Abstract: Multilayer printed circuit board is fabricated by coating a suitable substrate, metal, plastic, paper, with a photosensitive coating, exposing the photosensitive coating to form a dielectric thereof, coating the dielectric layer with a coating of a photosensitive chemical solution, selectively imaging and developing the photosensitive coating to form a desired circuit pattern on the dielectric coating, forming a first layer of circuitry by coating the circuit pattern with a conducting material, coating the circuitry bearing layer with a second layer of photosensitive material, selectively exposing and developing the second layer of photosensitive material to form a dielectric with open windows to the first circuit layer, coating the second dielectric layer of the first circuitry with a coating of photosensitive chemical solution, selectively imaging and developing the coating of photosensitive chemical solution to form a circuit pattern and an interconnect pattern and forming a conductor layer of circuitry an

Abstract: An additive process for producing printed wiring boards is taught. In the process metal substrates having desired hole patterns are powder coated with a dielectric material electrostatically. The dielectric powder coating is then fused on the metal substrate. Next, a continuous film of pre-catalyzed adhesive is applied to all surfaces; then a plating resist is applied to all areas on which copper is not desired. The exposed catalyzed adhesive is then activated and plated in an electroless copper bath.

Abstract: A fastener for cloth and similar materials is secured thereto by means of apparatus which includes an elongated member which is tempered in the form of a coil. Absent restraint the coil will move in a direction which is tangential to the envelope of the coil and carry therewith portions of the fastener and in cooperation with a base and a punch the members of the fastener are assembled.

Abstract: A method of making a multilayer board in which relatively thick ground and voltage planes are punched to form clearance holes. The planes are stacked with insulative layers, laminated and then drilled to produce through holes aligned with the clearance holes. The through holes are then plated-through. The method eliminates under-etch problems in thick ground and voltage planes which are capable of carrying high magnitudes of current.

Abstract: A method and apparatus for direct insertion into a substrate of terminals from a flexible carrier strip releasably supporting the terminals. The strip path of travel toward a terminal removal zone and from that zone is constrained to accomodate strip flexibility and travel without binding while preventing significant strip twisting and transverse and lateral excursion. A guide block assembly establishes that path of travel in first and second channel guide sections where the terminals are deflected strip portions are respectively guided by flanges. During terminal removal, resilient jaws aid in providing uniform deflection of these strip portions. Continuous tension tends to advance the strip, and escapement fingers control strip indexing. A ram assembly, operable after indexing to directly insert the terminal, includes selected gripping inserts cooperable with differently sized terminals.

Abstract: A releasable pull plug arranged for mounting inside the end of one of the pipes or conduits with the plug having clips for disengageably engaging the internal surface of one of the conduits and locking the plug against axial movement relative thereto. A line is attached to the plug and extends axially through the other conduit for exerting a pulling force thereon whereby the two conduits may be drawn together by pulling on the line. The plug is provided with fluid pressure actuated release means for disengaging the clips, and means are provided for applying pressurized fluid to the release means to thereby release the plug. Means are also provided which are operable in response to the activation of the release means for holding the locking means in the disengaged position independently of the fluid pressure, whereby the plug after release may be withdrawn through the other conduit by pulling on the line. The plug may include means for sealing the end of the conduit in which the plug is mounted.

Abstract: A printed circuit board is prepared by connecting electronic components to the circuit, coating the board with a layer up to about 0.1 mil thick of a compound of the formula C.sub.n F.sub.2n.sub.+1 C.sub.m X.sub.2m.CHY--OOC--C(R)=CH.sub.2 or its prepolymer, replacing at least one of the electronic components, thermally bonding another electronic component to the circuit, and recoating the area around the new component with a layer of the compound or its prepolymer. In the formula n is 2 to 9, m is 1 to 9, X and Y are H, F Cl, or Br and R is --H or --CH.sub.3. This method enables a printed circuit board to be easily repaired since the coating on the board can be soldered or welded through without first removing the coating or protecting the surrounding coating.

Abstract: A method and apparatus for end jointing timber members such as floor or ceiling joists by means of spiked timber connector plates, using apparatus incorporating equipment to position and hold the timber and automatically feed connector plates from cassettes or magazines holding a supply of connector plates onto magnetized pressing platens which then rotate to position the connector plates to span the joint to be made before passing the spikes into the relevant timber members.