Patents Examined by Jorge Salazar, Jr.
  • Patent number: 10128816
    Abstract: In a high frequency module, in addition to a main transmission path in which a high-frequency signal propagates in first filter elements, a sub transmission path is defined by inductive coupling or capacitive coupling between a first inductor and a matching element or by inductive coupling between the first inductor and a second inductor. The sub transmission path has different amplitude characteristics and phase characteristics from those of the main transmission path depending on a degree of the inductive coupling or capacitive coupling, and transmission characteristics as a high-frequency module are adjustable by adjusting the amplitude characteristics and the phase characteristics of the sub transmission path.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: November 13, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Morio Takeuchi, Koichiro Kawasaki, Yohei Konaka
  • Patent number: 10128813
    Abstract: A bulk acoustic wave (BAW) resonator comprises: a first electrode; a second electrode comprising a plurality of sides, wherein at least one of the sides is a connection side; a piezoelectric layer disposed between the first and second electrodes, and an acoustic reflective element disposed beneath the first electrode, the second electrode and the piezoelectric layer, wherein an overlap of the reflective element, the first electrode, the second electrode, and the piezoelectric layer defines an active area of the acoustic resonator; a bridge adjacent to a termination of the active area of the BAW resonator; and a discontinuity disposed in the bridge.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: November 13, 2018
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Robert Thalhammer, Alexandre Shirakawa, Thomas Faust, Phil Nikkel
  • Patent number: 10122344
    Abstract: A ladder-type surface acoustic wave filter includes interdigital transducer electrodes disposed on a LiTaO3 piezoelectric substrate, and series resonators and parallel resonators defined by the interdigital transducer electrodes, and utilizes a leaky wave that propagates on the LiTaO3 piezoelectric substrate. A bandwidth ratio indicating a bandwidth of a passband of the ladder-type surface acoustic wave filter is about 2.5% or greater, and a cutoff frequency due to bulk wave radiation of one of the parallel resonators, is in a frequency range higher than the passband.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: November 6, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Norihiko Nakahashi, Koji Miyamoto
  • Patent number: 10116284
    Abstract: A branching device (10) includes a switch (SW1), a fixed filter circuit (11), and a tunable filter (TF1). The switch (SW1) includes a common terminal (Ps11) and individual terminals (Ps12, Ps13). The fixed filter circuit (11) is connected to the individual terminal (Ps12) and has a fixed pass band. The tunable filter (TF1) is connected to the individual terminal (Ps13) and has a tunable pass band. The fixed filter circuit (11) includes filters (FIL1, FIL2) having different pass bands. The pass bands of the filters (FIL1, FIL2) correspond to frequency bands to be used in carrier aggregation.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: October 30, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Katsuhiro Ikada
  • Patent number: 10116034
    Abstract: A twin axial cable structure is provided for transmitting signals that makes use of insulative materials that are not easily extruded, such as expanded polyethylene (ePE) and expanded polytetrafluoroethylene (ePTFE). The cable structure includes an insulative body portion having a pair of open channels defined through an outer longitudinal surface of the insulative body portion, in which are disposed a pair of conductive wires. A conductive sheet is disposed on the insulative body portion, and a grounding element is placed in contact with the conductive sheet, such as by applying planar conductive sheets and grounding elements and/or ground wires to the insulative body portion. Corresponding methods and apparatuses for manufacturing the same are also provided. The cable structures, methods, and apparatuses described herein can produce a cable structure for transmitting multiple differential signals within the same structure, with minimal negative effects on other, neighboring transmissions.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: October 30, 2018
    Assignee: Mellanox Technologies, Ltd.
