Abstract: A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorganic ingredient may be further added with a manganese oxide or a heat resistant insulating material such as ceramics and/or glass.

Abstract: A resistance paste for the manufacture of a resistor body, for example, by silk-screening and the resistance body manufactured herewith, which paste comprises a mixture of Pb.sub.2 Rh.sub.x Ru.sub.2-x O.sub.7-y, a permanent binder and a temporary firable binder. In the formula 0.15.ltoreq.x.ltoreq.0.95 and 0.ltoreq.y.ltoreq.1/2. The resulting resistor body in the temperature range from -55.degree. to +150.degree. C. has a temperature coefficient of the resistance between -10.times.10.sup.-6 /.degree.C. and +10.times.10.sup.-6 /.degree.C. and is very stable. The resistance variation during the life of the resistor is smaller than .+-.0.5%.

Abstract: Thermoplastic compositions comprising a polycarbonate resin, a graft copolymer and conductive particles are provided suitable for the preparation of molded articles characterized in that they provide an improved level of EMI shielding.