Patents Examined by Jorge Salazar, Jr.
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Patent number: 9503051Abstract: A filter unit of a high-frequency module includes SAW resonators connected in series with first and second series connection terminals therebetween, first and second shunt connection terminals, and additional SAW resonators. One end of one SAW resonator is connected to a connection node of other SAW resonators via a connection conductor, and the other end of the one SAW resonator is connected to the first shunt connection terminal via a connection conductor. The first shunt connection terminal is connected to ground via an inductor. A matching element is connected between the second series connection terminal and the second external connection terminal. The matching element is inductively coupled or capacitively coupled to the connection conductor.Type: GrantFiled: October 8, 2015Date of Patent: November 22, 2016Assignee: Murata Manufacturing Co., Ltd.Inventor: Morio Takeuchi
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Patent number: 9503050Abstract: An elastic wave device that can be downsized. Certain examples of the elastic wave device include a substrate, an IDT electrode provided above the substrate, a wiring electrode provided above the substrate and connected to the IDT electrode, a sealing body sealing an excitation space in which the IDT electrode excites an elastic wave, and a sealing wall provided above the wiring electrode and forming a part of the sealing body. An outer periphery of the wiring electrode includes a protrusion. In one example, the wiring electrode includes a first wiring electrode provided on an upper surface of the substrate and a second wiring electrode provided on an upper surface of the first wiring electrode, an outer periphery of the second wiring electrode being provided with the protrusion.Type: GrantFiled: July 27, 2015Date of Patent: November 22, 2016Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.Inventors: Yosuke Hamaoka, Mitsuhiro Furukawa, Toru Yamaji
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Patent number: 9496914Abstract: Antenna units, antenna systems and polarizing systems provide polarization diversity to leaky-wave antennas. An antenna unit comprises a rat-race coupler having a summation port, a difference port and two output ports. Each one of a pair of composite right/left-handed (CRLH) leaky-wave antennas (LWA) is connected at one end to a respective one of the output ports of the rat-race coupler. An inductive stub is implemented between the CRLH LWAs for connecting the CRLH LWAs to a grounded via. Various polarizations are obtained by injecting a radio-frequency (RF) signal in the summation or difference port of the rat-race coupler, or in both ports. System variants include various devices and assemblies for injecting RF signals in the antenna unit. One such variant includes a polarizing system having a switched matrix for directing a signal according to various intended polarizations.Type: GrantFiled: January 13, 2012Date of Patent: November 15, 2016Assignee: POLYVALOR, LIMITED PARTNERSHIPInventors: Christophe Caloz, Samer Abielmona, Van-Hoang Nguyen, Ning Yang
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Patent number: 9490771Abstract: An acoustic resonator structure comprises a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode, a second electrode disposed on the piezoelectric layer, a frame disposed within a main membrane region defined by an overlap between the first electrode, the piezoelectric layer, and the second electrode, and having an outer edge substantially aligned with a boundary of the main membrane region, and a collar formed separate from the frame, disposed outside the main membrane region, and having an inner edge substantially aligned with the boundary of or overlapping the main membrane region.Type: GrantFiled: February 28, 2013Date of Patent: November 8, 2016Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Dariusz Burak, John Choy, Alexandre Shirakawa, Phil Nikkel
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Patent number: 9484887Abstract: A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate. The solder balls are positioned to electrically connect the bonding pads formed on the substrate to positions on each of the die.Type: GrantFiled: December 26, 2012Date of Patent: November 1, 2016Assignee: Telefonaktiebolaget LM Ericsson (publ)Inventors: Chunyun Jian, Somsack Sychaleun
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Patent number: 9478838Abstract: An orthomode coupler for an antenna system, particularly for a multi-feed antenna is provided. The orthomode coupler includes a first signal waveguide for a first RF signal that can propagate in the first signal waveguide, along a first axis, as well as a second signal waveguide for a second RF signal that can propagate in the second signal waveguide, along a second axis, where the second axis is disposed parallel to the first axis. Furthermore, the orthomode coupler includes a septum polarizer in which the first and second signal waveguide end, and a common signal waveguide having a third axis, along which a transmission and reception signal can propagate, where the third axis runs parallel to the first and the second axis, and where the common signal waveguide is coupled with the septum polarizer. The common signal waveguide includes a further polarizer.Type: GrantFiled: June 15, 2012Date of Patent: October 25, 2016Assignee: Astrium GmbHInventors: Helmut Wolf, Michael Schneider