    Inventors: Pierre Avner Badehi, Eyal Frost
  • Patent number: 10116023
    Abstract: An apparatus is provided for causing a phase-shift in reflected signals that are a reflection of surface-traveling wave signals of a select signal frequency. The apparatus comprises a conductive strip having a plurality of slots therein alternatingly arranged orthogonal to each other, each slot having an effective length that is a fraction between 9/16 and ? of the wavelength associated with the select signal frequency, and a plurality of conductive enclosures respectively disposed under each of the plurality of slots. Each of the conductive enclosure have a width and length sufficient to enclose a respective corresponding slot, and a depth that is a fraction of between ? and ? of the wavelength associated with the select signal frequency when transmitted in the dielectric material.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: October 30, 2018
    Assignee: The Boeing Company
    Inventors: Garrett L. Gilchrist, Richard W. Burns, Michael P. Hurst
  • Patent number: 10110199
    Abstract: An acoustic wave filter includes: series resonators connected in series; and one or more parallel resonators connected in parallel, wherein at least two series resonators and a parallel resonator therebetween are divided into a first divided resonator, which includes a piezoelectric substance sandwiched between a pair of electrodes in a c-axis orientation direction, and a second divided resonator, which includes another piezoelectric substance sandwiched between another pair of electrodes so that the another pair of electrodes in the c-axis orientation direction has an electric potential opposite to that of the electrodes of the first divided resonator in the c-axis orientation direction, a first group including the first divided resonators and a second group including the second divided resonators are interconnected in parallel between two nodes, and the first divided resonators and the second divided resonators of the at least two series resonators are not electrically interconnected at the two nodes.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: October 23, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masumi Kida, Tokihiro Nishihara, Yoshio Sato, Shinji Taniguchi, Taisei Irieda
  • Patent number: 10103417
    Abstract: Waveguide hinges are provided that allow for a substantially continuous RF waveguide to be formed through the hinge when the hinge elements are in a particular relative rotational configuration with respect to one another; the substantially continuous RF waveguide is not formed when the hinge elements are in various other relative rotational configurations. Such waveguide hinges allow for waveguide elements to be repositioned during periods when RF energy is not being transmitted.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: October 16, 2018
    Assignee: Space Systems/Loral, LLC
    Inventor: Evan I. Gomberg
  • Patent number: 10097153
    Abstract: A bandstop filter is provided that includes an input port, a series bandpass resonator, a first capacitor, a bandstop resonator, a second capacitor and an output port. The combination of the first capacitor, the bandstop resonator and the second capacitor comprises a bandstop impedance magnitude and a bandstop impedance phase. The bandpass resonator impedance magnitude is substantially equal to the bandstop impedance magnitude. The bandpass resonator impedance phase is substantially 180° out of phase with the bandstop impedance phase. The series bandpass resonator, the first capacitor, the bandstop resonator and the second capacitor operate as a band stop for a predetermined frequency within the frequency band.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: October 9, 2018
    Assignee: The United States of America as represented by Secretary of the Navy
    Inventors: Jason F. Rowland, Jia-Chi S. Chieh
  • Patent number: 10096876
    Abstract: Methods, systems, and devices are described that include one or more sidewall features to improve performance of a waveguide device. In particular, the sidewall features may be utilized within a polarizer section of a polarizer device such as a septum polarizers. The sidewall feature(s) may include recesses and/or protrusions. When a plurality of sidewall features are employed, the size, shape, spacing and kind (e.g., recess or protrusion) may vary according to a particular design.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: October 9, 2018
    Assignee: ViaSat, Inc.
    Inventor: Anders Jensen
  • Patent number: 10090824
    Abstract: A filter apparatus includes a plurality of stages of ladder circuits connected between an input terminal and an output terminal, and a band width ratio is about 4.3 % or higher. The ladder circuits of respective stages include series arm resonators, parallel arm resonators, first inductors respectively connected between a ground potential and first end portions, and second inductors respectively connected between the ground potential and second end portions.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: October 2, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Norihiko Nakahashi
  • Patent number: 10084427
    Abstract: Embodiments of a Surface Acoustic Wave (SAW) device and methods of fabrication thereof are disclosed. In some embodiments, a SAW device includes a quartz carrier substrate, a piezoelectric layer on a surface of the quartz carrier substrate, and at least one interdigitated transducer on a surface of the piezoelectric layer opposite the quartz carrier substrate, wherein a thickness of the piezoelectric layer is less than twice a transducer electrode period of the at least one interdigitated transducer. Using the piezoelectric layer on the carrier substrate suppresses acoustic radiation into the bulk, thereby improving the performance of the SAW device. Further, by utilizing quartz for the carrier substrate, additional advantages of small viscous losses, small permittivity, and small thermal sensitivity are achieved. Still further, as compared to Silicon, the use of quartz for the carrier substrate eliminates resistive losses.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: September 25, 2018
    Assignee: Qorvo US, Inc.
