Patents Examined by Jon T Schermerhorn
  • Nucleation device, heat storage device, and nucleation method for heat storage material
    Patent number: 10386122
    Abstract: A nucleation device for changing a phase of a heat storage material from a liquid state to a solid state includes a plurality of substrates in close contact with each other in the heat storage material, and a pressing part that presses a portion of the plurality of substrates so as to elicit a change in the state of close contact of the plurality of substrates.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: August 20, 2019
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Shinji Nishida, Hiroto Yoshino, Teruaki Yuoka
  • Tube header for heat exchanger
    Patent number: 10378834
    Abstract: A tube header for a heat exchanger includes a header plate having two major dimensions defining a header plane. The header plate has a row of oblong passages extending through the header plate, and a plurality of tie bars. Each tie bar is arranged between a pair of adjacent oblong passages. At least one of the tie bars is a support tie bar with a generally W-shaped support tie bar profile in a cross-section across the row of oblong passages. The support tie bar has a center area forming a plateau surface parallel to the header plane and connecting two generally V-shaped portions of the support tie bar profile. The plateau surface supports an internal header baffle extending perpendicular to the header plane.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: August 13, 2019
    Assignee: MAHLE INTERNATIONAL GMBH
    Inventors: Bradley D. Abell, Nicholas Potter
  • Tube header for heat exchanger
    Patent number: 10371464
    Abstract: A tube header for a heat exchanger includes a header plate having two major dimensions defining a header plane. The header plate has a row of oblong passages extending through the header plate. Each passage is bordered by a ferrule monolithically formed with the header plate. The ferrule has a surrounding wall extending perpendicular to the header plane. A transitional area between the ferrule and the header plate has a reduced thickness that is smaller than the wall thickness of the ferrule. This transitional area provides a flexible hinge-like function for compensating dimensional changes during thermal cycles of a heat exchanger.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: August 6, 2019
    Assignee: MAHLE INTERNATIONAL GMBH
    Inventors: Bradley D. Abell, Nicholas A. Potter, Jeffrey A. Dunker, David A. Nagel, Jr.
  • Condenser tube cleaning apparatus
    Patent number: 10371470
    Abstract: Disclosed herein is a condenser tube cleaning apparatus. The condenser tube cleaning apparatus can stably circulate and collect a large number of cleaning balls to efficiently remove foreign substances accumulated in a condenser unit.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: August 6, 2019
    Assignee: Doosan Heavy Industries Construction Co., Ltd
    Inventor: Ki Youl Kim
  • 3-D channel gas heat exchanger
    Patent number: 10365045
    Abstract: The present invention relates to a 3-d channel gas heat exchanger. The 3-D channel gas heat exchanger includes a plurality of heat exchange plates configured to have heating surface units for exchanging heat formed on one sides of the heat exchange plates and a plurality of passages and that are formed in between the plurality of heat exchange plates and wherein the plurality of passages comprise, first passages configured to convey a first fluid having a first temperature through the first passages, second passages configured to convey a second fluid through the second passages for transferring heat to the first fluid having the first temperature and third passages configured to prevent freezing in the second passages by transferring heat to at least some of the second passages when a temperature (T) of the second fluid is below a predetermined temperature value (Tref).
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: July 30, 2019
    Assignee: ALFA LAVAL CORHEX LTD.
    Inventor: Young-Jong Choi
  • Manifold design to eliminate fractures on multistage heat exchanger coils
    Patent number: 10359218
    Abstract: A system and method for a multistage condenser is described that reduces problems associated with temperature and pressure differential strains on tubes above and below a dead tube. Instead of connecting the dead tube to the I/O manifold, a physical separation is created. The physical separation can be created by shortening the dead tube, coring a portion of the I/O manifold where the dead tube is received, independent I/O manifolds, or other means.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: July 23, 2019
    Assignee: Lennox Industries Inc.
    Inventors: Tate Byers, Aylan Him, Gregory Ruhlander, Claudia A. Morales, David Mackey
  • Support device for a tube, in particular a tube of a heat exchanger designed to come into contact with a motor vehicle battery
    Patent number: 10351012
    Abstract: The invention concerns a support device (1) for a tube, in particular a tube of a heat exchanger designed to come into contact with a vehicle battery for cooling thereof, the device (1) comprising a base (13) on which the tube is designed to be mounted, an element (15) for compressing the tube against the battery, and one or more elements (17) for connecting the compression element (15) to the base (13), the connecting elements (17) being configured to engage with a face (19) of the compression element (15) opposite said base (13) while being in contact with the base (13) on either side of said compression element (15).
