Patents Examined by Joshel Rivera
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Patent number: 12381083Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a first imaging device provided at the first holder and configured to image the second substrate held by the second holder; a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged; a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged. Each of the first light irradiating device and the second light irradiating device is connected to a first light source configured to irradiate white light.Type: GrantFiled: April 28, 2022Date of Patent: August 5, 2025Assignee: TOKYO ELECTRON LIMITEDInventors: Toshifumi Inamasu, Shinichi Shinozuka
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Patent number: 12378449Abstract: A composite material comprising at least two substrates onto which a layer of an intumescent composition is set therebetween, the composition comprising a mixture of following individual constituents: from 5 weight % to 70 wt % of at least one carbon source, from 0 weight % to 50 wt % of at least one acid source, and from 5 weight % to 50 wt % of least one expanding agent, the total being 100 wt %, wherein the intumescent composition is active at an intumescent predetermined temperature of from 120° C. to 450° C., the intumescent temperature being less than the degradation temperature of the at least two substrates. Also a use of the intumescent composition for disassembling, at an intumescent predetermined temperature of from 120° C. to 450° C., a composite material comprising at least two substrates onto which a layer of the intumescent composition is set therebetween.Type: GrantFiled: April 28, 2021Date of Patent: August 5, 2025Assignee: Luxembourg Institute of Science and Technology (LIST)Inventors: Abdelghani Laachachi, Nicolas Burger, Gregory Mertz, David Ruch
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Patent number: 12358702Abstract: Recyclable films having at least a first layer containing a high-density polyethylene and a nucleating agent, a second layer containing a high-density polyethylene and a third layer containing a high-density polyethylene and a nucleating agent may be used for thermoforming packaging components. The film structure is advantageous as it can be more easily thermoformed that traditional high-density polyethylene films and can maintain the shape taken during thermoforming, exhibiting minimal warping or shrinking.Type: GrantFiled: August 21, 2019Date of Patent: July 15, 2025Assignee: Amcor Flexibles North America, IncInventors: Michael D. Priscal, Jacob A Lasee
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Patent number: 12351511Abstract: Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the thin film of the metal oxide.Type: GrantFiled: December 21, 2018Date of Patent: July 8, 2025Assignees: iSABers Japan Co., Ltd., Tadatomo SUGAInventors: Tadatomo Suga, Yoshiie Matsumoto
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Patent number: 12337546Abstract: A system for consolidating materials, comprising a sonotrode configured to direct ultrasonic energy into materials to be consolidated, wherein the materials to be consolidated have both a glass transition temperature and a melting temperature; a non-rigid consolidating material in proximity to the sonotrode, wherein the non-rigid consolidating material and sonotrode define a region therebetween for receiving the materials to be consolidated, and wherein the non-rigid consolidating material has a glass transition temperature that is higher than the glass transition temperature of the materials to be consolidated and a melting temperature that is higher than the melting temperature of the materials to be consolidated.Type: GrantFiled: August 18, 2022Date of Patent: June 24, 2025Assignee: Agile Ultrasonics Corp.Inventors: Matthew A. Short, James Stratton
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Patent number: 12337571Abstract: The present disclosure provides a fuel-impermeable structural unit for use as a structural element of a fuel tank, including a multi-plies structure made of one or more composite material and polymers, and, a sealing polymeric film structurally bonded to and coating the entire surface of at least one face of the multi-plied structure. The polymeric film is integrated with an underlying external layer of said multi-plies structure, is impermeable to the fuel, is not reactive with the fuel, and can bind to an adhesive for fixing one or more rigid elements thereto.Type: GrantFiled: March 16, 2021Date of Patent: June 24, 2025Assignee: ISRAEL AEROSPACE INDUSTRIES LTD.Inventors: Herman Leibovich, Liron Yechiel, Rachel Blaut, Enbal Luster, Ofir Katz, Eilon Rubin
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Patent number: 12327712Abstract: A high voltage power supply apparatus includes a high voltage direct current voltage source, a power switch configured to apply an output of the high voltage direct current voltage source to process equipment, and a sensing circuit unit including a sensor unit including a sensor and at least one operational amplifier, a reference voltage detection unit connected to a node between the sensor and the at least one operational amplifier, and a digital signal processing unit, wherein the sensing circuit unit is connected to an output terminal through which an output of the high voltage direct current voltage source is applied to the process equipment.Type: GrantFiled: September 1, 2022Date of Patent: June 10, 2025Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jihwan Kim, Hyunbae Kim, Hongseung Cho, Seungbo Shim, Sungyeol Kim