    Inventors: Marc Solal, Shogo Inoue
  • Patent number: 10075146
    Abstract: An elastic wave device including a sealing structure. Examples of the elastic wave device include a piezoelectric substrate, an IDT electrode provided on the substrate, a first wiring electrode provided on the substrate adjacent the IDT electrode, a second wiring electrode provided on the first wiring electrode, and a dielectric sealing structure that extends over and seals an excitation space above the IDT electrode in which the IDT electrode excites the elastic wave. The second wiring electrode includes a protrusion formed on its outer periphery and extending beyond the first wiring electrode into the excitation space. The first and/or second wiring electrodes are electrically connected to the IDT electrode. The dielectric sealing structure includes a sealing wall provided on the second wiring electrode, the sealing wall being spaced apart from the IDT electrode by the protrusion and having a side surface that defines a side edge of the excitation space.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: September 11, 2018
    Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Yosuke Hamaoka, Mitsuhiro Furukawa, Toru Yamaji
  • Patent number: 10069477
    Abstract: A surface acoustic wave device includes: comb-shaped electrodes each including electrode fingers and dummy electrode fingers; and additional films located to cover gaps between tips of the electrode fingers of one of the comb-shaped electrodes and tips of the dummy electrode fingers of the other, wherein each of the additional films overlap with at least one of the electrode fingers and the dummy electrode fingers located lateral to the corresponding gap in a first direction in which the electrode fingers extend or in a second direction intersecting with the first direction, and a distance G of the gap is 0<G?1.0? and a film thickness h of the additional films is 0<h/??(0.146G+0.694076)×?2/?1 where ? is a wavelength of an acoustic wave, ?1 is a density of a material of the additional films, and ?2 is a density of aluminum oxide.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: September 4, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Hidetaro Nakazawa, Takashi Matsuda
  • Patent number: 10069472
    Abstract: A bulk acoustic wave resonator including a substrate; an air cavity formed on the substrate; and a resonating part formed on the air cavity and comprising a first electrode, a piezoelectric layer, and a second electrode which are sequentially laminated, wherein a cross section of the air cavity has a short side, a long side opposing the short side, a first lateral side and a second lateral side connecting the short side and the long side to each other, the first and second lateral sides are inclined, and a surface roughness of the first electrode, the piezoelectric layer, the second electrode, or any combination thereof is between 1 nm and 100 nm.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: September 4, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Moon Chul Lee, Yeong Gyu Lee, Chul Soo Kim, Jea Shik Shin, Duck Hwan Kim, Sang Uk Son
  • Patent number: 10069537
    Abstract: Aspects of the subject disclosure may include, for example, a coupling device including a receiving portion that receives a radio frequency signal conveying data from a transmitting device. A magnetic coupler magnetically couples the radio frequency signal to a transmission medium as a guided electromagnetic wave that is bound by an outer surface of the transmission medium. Other embodiments are disclosed.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: September 4, 2018
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventors: Robert Bennett, Paul Shala Henry, Irwin Gerszberg, Farhad Barzegar, Donald J. Barnickel, Thomas M. Willis, III
  • Patent number: 10062943
    Abstract: A method for fabricating microstrip line structure is disclosed. First, a substrate is provided, ground patterns are formed on the substrate, an interlayer dielectric (ILD) layer is formed on the ground patterns, contact plugs are formed in the ILD layer, a ground plate is formed on the ILD layer, and a signal line is formed on the ground plate. Preferably, the ground plate includes openings that are completely shielded by the ground patterns.
    Type: Grant
    Filed: September 10, 2016
    Date of Patent: August 28, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventor: Tzung-Lin Li
  • Patent number: 10063213
    Abstract: In a filter device, a transversal elastic wave filter, which defines a delay element, is connected in parallel with a band pass filter. The transversal elastic wave filter has the same amplitude characteristic as and the opposite phase to the band pass filter at a desired frequency inside an attenuation range of the band pass filter. When a wavelength determined by an electrode finger period of IDTs and is denoted by ?, the distance between the first IDT and the second IDT of the elastic wave filter is about 12? or less.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: August 28, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Koichiro Kawasaki
  • Patent number: 10056670
    Abstract: A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: August 21, 2018
    Assignee: HARRIS CORPORATION
    Inventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, Jr., Lawrence Wayne Shacklette, Robert Patrick Maloney, David M. Smith
  • Patent number: 10044492
    Abstract: Embodiments of the present invention provide an antenna and a communications device, and relate to the field of wireless communications technologies. The antenna includes at least one receive antenna unit, at least one transmit antenna unit, a transmit and receive antenna unit connected to a three-port component having a circulator characteristic, a signal output port, and a signal input port, where each receive antenna unit and a receiver port of the three-port component are both connected to the signal output port by using a power combiner, and the signal output port is configured to connect to a receiver; and each transmit antenna unit and a transmitter port of the three-port component are both connected to the signal input port by using a power divider, and the signal input port is configured to connect to a transmitter.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: August 7, 2018
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yu Liu, Huaping Qing, Kun Li