Abstract: Disclosed is an all-air jack for lifting a vehicle, comprising: a frame assembly; a first bellow at an upper portion of the frame assembly; a second bellow at a lower portion of the frame assembly; an air bellow attachment plate positioned between the first and second bellows; an air supply with a first and second air tube, the first air tube in communication with the first bellows and the second air tube in communication with the second bellows; wherein inflation of the bellows raises the jack to lift the vehicle. The first and second air tubes and air supply are connectable by a 3-way air valve. Preferably, 120 psi of air is used to inflate the bellows.
Abstract: A compact multipurpose tool including a bit head, a hollow first cylinder that defines a plurality of open-end wrenches on one end, and a second cylinder that communicates with the bit head and can be at least partially housed within the hollow first cylinder. In further features the hollow first cylinder defines a socket on the end opposite the plurality of open-end wrenches and the second cylinder includes a plurality of sockets.
Abstract: Ten of pavilion main facets are formed with reference to the previously formed five of first pavilion main facets in which an initial first main facet is formed in a position centered on a line shifted approximately fifteen degrees from the ridge of the raw diamond on the pavilion side. Ten of pavilion main facets 19 radiate from the curette 18 and twenty of lower girdle facets are formed between the adjacent pavilion main facets on the pavilion side of the diamond 1.
Abstract: A sharpening apparatus (16) for a blade-like cutting implement. The sharpening apparatus has an elongate body (18) and a cutting edge extending widthwise across one end of the body (11) at a predetermined angle relative to the longitudinal axis of the body (11). The cutting edge is formed by an inclined face formed on one side face of the body. The apparatus includes a cradle (26) for holding a blade-like implement to be sharpened and a mounting body for mounting the cradle (26) relative to a grinding surface. The cradle is mounted on a pair of guide rails (22, 24) for movement along a rectilinear path, the cradle including first and second rail followers slidably connected to a first and second of the guide rails respectively. The cradle (26) includes a seat for locating the blade-like implement at a reselected reference position on the cradle (26) such that the cutting edge of the implement to be sharpened is located parallel to said rectilinear path.
Abstract: A wheel clamping assembly provides a frame having three arms, two fixed stops and a turnable cam. The arms are equally spaced and have holes to admit the stops and the cam. The stops have an extension eccentrically located upon the top of the cylinder. Then the cam has an involute, having an expanding radius, upon the top of the cam. In use, the stops are placed upon two arms and the cam is placed upon the remaining arm, all at the same radius. A wheel rim is positioned upon the stops and the cam. The cam is then turned to grasp the wheel. The stops and the cam are made of a non-marring material.
Abstract: The present invention features a reciprocating wire saw particularly adapted or configured for cutting hard materials. In one aspect, the reciprocating wire saw comprises (a) a flexible wire; (b) a plurality of cutting segments fittable onto the flexible wire, wherein each of the cutting segments comprises an outer surface; and a (c) plurality of superabrasive particles braze bonded onto the outer surface of the cutting segments to form a cutting wire. In another aspect, the reciprocating wire saw comprises a plurality of superabrasive particles braze bonded directly to the wire itself to form a cutting wire. The cutting wire is unique in that it comprises a pre-determined superabrasive particle concentration and is configured to cut various materials, such as granite, in a reciprocating manner.
Abstract: A device for torquing a tubular connection. The device comprises an upper assembly having an upper jaw member, a lower assembly having a lower jaw member, an upper gear for advancing the upper jaw member, and a lower gear for advancing the lower jaw member. The upper jaw member includes a first jaw operatively associated with a first rack, a second jaw operatively associated with a second rack, and a third jaw operatively associated with a third rack. The lower jaw member includes a fourth jaw operatively associated with a fourth rack, a fifth jaw operatively associated with a fifth rack, and a sixth jaw operatively associated with a sixth rack. A method of torquing a first tubular with a second tubular is also disclosed.
Abstract: In a polishing apparatus, a polishing tool including abrasive particles and a binder for bonding together the abrasive particles is pressed against a substrate to polish the substrate. The polishing apparatus has a light source for irradiating a polishing surface with light rays for weakening a bond force of the binder for bonding together the abrasive particles, and a waste matter removing mechanism for forcefully removing waste matter produced by polishing or waste matter produced by irradiation. By irradiating the polishing surface with the light rays, dressing of the polishing surface is performed, and products resulting from dressing and the like are removed. The polishing apparatus supplies abrasive particles to the polishing surface stably by dressing and allows high-speed polishing of the substrate.
Abstract: A method for producing a diamond includes forming a table lying in a table plane; forming crown facets that are oriented at an angle of between 26° and 35° relative to the table plane; forming upper pavilion (UP) facets below the crown facets at an angle of between 45° and 80° relative to a girdle plane lying between bottoms of the crown facets and tops of the UP facets; and forming a set of lower pavilion (LP) facets between bottoms of the UP facets and the culet at an angle of between 38° and 44° relative to the girdle plane. The UP and LP facets form a rib line positioned between one-fifth and four-fifths the distance between the girdle plane and the culet, such that the UP facets extend between 20% and 80% of the distance between the girdle plane and the culet.