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Patent number: 9473108Abstract: A surface acoustic wave device includes: a pair of comb-like electrodes formed on a piezoelectric substrate, each of which includes electrode fingers, dummy electrode fingers and a bus bar to which the electrode fingers and the dummy electrode fingers are connected, the electrode fingers and the dummy electrode fingers of one of the pair of comb-like electrodes facing the dummy electrode fingers and the electrode fingers of the other com-like electrode, respectively; and additional films extending in the form of a strip in a first direction in which the electrode fingers are arranged side by side, each of the additional films covering at least parts of gaps defined by ends of the electrode fingers of one of the pair of comb-like electrodes and ends of the dummy electrode fingers of the other comb-like electrode.Type: GrantFiled: September 10, 2014Date of Patent: October 18, 2016Assignee: TAIYO YUDEN CO., LTD.Inventors: Kentaro Nakamura, Hidetaro Nakazawa, Shogo Inoue, Jun Tsutsumi
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Patent number: 9461618Abstract: In one aspect of the invention, an acoustic device has a first coupled resonator filter (CRF) and a second CRF electrically coupled to one another in series. Each CRF has an input port, an output port, a bottom film bulk acoustic resonator (FBAR), an acoustic decoupler formed on the bottom FBAR, and a top FBAR formed on the acoustic decoupler. Each FBAR has a bottom electrode, a piezoelectric layer formed on the bottom electrode, and a top electrode formed on the piezoelectric layer. The decoupling layer capacitance arising between the two electrodes enclosing the acoustic decoupler in a CRF is configured to achieve targeted filter response. A compensating capacitance is introduced to improve the amplitude and phase imbalance performance of an unbalanced to balanced CRF by eliminating the existence of asymmetric port-to-ground or feedback capacitance at the balanced output port produced by the decoupling layer capacitance.Type: GrantFiled: January 23, 2014Date of Patent: October 4, 2016Inventors: Wei Pang, Hao Zhang
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Patent number: 9461621Abstract: A first filter channel with superior attenuation characteristics for transmission signals and is less susceptible to influence of transmission signals inputted to a transmission SAW filter device, is disposed closer to a transmission terminal, whereas a second filter channel with poor attenuation characteristics in a transmission band and is more susceptible to the influence of transmission signals inputted to the transmission SAW filter device, is disposed farther from a transmission terminal to improve isolation characteristics in a differential mode of a duplexer.Type: GrantFiled: December 4, 2014Date of Patent: October 4, 2016Assignee: Murata Manufacturing Co., Ltd.Inventor: Syuji Yamato
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Patent number: 9461619Abstract: A high-frequency module includes a multilayer substrate, a switch IC, a SAW duplexer and a matching circuit. The matching circuit includes a wiring line and first and second inner layer ground electrodes. The matching circuit performs impedance matching between the switch IC and the SAW duplexer in a pass band of the SAW duplexer. The wiring line is an inner layer electrode of the multilayer substrate that is connected between the switch IC and the SAW duplexer. The first and second inner layer ground electrodes face the wiring line in a stacking direction with only dielectric layers of the multilayer substrate therebetween.Type: GrantFiled: January 31, 2014Date of Patent: October 4, 2016Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yuji Nurikabe, Hiromichi Kitajima
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Patent number: 9450563Abstract: An acoustic wave bandpass filter comprises at least an input first acoustic wave resonator with an output surface, and an output second acoustic wave resonator with an input surface, said resonators being coupled to each other along a set direction, the input and output surfaces being substantially opposite, and at least one first phononic crystal structure between said input and output resonators and/or a second phonic crystal structure at the periphery of said resonators so as to guide the acoustic waves, generated by said input resonator, toward said output resonator along said set direction, the resonators ensuring an impedance conversion and/or a mode conversion.Type: GrantFiled: October 11, 2011Date of Patent: September 20, 2016Assignee: Commissariat a L'Energie Atomique et aux Energies AlternativesInventors: Marie Gorisse, Alexandre Reinhardt
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Patent number: 9450564Abstract: An elastic wave filter includes a piezoelectric substrate, an input side IDT electrode, an output side IDT electrode, and a reflector. At least one IDT electrode among the input side IDT electrode and the output side IDT electrode is weighted only with a main lobe among an apodized weighting method such that the intersection length becomes short from a part at which one electrode finger is opposed to another electrode finger adjacent to the one electrode finger toward an end portion of the at least one IDT electrode in a propagation direction of an elastic wave. A part with the largest intersection length in the at least one IDT electrode is shifted to any one of one side and another side in the propagation direction of the elastic wave from a center position at the at least one IDT electrode in the propagation direction of the elastic wave.Type: GrantFiled: August 27, 2014Date of Patent: September 20, 2016Assignee: NIHON DEMPA KOGYO CO., LTD.Inventor: Ryuji Kajihara
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Patent number: 9450279Abstract: A lossy electrical-signal transmission line having first and second ends, the transmission line being configured such that: its characteristic impedance at the first end has a first value; its characteristic impedance at the second end has a second value, lower than the first value; and its series resistance measured from its first end to its second end is within a given range of the difference between said first and second values.Type: GrantFiled: August 29, 2014Date of Patent: September 20, 2016Assignee: SOCIONEXT INC.Inventor: Ian Juso Dedic
