Patents Examined by Joselito S. Baisa
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Patent number: 11574764Abstract: A dust core includes a compact containing a soft magnetic powder and also includes a cover coat for the compact. The cover coat contains a polyamideimide-modified epoxy resin. An electric/electronic component includes the dust core, a coil, and a connection terminal connected to each end portion of the coil. At least one portion of the dust core is placed so as to be located in an induced magnetic field generated by the current flowing in the coil through the connection terminal. An electric/electronic device includes the electric/electronic component.Type: GrantFiled: June 14, 2017Date of Patent: February 7, 2023Assignee: ALPS ELECTRIC CO., LTD.Inventors: Masao Matsui, Satoshi Maruyama, Takao Mizushima
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Patent number: 11562846Abstract: A coil component includes a main body portion containing resin and having a hole portion, a coil provided in the main body portion, and a substantially cylindrical pipe arranged inside the hole portion. The coil includes an inner wiring embedded in the pipe and an outer wiring exposed from the main body portion. The inner wiring and the outer wiring are integrally continuous.Type: GrantFiled: November 27, 2018Date of Patent: January 24, 2023Assignee: Murata Manufacturing Co., Ltd.Inventor: Junji Kurobe
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Patent number: 11562851Abstract: An electronic component includes a magnetic body containing magnetic metal powder; and external electrodes disposed on an outer portion of the magnetic body. The external electrodes include first plating layers in direct contact with the magnetic body.Type: GrantFiled: January 29, 2016Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Min Sung Choi
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Patent number: 11538624Abstract: There are provided a wire wound inductor and a manufacturing method thereof according to an exemplary embodiment in the present disclosure. The wire wound inductor according to an exemplary embodiment in the present disclosure includes a winding coil, a magnetic core embedding the winding coil, and an adhesive portion disposed between the magnetic core and the winding coil and enclosing the winding coil.Type: GrantFiled: June 8, 2018Date of Patent: December 27, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Young Seuck Yoo, Hwi Dae Kim
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Patent number: 11527349Abstract: Inductor device comprising a rectangular prismatic electro-insulating support (10) with three pairs of parallel outer faces (11) defining orthogonal axis (X, Y, Z), and defining eight corners; a rectangular prismatic magnetic core (20) supported by said electro-insulating support (10); and three conductor wire windings (DX, DY, DZ) wound around the three axis (X, Y, Z) surrounding the magnetic core (20); wherein the magnetic core (20) is a hollow magnetic core (20) composed by three pairs of sheets (21), each pair of sheets (21) being composed by two parallel sheets (21) facing each other perpendicular to one of said axis (X, Y, Z), and wherein each sheet (21) is made of a magnetic material, said sheet (21) being in contact and attached to the electro-insulating support (10) and being in contact with the surrounding orthogonal sheets (21).Type: GrantFiled: November 26, 2018Date of Patent: December 13, 2022Inventors: Sergio Cobos Reyes, Claudio Cañete Cabeza, Antonio Rojas Cuevas, Jorge Rodríguez, Francisco Ezequiel Navarro Pérez
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Patent number: 11515076Abstract: A coil device comprising a pair of coil members annularly assembled at two connecting end portions; each coil member comprising a magnetic core, a resin case substantially entirely surrounding the magnetic core, and a coil wound around the resin case; the resin case having connecting means and guide means in the connecting end portion of each coil member; and the connected coil members being adhered to each other in the connecting end portions.Type: GrantFiled: March 23, 2018Date of Patent: November 29, 2022Assignee: HITACHI METALS, LTD.Inventor: Mutsuhito Sakaguchi
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Patent number: 11495398Abstract: A coil electronic component includes a body including an insulator; a coil portion embedded in the body; aggregates dispersed in the insulator, where the aggregates each comprise a plurality of magnetic particles, coating layers formed on surfaces of the aggregates using an insulating material, and external electrodes connected to the coil portion.Type: GrantFiled: June 8, 2018Date of Patent: November 8, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Il Lee, Han Wool Ryu, Sang Kyun Kwon
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Patent number: 11482371Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.Type: GrantFiled: December 16, 2019Date of Patent: October 25, 2022Assignee: TDK CORPORATIONInventors: Shinichi Sato, Yohei Tadaki, Akihiko Oide, Yuma Ishikawa, Hidekazu Sato, Kazuhiro Ebina, Hiroyuki Tanoue
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Patent number: 11482364Abstract: A component main body has a multilayer structure having a thickness and in which a first dielectric glass layer in which an internal conductor is embedded and having a thickness is interposed between a pair of magnetic layers containing a ferrite material as a primary component, and each of a pair of second dielectric glass layers is disposed on one of principal surfaces of the pair of magnetic layers. First to fourth outer electrodes are disposed on both end portions of the component main body. The thickness of at least one of the pair of second dielectric glass layers that faces a mounting substrate is about 10 ?m to 64 ?m.Type: GrantFiled: November 27, 2018Date of Patent: October 25, 2022Assignee: Murata Manufacturing Co., Ltd.Inventors: Keiichi Tsuduki, Kenji Tanaka, Masashi Matsubara
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Patent number: 11476034Abstract: A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.Type: GrantFiled: July 6, 2018Date of Patent: October 18, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Hui Jo, Hye Won Jung, Sa Yong Lee
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Patent number: 11469030Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.Type: GrantFiled: December 30, 2019Date of Patent: October 11, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Patent number: 11469036Abstract: An inductor includes a magnetic body including a magnetic substance; a substrate disposed within the magnetic body; and an internal electrode disposed on at least one of an upper surface and a lower surface of the substrate. The substrate is disposed on an inclined with respect to at least one surface of the magnetic body.Type: GrantFiled: July 10, 2020Date of Patent: October 11, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Jong Ik Park