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: July 16, 2019
    Assignee: Valeo Systemes Thermiques
    Inventors: Laurent Legot, Fabien Bireaud
  • Thermal module
    Patent number: 10352625
    Abstract: A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.
    Type: Grant
    Filed: April 10, 2014
    Date of Patent: July 16, 2019
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang
  • Membrane-integrated energy exchange assembly
    Patent number: 10352628
    Abstract: A method of forming a membrane panel configured to be secured within an energy exchange assembly may include forming an outer frame defining a central opening, and integrating a membrane sheet with the outer frame. The membrane sheet spans across the central opening, and is configured to transfer one or both of sensible energy or latent energy therethrough. The integrating operation may include injection-molding the outer frame to edge portions of the membrane sheet. Alternatively, the integrating operation may include laser-bonding, ultrasonically bonding, heat-sealing, or the like, the membrane sheet to the outer frame.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: July 16, 2019
    Assignee: Nortek Air Solutions Canada, Inc.
    Inventors: Blake Norman Erb, Stephen Hanson, Mohammad Afshin
  • Thermal camouflage device and vehicle comprising such a device
    Patent number: 10345080
    Abstract: An infrared camouflage device and a vehicle including such a device which includes an array of parallel pipes carrying a heat-transfer fluid for changing the thermal signature of a vehicle. This device is characterized in that it includes an inlet manifold, an intermediary manifold, a first series of first pipes connecting the inlet manifold to the intermediary manifold, a second series of second pipes connecting the intermediary manifold to an outlet manifold, each first pipe being located in the vicinity of a second pipe so as to form, at the device, an alternation of first and second parallel pipes, the inlet manifold and the outlet manifold being in the vicinity of each other.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: July 9, 2019
    Assignee: NEXTER SYSTEMS
    Inventor: Michel Brun
  • Aircraft cooling system
    Patent number: 10343781
    Abstract: An aircraft cooling system including a cooler which is adapted to supply cooling energy to an aircraft device to be cooled, and a heat transfer arrangement which is adapted to transfer waste heat generated by the cooler to a cabin air extraction system. The heat transfer arrangement comprises a heat transfer circuit, in which a liquid heat transfer medium heated by the waste heat of the cooler circulates.
    Type: Grant
    Filed: April 2, 2014
    Date of Patent: July 9, 2019
    Assignee: AIRBUS OPERATIONS GMB
    Inventors: Torsten Truemper, Matthias Reiss
  • Heat exchanger for cooling a flow of charge air, and method of assembling the same
    Patent number: 10337801
    Abstract: A heat exchanger for cooling a flow of charge air includes a heat exchanger core that is inserted through an aperture of a housing. A leak-free seal is maintained along the periphery of the aperture by the compression of a gasket between a top plate of the heat exchanger core and a planar bearing surface of the housing. Compression of the gasket is maintained by one or more deformable retaining members that are disposed against the top plate.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: July 2, 2019
    Assignee: MODINE MANUFACTURING COMPANY
    Inventors: Steven Meshenky, Christopher Michael Moore, Robert Cook
  • Fluid handling device and a method of heating or cooling a fluid flow
    Patent number: 10330390
    Abstract: A fluid handling device that is adapted to heat or cool a first fluid flow, the device includes a thermal chamber adapted to heat or cool the first fluid flow in the thermal chamber; and an input channel which is adapted to channel the first fluid flow into the thermal chamber, an outlet channel which is adapted to channel a heated or cooled second fluid flow out of the thermal chamber, such that the thermal energy of the second fluid flow along the outlet channel is higher or lower than the thermal energy of the first fluid flow along the input channel. The outlet channel is thermally connected to the input channel, so that the outlet channel is adapted to transfer thermal energy between the heated or cooled second fluid flow along the outlet channel and the first fluid flow along the input channel to heat or cool the first fluid flow before entering the thermal chamber.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: June 25, 2019
    Assignee: Verdus Technologies PTE. LTD.