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Patent number: 9444429Abstract: A piezoelectric thin-film resonator includes: a substrate; a piezoelectric film having a lower piezoelectric film provided on the substrate and an upper piezoelectric film provided on the lower piezoelectric film; lower and upper electrodes that face each other through at least a part of the piezoelectric film; an interposed film that is interposed between the lower piezoelectric film and the upper piezoelectric film and is located in an outer circumferential part of a resonance region in which the lower and upper electrodes face each other through the piezoelectric film, the interposed film not being provided in a central part of the resonance region; an upper surface of the lower piezoelectric film having a first roughness in a region in which the interposed film is not provided and a second roughness in another region in which the interposed film is provided, the first roughness being smaller than the second roughness.Type: GrantFiled: November 25, 2014Date of Patent: September 13, 2016Assignee: TAIYO YUDEN CO., LTD.Inventors: Takeshi Sakashita, Tokihiro Nishihara, Tsuyoshi Yokoyama
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Patent number: 9444428Abstract: An film bulk acoustic wave resonator (FBAR) structure has an FBAR and a via disposed substantially directly beneath the FBAR. The via is in thermal contact with the FBAR. A plurality of vias may be included. The via(s) serve to dissipate heat generated by the FBAR structure during operation.Type: GrantFiled: August 28, 2014Date of Patent: September 13, 2016Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Richard C. Ruby, Steve Martin, Brice Ivira, Suresh Sridaran
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Patent number: 9418524Abstract: Systems (100) and methods (600, 1800) for making a marker. The methods comprise: obtaining a resonator material which has been annealed under a tensile force selected to provide a maximum resonant amplitude at a bias field; providing by a bias material of the marker an operating bias field with a value less than a value of the bias field; forming a first housing portion from a flexible material so as to have a planar shape; and forming a second housing portion from the flexible material so as to comprise a cavity in which the resonator and bias materials can be housed when the second housing portion is coupled to the first housing portion. The cavity is defined by two opposing short sidewalls, two opposing elongate sidewalls (OESW) and a bottom sidewall. Each of OESW is stiffened by forming a plurality of first stiffener edge features along an exterior surface thereof.Type: GrantFiled: September 16, 2014Date of Patent: August 16, 2016Assignee: Tyco Fire & Security GmBhInventors: Randy Zirk, Gopal Chandramowle, Nen-Chin Liu
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Patent number: 9419585Abstract: An elastic wave filter device includes a one-port elastic wave resonator and an elastic wave filter unit connected in series to the one-port elastic wave resonator. The one-port elastic wave resonator is connected in parallel to an inductance. In the elastic wave filter device, fr1>f0 is satisfied, where f0 is the center frequency of a passband of the elastic wave filter unit, and fr1 is a resonant frequency of the one-port elastic wave resonator.Type: GrantFiled: July 29, 2014Date of Patent: August 16, 2016Assignee: Murata Manufacturing Co., Ltd.Inventor: Junpei Yasuda
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Patent number: 9419582Abstract: A filter device includes a band pass filter connected between a first signal terminal and a second signal terminal and an LC circuit connected in parallel with the band pass filter. The LC circuit has anti-resonant characteristics that make the LC circuit be open at a pass band of the band pass filter, and make attenuation in a specified frequency band outside of the pass band of the band pass filter higher than in a case in which the LC circuit is not connected, as a result of the LC circuit being connected.Type: GrantFiled: January 27, 2015Date of Patent: August 16, 2016Assignee: Murata Manufacturing Co., Ltd.Inventor: Koichiro Kawasaki
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Patent number: 9413335Abstract: A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.Type: GrantFiled: July 29, 2014Date of Patent: August 9, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Syuichi Onodera, Syuji Yamato, Tadaji Takemura
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Patent number: 9401691Abstract: A bulk acoustic wave (BAW) resonator device includes a substrate defining a cavity, a bottom electrode formed over the substrate and at least a portion of the cavity, a piezoelectric layer formed on the bottom electrode, and a top electrode formed on the piezoelectric layer. An air-wing and an air-bridge are formed between the piezoelectric layer and the top electrode, the air-wing having an inner edge that defines an outer boundary of an active region of the BAW resonator device. The BAW resonator device further includes a temperature compensation feature having positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer. The temperature compensation feature extends outside the active region by a predetermined length.Type: GrantFiled: April 30, 2014Date of Patent: July 26, 2016Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Qiang Zou, Chris Feng, Phil Nikkel, John Choy, Alexandre Augusto Shirakawa, Tina L. Lamers, Sook Ching Chang, Dariusz Burak