Patents Examined by Jonathon Johnson
  • Patent number: 6696666
    Abstract: A system and method for processing a tubular member comprises a hollow tubular member, a laser and a media flow. The laser is constructed and arranged to transmit laser energy to the tubular member. The laser energy is transmitted to the tubular member through a fluid column according to a predetermined pattern. The media flow is injected into the lumen of the hollow tubular member.
    Type: Grant
    Filed: July 3, 2002
    Date of Patent: February 24, 2004
    Assignee: SciMed Life Systems, Inc.
    Inventors: Kenneth M. Merdan, Jan Weber
  • Patent number: 6685083
    Abstract: A method and apparatus for creating second order vibrational modes. The apparatus includes a signal generator, a piezoelectric transducer, a plurality of wave propagating beams and reflecting boards. An electric field applied by the signal generator to the piezoelectric transducer induces a unidirectional vibration of the transducer. The vibration is propagated through the beams and reflected by the reflecting boards in a closed polygonal loop. The final reflection direction is perpendicular to the original vibration. A circular or elliptical vibration of the apparatus results. The circular or elliptical vibrational energy can be imparted to the wire bond of an integrated circuit to add strength to the connection.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: February 3, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Zhiqiang Wu
  • Patent number: 6244497
    Abstract: A method for repairing and joining aluminum alloy articles and structures, such as heat exchangers for use in automotive applications. The method utilizes a flux-coated soldering rod (10) that is used to deliver a solder alloy (12) and a flux compound to a region to be repaired. The flux compound has a higher melting temperature than the solder alloy (12), and is present as a coating (14) that sufficiently thermally insulates the alloy (12) to cause the flux compound and the solder alloy (12) to melt nearly simultaneously during the soldering operation. The solder alloy (12) is preferably a zinc-aluminum alloy, while the flux coating (14) preferably contains a cesium-aluminum flux compound such as potassium cesium tetrafluoroaluminate, dispersed in an adhesive binder that will readily volatilize or cleanly burn off during the soldering operation.
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: June 12, 2001
    Assignee: S.A. Day Mfg. Co. Inc.
    Inventors: Paul Joseph Conn, Jackson H. Bowling, Jr.