Patents Examined by Joseph Jones
  • Patent number: 12217183
    Abstract: A control system is for a railway yard with railroad tracks. The control system may include RCLs and sets of railcars on the railroad tracks. The control system may include railyard sensors configured to generate railyard sensor data of the railroad tracks, and a server in communication with the RCLs and the railyard sensors. The server may be configured to generate a database associated with the sets of railcars based upon the railyard sensor data. The database may have, for each railcar, a railcar type value, a railcar logo image, and a vehicle classification value. The server may be configured to selectively control the RCLs to position the sets of railcars within the railroad tracks based upon the railyard sensor data.
    Type: Grant
    Filed: May 31, 2024
    Date of Patent: February 4, 2025
    Assignee: All Terminal Services, LLC
    Inventors: Mark D. Mills, Matthew Michael McDermott, Jorge A. Perez Rincon, Carson Rentz, Edwin Victor Gendron, Dakoda Jarrard Sanders
  • Patent number: 12209622
    Abstract: An assembly for connecting two drive sides of a drive train of a rail vehicle includes a first drive side having a disc-shaped first coupling body at one end, a second drive side having a disc-shaped second coupling body at one end and a disc-shaped intermediate body disposed between the first coupling body and the second coupling body. The intermediate body is coupled to both the first coupling body and the second coupling body in such a way that a rotational movement of one of the two drive sides is transmitted to the other drive side through the coupled body.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: January 28, 2025
    Assignee: Siemens Mobility GmbH
    Inventor: Martin Zaech
  • Patent number: 6100112
    Abstract: A bump-attached tape carrier for mounting a semiconductor chip on a circuit substrate, the bump-attached tape carrier comprising, an insulating film, a conductor pattern formed on the insulating film, and metal bumps formed on the conductor pattern and adapted to be bonded with the semiconductor chip, wherein the metal bumps are respectively formed of a columnar body having a side wall substantially perpendicular to the conductor pattern.
    Type: Grant
    Filed: October 6, 1998
    Date of Patent: August 8, 2000
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Toshiaki Amano, Toshiaki Asada, Masakazu Hamada