Abstract: A first light receiving element according to an embodiment of the present disclosure includes a plurality of pixels, a photoelectric converter that is provided as a layer common to the plurality of pixels, and contains a compound semiconductor material, and a first electrode layer that is provided between the plurality of pixels on light incident surface side of the photoelectric converter, and has a light-shielding property.

Abstract: A display device includes a pixel portion in which a pixel is arranged in a matrix, the pixel including an inverted staggered thin film transistor having a combination of at least two kinds of oxide semiconductor layers with different amounts of oxygen and having a channel protective layer over a semiconductor layer to be a channel formation region overlapping a gate electrode layer and a pixel electrode layer electrically connected to the inverted staggered thin film transistor. In the periphery of the pixel portion in this display device, a pad portion including a conductive layer made of the same material as the pixel electrode layer is provided. In addition, the conductive layer is electrically connected to a common electrode layer formed on a counter substrate.

Abstract: Methods of exposing conductive vias of semiconductor devices may involve positioning a barrier material over conductive vias extending from a backside surface of a substrate to at least substantially conform to the conductive vias. A self-planarizing isolation material may be positioned on a side of the barrier material opposing the substrate. An exposed surface of the self-planarizing isolation material may be at least substantially planar. A portion of the self-planarizing isolation material, a portion of the barrier material, and a portion of at least some of the conductive vias may be removed to expose each of the conductive vias. Removal may be stopped after exposing at least one laterally extending portion of the barrier material proximate the substrate.

Abstract: An integrated circuit includes a substrate with an active area, a first insulating layer, a second insulating layer, and a phase-change material. The integrated circuit further includes a heating element in an L-shape, with a long side in direct physical contact with the phase-change material and a short side in direct physical contact with a via. The heating element is surrounded by first, second, and third insulating spacers, with the first insulating spacer having a planar first sidewall in contact with the long side of the heating element, a convex second sidewall, and a planar bottom face in contact with the short side of the heating element. The second and third insulating spacers are in direct contact with the first insulating spacer and the long side of the heating element.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor. The image sensor includes a first semiconductor substrate having a photodetector and a floating diffusion node. A transfer gate is disposed over the first semiconductor substrate, where the transfer gate is at least partially disposed between opposite sides of the photodetector. A second semiconductor substrate is vertically spaced from the first semiconductor substrate, where the second semiconductor substrate comprises a first surface and a second surface opposite the first surface. A readout transistor is disposed on the second semiconductor substrate, where the second surface is disposed between the transfer gate and a gate of the readout transistor. A first conductive contact is electrically coupled to the transfer gate and extending vertically from the transfer gate through both the first surface and the second surface.

Abstract: A semiconductor light emitting device includes a light emitting structure in the form of a rod, including a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, and having a first surface, a second surface opposing the first surface, and a side surface connecting the first and second surfaces; a regrowth semiconductor layer surrounding an entire side surface of the light emitting structure and having a first thickness in a first position along a perimeter of the side surface and a second thickness, different from the first thickness, in a second position along a perimeter of the side surface; a first electrode on the first surface of the light emitting structure and connected to the first conductivity-type semiconductor layer; and a second electrode on the second surface of the light emitting structure and connected to the second conductivity-type semiconductor layer.

Abstract: A semiconductor device includes: a fin that is a portion of a semiconductor substrate, protrudes from a main surface of the semiconductor substrate, has a width in a first direction, and extends in a second direction; a control gate electrode that is arranged on the fin via a first gate insulating film and extends in the first direction; and a memory gate electrode that is arranged on the fin via a second gate insulating film and extends in the first direction. Further, a width of the fin in a region in which the memory gate electrode is arranged via the second gate insulating film having a film thickness larger than the first gate insulating film is smaller than a width of the fin in a region in which the control gate electrode is arranged via the first gate insulating film.

Abstract: An integrated circuit includes two N wells from two different devices in close proximity to each other with each N well biased by two different terminals. The N wells are at least partially surrounded by P type regions that are biased by a terminal. The integrated circuit includes conductivity reduction features that increase the resistivity of current paths to a P type regions of one device on a side closest the other device. The integrated circuit includes two conductive tie biasing structures each located directly over an N type region of the substrate and directly over a P type region of the substrate. The two conductive tie biasing structures are not electrically connected to each other and are not electrically coupled to each other by a conductive biasing structure.

Abstract: A light emitting element includes a first electrode, a hole transport region on the first electrode, an emission layer on the hole transport region and containing a light emitting polymer compound derived from a mixture of a polyphenylene vinylene-based compound having a weight average molecular weight of about 1.3×106 to about 1.6×106 and an organic compound represented by Formula 1, and a second electrode on the emission layer, wherein, the mixture contains the polyphenylene vinylene-based compound and the organic compound in a molar ratio of about 9:1 to about 8:2, and the light emitting element may thus include an emission layer having improved flexibility and strength.

Abstract: A semiconductor device includes a first lower line and a second lower line on a substrate, the first and second lower lines extending in a first direction, being adjacent to each other, and being spaced apart along a second direction, orthogonal the first direction, an airgap between the first and second lower lines and spaced therefrom along the second direction, a first insulating spacer on a side wall of the first lower line facing the second lower line, wherein a distance from the first airgap to the first lower line along the second direction is equal to or greater than an overlay specification of a design rule of the semiconductor device, and a second insulating spacer between the airgap and the second lower line.

