Patents Examined by Josephine Baer
  • Thick film copper conductor inks
    Patent number: 4880567
    Abstract: Improved copper conductor inks useful in the fabrication of multilevel circuits are disclosed. The inks comprise copper powder, a devitrifying glass frit selected from a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit and mixtures thereof, an adhesion promoting oxide, and a suitable organic vehicle. These inks are particularly adapted for applications where superior adhesion between the copper conductor ink and the underlying substrate or dielectric film is required.
    Type: Grant
    Filed: December 9, 1988
    Date of Patent: November 14, 1989
    Assignee: General Electric Company
    Inventors: Ashok N. Prabhu, Kenneth W. Hang, Edward J. Conlon