Patents Examined by Jose D. Dees
  • Adhesion promotion in photoresist lamination and processing
    Patent number: 4693959
    Abstract: Use of a photoresist is improved due to increased adhesive to a substrate through an additive in the resist of a condensation polymer of formaldehyde, toluene sulfonamide and either a triazine such as melamine or hydantoin.
    Type: Grant
    Filed: March 7, 1986
    Date of Patent: September 15, 1987
    Assignee: E.I. Du Pont de Nemours and Company
    Inventor: Robert W. Ashcraft