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Patent number: 12312515Abstract: The present invention refers to a sprayable hot melt adhesive composition based on olefin block copolymers and ethylene-octene copolymers, being its final form of supply pellets. More particularly, this invention refers to a hot melt adhesive composition which find utility in manufacturing nonwoven disposable articles such as diapers and feminine care products. The hot melt adhesive composition of the present invention is particularly useful in construction applications, where rheological behaviour, adhesion and flexibility are desired.Type: GrantFiled: March 9, 2023Date of Patent: May 27, 2025Assignee: COLQUÍMICA-INDÚSTRIA NACIONAL DE COLAS, S.A.Inventors: Cristina Isabel Fernandes Frutuoso, Ana Paula Da Silva Coutinho
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Patent number: 12311610Abstract: The invention relates to a method for operating an ultrasonic welding machine. During a welding process, a flat material is continuously moved through a gap formed between a sonotrode (1), which is vibrated at an ultrasonic frequency with a welding amplitude, and an anvil (2) at a welding speed while a welding force is exerted onto the flat material by the anvil (2) and/or the sonotrode (1). The invention is characterised in that during a welding phase, the ACTUAL temperature of the flat material is measured after the flat material has passed through the gap, the ACTUAL temperature is compared with a predetermined TARGET temperature, and the welding amplitude is varied on the basis of the comparison result.Type: GrantFiled: November 16, 2021Date of Patent: May 27, 2025Assignee: HERRMANN ULTRASCHALLTECHNIK GMBH & CO. KGInventors: Micha Augenstein, Sven Roessler
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Patent number: 12296569Abstract: A substrate laminating apparatus includes: a first holding mechanism configured to hold a first substrate; a second holding mechanism configured to hold a second substrate and change a distance between the first substrate and the second substrate; a load detecting mechanism configured to detect a load originated from a surface tension acting between the first substrate and the second substrate; and a driving mechanism configured to control a distance between the first substrate and the second substrate based on a detection value of the load detecting mechanism.Type: GrantFiled: May 22, 2023Date of Patent: May 13, 2025Assignee: OLYMPUS CORPORATIONInventor: Masashi Honda
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Patent number: 12297004Abstract: An apparatus for applying a label to a spool or reel containing wire and a wire tail extending from the spool or reel, the apparatus comprising a wire tail sensor, wherein the wire tail sensor identifies the location of the wire tail protruding from the spool or reel and a label application mechanism, wherein the labeling mechanism applies a label to the spool or reel and wherein the label does not contact the wire tail protruding from the spool or reel.Type: GrantFiled: April 17, 2024Date of Patent: May 13, 2025Assignee: Encore Wire CorporationInventors: William T. Bigbee, Jr., Clifton S. Thompson
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Patent number: 12297144Abstract: Methods, apparatus and systems are described that relate to in-situ and in-process assembly of segmented optical component with high accuracy. One example method for assembling an optical component with multiple segments includes positioning the multiple segments to an initial state conforming to an alignment or positioning requirement, measuring positions of the multiple segments at the initial state, initiating a fusing process to fuse the multiple segments of the optical element together, measuring the positions of the multiple segments after commencement of the fusing process, and determining whether a change in the positions of the multiple segments has occurred that causes a deviation from the initial state. Upon a determination that the deviation is not within a tolerance value, the method includes adjusting a position of at least one of the multiple segments to maintain the deviation within the tolerance value.Type: GrantFiled: August 17, 2021Date of Patent: May 13, 2025Assignee: Arizona Board of Regents on Behalf of the University of ArizonaInventors: Dae Wook Kim, Heejoo Choi, Marcos Esparza
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Patent number: 12296565Abstract: A plant for laminating cardboard, and in particular corrugated cardboard, by an adhesive plastics film, is provided. The plant has a supply station configured to supply a succession of single rough cardboard sheets in a feeding direction, an application station arranged in the sheet feeding direction and having an application roller configured to unwrap and apply the adhesive plastics film to a rough cardboard sheet so that the adhesive plastics film adheres to each rough cardboard sheet of the succession of rough cardboard sheets to form a succession of coated cardboard sheets and to advance each coated cardboard sheet of the succession of coated cardboard sheets in the feeding direction. A method for laminating cardboard, and in particular corrugated cardboard, using an adhesive plastics film is also provided.Type: GrantFiled: February 15, 2021Date of Patent: May 13, 2025Assignee: TECNOMAC S.R.L.Inventors: Stefano Monfredini, Giuseppe Tornetti
