for outputting amplified signals corresponding to the signals accumulated in the signal accumulators, each signal amplifier being connected with an associated signal accumulator; and a plurality of cross-talk preventors for preventing cross-talk of the signal output from each si