    Inventor: Avichal Agrawal
  • Water-cooling heat dissipation device and water block thereof
    Patent number: 10327355
    Abstract: A water-cooling heat dissipation device includes a vapor chamber, a heat conduction cylinder, and a cover. A first chamber is formed in the vapor chamber. The heat conduction cylinder extends from a surface of the vapor chamber. A second chamber communicating with the first chamber is formed in the heat conduction cylinder. A working fluid flows in the first chamber and the second chamber. The cover covers the vapor chamber; the heat conduction cylinder is disposed in the cover. By means of the working fluid flowing in the first chamber and the second chamber which communicate with each other, heat can be delivered rapidly from the vapor chamber to the heat conduction cylinder.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: June 18, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Jen-Cheng Lin
  • Cooler and cooler fixing method
    Patent number: 10319665
    Abstract: A cooler for cooling a semiconductor module to be secured to a base, the cooler including: a cooler body that includes a refrigerant flow path surrounded by a first wall part having a first through-hole, a second wall part that is arranged facing the first wall part and that includes a connection region which is to be connected to the base at a position opposing the first through-hole, and a side wall part for connecting the periphery of the first wall part and the periphery of the second wall part; and a lid for closing off the first through-hole.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: June 11, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Ryo Maruyama
  • Pre-cooling system having controlled internal adjustment
    Patent number: 10316399
    Abstract: The invention relates to equipment for cooling a metal strip (2) having a liquid coating to be solidified, wherein said strip is continuously moving. Said equipment is characterized in that each half-cooler (11, 12) is divided, over the length thereof, into at least two sections, a first section (13) and a second section (14), in the direction of the movement of the strip (2). The first section (13) is separated from the second section (14) in each half-cooler (11, 12) by a respective internal adjustment device (7, 8), making it possible to change the gas flow/pressure parameter so that the value of said gas flow/pressure parameter is different in the first section (13) from the value of said parameter in the second section (14).
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: June 11, 2019
    Assignee: Cockerill Maintenance & Ingéniérie S.A.
    Inventors: Stéphane Langevin, Michel Dubois
  • Heat spreading module for portable electronic device
    Patent number: 10314202
    Abstract: In a heat spreading module for a portable electronic device configured such that a heat pipe is attached along a metal plate with which a heating element is brought into close contact, and heat of a heated region of the metal plate with which the heating element is brought into close contact is transferred to a place on the metal plate apart from the heated region by the heat pipe, the heat pipe is configured such that a container is formed of a pipe, a portion of the container arranged on the heated region is a heated portion, and a portion of the container apart from the heated region is a heat dissipation portion that dissipates heat to the metal plate, and the heated portion is formed in a flat shape, and the heat dissipation portion is formed to be thicker than the heated portion having the flat shape.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: June 4, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Mohammad Shahed Ahamed, Yuji Saito, Akihiro Takamiya, Makoto Takahashi
  • Heat exchanger
    Patent number: 10302373
    Abstract: The present disclosure provides a heat exchanger that includes a plurality of tubes and a side plate arranged most outside of the plurality of tubes. The side plate extends in a longitudinal direction of the plurality of tubes. The heat exchanger further includes a core plate, and longitudinal ends of the plurality of tubes are connected to the core plate. Furthermore, the heat exchanger includes a tank connected to the core plate, and a thermal expansion joint integrally formed in the core plate. The thermal expansion joint is located on an end portion of the core plate, and includes a wall part, which an end portion of the side plate in the longitudinal direction is brazed with, and a bent part, which is configured to be deformed to allow the thermal expansion joint to have flexibility between the side plate and the core plate.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: May 28, 2019
    Assignee: DENSO International America, Inc
    Inventor: Yilin Tian
  • Cooling mechanism of high mounting flexibility
    Patent number: 10306805
    Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: May 28, 2019
    Assignee: ADLINK TECHNOLOGY INC.
    Inventors: Hsiu-Ling Yu, Hsuan-Chan Chiang
  • Heat exchanger apparatus with manifold cooling
    Patent number: 10302365
    Abstract: Disclosed is a heat exchanger having heat exchange plates and a base plate that can help to mitigate the thermal stresses encountered by a heat exchanger, particularly, around the peripheral edge portions of the heat exchanger and the base of heat exchanger. This is achieved by providing a channel of coolant fluid near the peripheral edge portions which is in between the peripheral edge portions and the manifold permitting flow of hot fluid. In addition, the base plate of the heat exchanger is protected from the hot fluid flowing through the manifold by providing deflectors that shield the base plate from the hot fluid.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: May 28, 2019
    Assignee: Dana Canada Corporation
    Inventors: Ihab Edward Gerges, John G. Burgers, Peter Zurawel, Zia Shahidi, Kosta Bozhkov