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Patent number: 12280579Abstract: A sheet processing apparatus including a sheet feeder, a sheet processing device, a sheet ejection device, a purge unit, a multifeed sensor, a sheet sensor, and circuitry. The circuitry stops an operation of the sheet processing apparatus when the multifeed sensor has not detected multifeed of the sheet and the sheet sensor does not detect a trailing end of the sheet after a first set time from detection of a leading end of the sheet, stop the operation when the multifeed sensor has detected the multifeed and the sheet sensor does not detect the trailing end of the sheet after a second set time from the detection, and conveys the sheet toward the purge unit without stopping the operation when the multifeed sensor has detected the multifeed and the sheet sensor detects the trailing end of the sheet before the second set time elapses from the detection.Type: GrantFiled: February 14, 2023Date of Patent: April 22, 2025Assignee: Ricoh Company, LTD.Inventors: Akira Kunieda, Satoshi Kuno, Hirofumi Horita, Koju Kawakami, Yasunobu Kidoura, Ryohsuke Akaishi, Yohsuke Haraguchi
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Patent number: 12269203Abstract: An arrangement for mending a pipe, particularly a waste water pipe, which arrangement comprises the following elements: a first textile hose (ALg) woven in a single piece preferably laminated on the outer wall thereof, a felt hose (FS) arranged in the interior of the first textile hose (ALg) and wetted with a curable synthetic resin mixture, and a second textile hose (ALs), woven in a single piece and coated on its outer wall with a release agent, preferably silicon, not adhering to the synthetic resin mixture, for introduction into the felt hose (FS). A method for mending a pipe, particularly a waste water pipe, preferably uses the arrangement described.Type: GrantFiled: May 7, 2020Date of Patent: April 8, 2025Assignee: GLOBAL SAFETY TEXTILES GMBHInventor: Ergül Ballikaya
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Patent number: 12267920Abstract: A method of fabricating a thin film heater includes providing a heating element supported on a surface of a flexible dielectric backing film; and attaching a layer of heat shrink film onto the surface of the dielectric backing film so as to at least partially enclose the heating element between the heat shrink film and the dielectric backing film. The method provides a much more precise and consistent method of assembling the heater assembly and improves the thermal properties and heat transfer to a heating chamber.Type: GrantFiled: August 28, 2020Date of Patent: April 1, 2025Assignee: JT International S.A.Inventors: Tony Reevell, Yingxu Zhang
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Patent number: 12266454Abstract: A hot pressing machine for continuously hot pressing a flexible flat cable includes a plurality of hot pressing units arranged at intervals along a feeding direction of the flexible flat cable. A central controller of the machine is operably connected to the plurality of hot pressing units and is configured to control the plurality of hot pressing units to synchronously hot press the flexible flat cable located in the plurality of hot pressing units.Type: GrantFiled: April 26, 2022Date of Patent: April 1, 2025Assignees: Tyco Electronics (Shanghai) Co., Ltd., TE Connectivity Solutions GmbHInventors: Zhonghua Xu, Dandan (Emily) Zhang, Roberto Francisco-Yi Lu, Jian Cao, Lvhai (Samuel) Hu
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Patent number: 12257757Abstract: A device may generate a multi-layer stack of sheets that may be adhered into a slab-shaped preform for thermal drawing. The sheets may include sublayers. Stacking the sub-layered sheets results in accumulation of layers in the final fabricated preform. The stacking process may use mechanical translation and conveyance to support placement of the sheets and fabrication of the stack.Type: GrantFiled: May 15, 2020Date of Patent: March 25, 2025Assignee: EVERIX INC.Inventors: Esmaeil Banaei, Justin Boga
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Patent number: 12257758Abstract: A die has an inner die that has a straight portion of circular columnar outer shape and a convergent tapered portion provided closer to an extrusion port side than the straight portion and an outer die that houses the inner die. A first supply passage connecting a first valve and a flow passage, a second supply passage connecting a second valve and the flow passage, and a third supply passage connecting a third valve and the flow passage are provided inside the die. Downstream side end portions of the first supply passage and the second supply passage are connected to a portion of the flow passage formed between the straight portion and the outer die and a downstream side end portion of the third supply passage is connected to a portion of the flow passage formed between the tapered portion and the outer die.Type: GrantFiled: January 30, 2023Date of Patent: March 25, 2025Assignee: PLA GIKEN CO., LTD.Inventor: Yoshiharu Kikuzawa
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Patent number: 12258497Abstract: An object of this invention is to provide an adhesive composition that comprises a moisture-curable resin and a modified polyolefin and that achieves an excellent liquid state and excellent adhesion to polyolefin resin substrates. Provided is a moisture-curable adhesive resin composition comprising a moisture-curable resin (A) and a modified polyolefin resin (B), wherein the content of the modified polyolefin resin (B) is 2 parts by mass or more per 100 parts by mass of the moisture-curable resin (A).Type: GrantFiled: December 24, 2020Date of Patent: March 25, 2025Assignee: TOYOBO MC CORPORATIONInventors: Hideyuki Sakata, Kenji Kashihara