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Patent number: 11462349Abstract: A resonance damping element for a power converter having a positive busbar and a negative busbar, wherein the resonance damping element comprises a magnetic core formed with two openings through which the positive busbar and the negative busbar of the power converter are to be routed, respectively.Type: GrantFiled: April 21, 2017Date of Patent: October 4, 2022Assignee: VACON OYInventors: Marko Koskela, Jukka Linna, Vesa Väisänen
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Patent number: 11437173Abstract: A coil component includes a body, a coil portion embedded in the body, and external electrodes electrically connected to the coil portion. The coil portion includes coil patterns having trenches formed in surfaces thereof. The trenches extend through a partial thickness of the coil portion, and are located at aligned locations in adjacent windings of the coil portion. A method of forming the coil component includes forming a mask pattern having a coil shaped opening and including a plurality of bridges extending across the coil shaped opening in the mask pattern.Type: GrantFiled: June 14, 2018Date of Patent: September 6, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Seong Min Cho, Eo Jin Choi, Young Ku Lyu, Yong Hui Li
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Patent number: 11437174Abstract: An inductor includes a coil substrate, an encapsulation material containing a magnetic material and selectively covering the coil substrate, and first and second external electrodes formed on the exterior of the encapsulation material. The coil substrate includes a laminate of stacked structures each including a conductive track and first and second connection parts on opposite sides of the conductive track in a single wiring layer. The conductive tracks are connected in series to form a helical coil. The first connection parts are connected by a first via to form a first electrode terminal connected to a first end of the helical coil. The second connection parts are connected by a second via to form a second electrode terminal connected to a second end of the helical coil. The first and second external electrodes are connected to the first and second electrode terminals, respectively.Type: GrantFiled: July 24, 2018Date of Patent: September 6, 2022Assignees: SHINKO ELECTRIC INDUSTRIES CO., LTD., TOKYO COIL ENGINEERING CO., LTD.Inventors: Yasuyoshi Horikawa, Tsukasa Nakanishi, Kazuyuki Okita, Yukihiro Miyasaka
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Patent number: 11404197Abstract: Techniques for fabricating low-loss magnetic vias within a magnetic core are provided. According to some embodiments, vias with small, well-defined sizes may be fabricated without reliance on precise alignment of layers. According to some embodiments, a magnetic core including a low-loss magnetic via can be wrapped around conductive coils of an inductor. The low-loss magnetic vias can improve performance of an inductive component by improving the quality factor relative to higher loss magnetic vias.Type: GrantFiled: June 8, 2018Date of Patent: August 2, 2022Assignee: Analog Devices Global Unlimited CompanyInventors: Jan Kubik, Bernard Patrick Stenson, Michael Morrissey
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Patent number: 11398340Abstract: An inductor may include a body and external electrodes on respective external surfaces of the body. The body may include a support member, an insulator on the support member and including a first opening, a coil in the first opening, and a thin film conductor layer between the coil and the support member. The thin film conductor layer may include a second opening, and one or both of its end portions may be between the support member and the insulator.Type: GrantFiled: April 28, 2020Date of Patent: July 26, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Young Sun Kim
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Patent number: 11393776Abstract: A semiconductor device package includes a substrate, a first coil, a dielectric layer and a second coil. The first coil is disposed on the substrate. The first coil includes a first conductive segment and a second conductive segment. The dielectric layer covers the first conductive segment of the first coil and the second conductive segment of the first coil and defines a first recess between the first conductive segment of the first coil and the second conductive segment of the first coil. The second coil is disposed on the dielectric layer. The second coil has a first conductive segment disposed within the first recess.Type: GrantFiled: May 17, 2018Date of Patent: July 19, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shun-Tsat Tu, Pei-Jen Lo, Yan-Si Lin, Chien-Chi Kuo
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Patent number: 11387034Abstract: An asymmetric spiral inductor fabricated in a semiconductor structure includes a spiral coil, a metal segment, and a connection structure. The spiral coil is substantially disposed in a first metal layer and includes a first terminal and a second terminal. The first terminal is disposed at an outermost turn of the spiral coil, and the second terminal is disposed at an innermost turn of the spiral coil. The metal segment is disposed in a second metal layer different from the first metal layer and has a third terminal and a fourth terminal. The connection structure connects the second terminal and the third terminal. The first terminal and the fourth terminal form the two terminals of the asymmetric spiral inductor. The spiral coil is a polygon with N sides (N>4). A portion of the metal segment has a shape substantially identical to a portion of the contour of the polygon.Type: GrantFiled: May 7, 2018Date of Patent: July 12, 2022Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Hsiao-Tsung Yen, Yuh-Sheng Jean, Ta-Hsun Yeh
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Patent number: 11355272Abstract: An electronic component comprising: a body; a conductive wire in the body; and a first lead comprising a first part disposed on a first surface of the body and a second part disposed on a second surface of the body, wherein the second part of the first lead comprises a first protrusion portion and a second protrusion portion spaced apart from each other, wherein a first portion of a first terminal part of the conductive wire is disposed between the first protrusion portion and the second part of the first lead disposed on the second surface of the body, and a second portion of the first terminal part of the conductive wire is disposed between the second protrusion portion and the second part of the first lead disposed on the second surface of the body.Type: GrantFiled: January 9, 2018Date of Patent: June 7, 2022Assignee: CYNTEC CO., LTDInventors: Yung-Cheng Chang, Chih-Siang Chuang, Yi-Min Huang