Abstract: A wrench including a stem having a head section at one end of the stem and a polygonal socket formed in the head section for fitting onto a screwed member. A resilient ring is disposed at the head section and pivotally connected with a controlling switch pivotally disposed at the head section. By means of operating the controlling switch, the resilient ring is driven to expand or close. In the closed position, the resilient ring obstructs at least one inner angle of the socket to prevent the screwed member from detaching out of the socket and clamp the screwed member in the socket. In the expanded position, the resilient ring frees the inner angle, permitting the screwed member to freely pass through the socket.
Abstract: A carrier head for chemical mechanical polishing of a substrate having a front surface, a back surface and an edge. The carrier head has a base, an inner retaining ring positioned beneath the base, and an outer retaining ring surrounding the inner retaining ring to retain the inner retaining ring. The inner retaining ring has a main portion with a first surface to apply a load to a perimeter portion of the back surface of the substrate and an annular lower projection protruding downwardly from the main portion with a second surface to circumferentially surround the edge of the substrate to retain the substrate.
Abstract: An improved ratchet or gear wrench that has a built-in, non-slip, gripping clip mechanism for retaining a nut in the tool, which can either be applied to the nut or clamped out-of-the-way. This tool allows a nut to be tightened or loosened from a bolt or threaded stud more quickly and with one hand. To attain this, the present invention essentially comprises a spring-loaded curveshaped gripping clip, mounted near the boxed-end of a ratchet wrench, which wraps around the opening of the wrench. The spring action of the gripping clip allows it to be easily pulled away from the opening of the wrench and clamped in an out-of-the-way position by means of a clamp or released into a functional gripping position by pushing downward on the clamp's release button. When released, the gripping clip presses against a nut, thereby creating pressure that secures the nut in the opening of the wrench.
Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
Abstract: A device for honing blind bores in parts, a blind bore including a cylindrical bore open at one end and closed adjacent to the opposite end including a honing mandrel for mounting on a honing machine that produces rotation thereof, the mandrel having a cylindrical honing portion adjacent one end which portion and the adjacent portion of the mandrel have spaced axially extending slot therethrough to enable the honing portion of the mandrel to expand and contract in size, the honing portion having a portion adjacent to the end thereof which is somewhat larger than the rest of the honing portion when the honing portion is expanded for honing in the blind hole, the end portions of the mandrel between the spaced slots being elastically expandable from a retracted position which is less than the diameter of the surface to be honed to enable insertion therein to a more expanded condition wherein the diameter of the honing portion at the largest point is the diameter at which the mandrel will hone the blind hole.
March 3, 2003
Date of Patent:
August 24, 2004
Sunnen Products Company
Richard F. Moellenberg, Jr., John J. Schimweg, David M. Moehn
Abstract: A continuous CMP process for polishing multiple conductive and non-conductive layers on a semiconductor substrate. The continuous process comprises the steps of: (a) disposing a substrate on a platen; (b) polishing a first layer using both a mechanical means and a chemical means; and (c) polishing a second layer upon adjusting at least one parameter in either the mechanical means, chemical means, or both.
Abstract: A polishing head and a chemical mechanical polishing apparatus having the polishing head including a plate having vacuum holes for transferring vacuum pumping force; a porous film having holes corresponding to the vacuum holes and attached to a lower surface of the plate; a retainer ring attached to the lower surface of the plate at an edge portion thereof and having a sloped surface; a clamp ring attached to the lower surface of the plate adjacent the retainer ring for clamping the retainer ring; an adjusting ring having a sloped surface parallel and in contact with the sloped surface of the retainer ring, the adjusting ring being installed between the retainer ring and the plate; and a diameter adjusting device for adjusting a diameter of the adjusting ring by moving the adjusting ring along the sloped surface of the retainer ring, thereby adjusting a height of the retainer ring.
Abstract: The present invention provides a portable dental system for use in areas having inadequate sources of power, either for human or for veterinary dentistry. The system provides one or more handpieces, each driven driven by a pressurized nitrogen gas contained in a portable tank. A water reservoir is also provided for medicated water to be applied to the tooth site. The system has two channels to which either a conventional dental handpiece or an abrasive handpiece can be attached. When two abrasive handpieces are attached, two different abrasive materials may be used by the system, one material for cleaning and one material for cutting or abrading.
Abstract: A process of dry polishing molded or lathe cut intraocular lenses or like medical devices to removing flash, sharp edges and/or surface irregularities therefrom. The process includes gas and/or rotational tumbling of the intraocular lenses or like medical devices in a dry polishing media. The process is suitable for single piece and multipiece intraocular lenses of varying composition.
Abstract: A wafer carrier (300) for a CMP tool is adjustable to provide center fast to edge fast material removal from a semiconductor wafer. The wafer carrier (300) holds the semiconductor wafer without vacuum. The semiconductor wafer is held by a carrier ring (308). An elastically flexed wafer support structure (318) is a support surface for the semiconductor wafer. Elastically flexed wafer support structure (318) can be bowed outward or bowed inward in an infinite number of different contours. The semiconductor wafer conforms to the contour of the elastically flexed wafer support structure (318) when a down force is applied to the wafer carrier (300) during a polishing process. Changing the contour is used to produce different material removal rates across the radius of the semiconductor wafer to increase wafer planarity in a polishing process.
November 16, 2000
Date of Patent:
July 15, 2003
James F. Vanell, James A. Grootegoed, Laura John