Abstract: Disclosed are three-dimensional semiconductor memory devices and methods of detecting electrical failure thereof. The three-dimensional semiconductor memory device includes a substrate with a first conductivity including a cell array region and an extension region having different threshold voltages from each other, a stack structure on the substrate and including stacked electrodes, an electrical vertical channel penetrating the stack structure on the cell array region, and a dummy vertical channel penetrating the stack structure on the extension region. The substrate comprises a pocket well having the first conductivity and provided with the stack structure thereon, and a deep well surrounding the pocket well and having a second conductivity opposite to the first conductivity.

Abstract: The present application provides a semiconductor device with an edge-protecting spacer over a bonding pad. The semiconductor device includes a bonding pad disposed over a semiconductor substrate; a first spacer disposed over a top surface of the bonding pad; a dielectric liner disposed between the first spacer and the bonding pad; a dielectric layer between the bonding pad and the semiconductor substrate, wherein the dielectric layer includes silicon-rich oxide; and a conductive bump disposed over the bonding pad and covering the first spacer and the dielectric liner, wherein the conductive bump is electrically connected to a source/drain (S/D) region in the semiconductor substrate through the bonding pad.

Abstract: A primary part for a linear motor, a linear motor comprising such primary part, and a method for manufacturing such primary part. The primary part comprises a housing, a pre-casted unit having at least two coils which are mutually fixed in position by a solidified first casting material, a plurality of spacer elements disposed between the pre-casted unit and the housing, the plurality of spacer elements contacting the housing and ensuring a space between the housing and the pre-casted unit, and a solidified second casting material filling the space between the housing and the pre-casted unit. The solidified second casting material ensures a fixed connection of the housing to the pre-casted unit.

Abstract: A core segment linked body when opened out rectilinearly is configured: such that a distance between adjacent width reduced portions is greater than a width dimension of width expanded portions when adjacent core segments are in an expanded position, and the distance between the adjacent width reduced portions is less than the width dimension of the width expanded portions when the adjacent core segments are in a contracted position; and so as to satisfy (te?tn)/?s?>0, and 0<(te?tn)/te?0.27, where ?s? is a distance between center lines of the adjacent magnetic pole teeth in the expanded position, te is a width dimension of tooth main portions, and tn is the width dimension of the width reduced portions.

Abstract: A synchronous electric motor for operating a pump includes a motor body, a stator and a rotor coupled to an impeller of the pump. The motor also comprises a cylindrical element that extends towards the inside of the motor body from one of its outer walls so as to define a first cylindrical cavity open to the outside to insert inside the rotor, wherein the rotor has a circular cross section essentially corresponding to the inner section of the cylindrical element so that the rotor is in contact with the cylindrical element and then there is a friction between the rotor and the cylindrical element when the rotor rotates, and the rotor is shaftless and axially and directly coupled to the impeller of the pump.

Abstract: A material of the stator core is different from a material of the housings, in a state where one end portion in the axis direction of the stator core is contacted to the first housing, and the other end portion in the axis direction of the stator core is contacted to the second housing; and a neighboring portion of a contact portion, at which the first housing is contacted to the stator core, and another neighboring portion of a contact portion, at which the second housing is contacted to the stator core, are connected by a connecting component in the axis direction, of which material is the same as a material of the stator core, whereby the first housing and the second housing are connected each other; and the first housing and the second housing face each other in a state where a gap intervenes between both housings.

Abstract: A brushless motor includes: a columnar rotor including magnets; a stator including at its center a space for placing the rotor; a housing member that houses the rotor and the stator; and a detector that detects a signal dependent on a rotational position of the rotor based on variation in a magnetic field associated with a rotation of the rotor. The housing member includes a front bell that supports a portion of the rotating shaft of the rotor and a housing body that supports another portion of the rotating shaft of the rotor. The front bell includes a mount fitted with the detector. The mount projects from the base toward an end face of the rotor.

Abstract: The present invention relates to a power generation system using a vehicle. The power generation system includes: a vehicle, such as an automobile, a train, an airplane, and an escalator, for carrying people or freight; a movement route, such as a road, a railroad, and a runway, formed so that the vehicle can move thereon; and a power generation unit including a magnetic force generation portion and a magnetic force receiving portion alternatively installed in the vehicle and the movement route, and configured to generate electric energy using electromagnetic induction occurring due to relative movement between the magnetic force generation portion and the magnetic force receiving portion according to movement of the vehicle.

Abstract: Apparatus for connecting a motor controller to an electrical motor, said apparatus comprising: a motor interface board; a mounting mechanism for mechanically connecting said motor interface board to the electrical motor; at least one input lead for electrically connecting said motor interface board to at least one of an electrical power source and an electrical signal source; at least one output lead for electrically connecting said motor interface board to the electrical motor; and at least one connector for mechanically and electrically connecting said motor interface board to the motor controller.

Abstract: A magnet-embedded rotor includes a cylindrical rotor core that rotates together with a rotating shaft; and permanent magnets embedded in the rotor core. The rotor core includes core members, and each core member includes a tubular portion into which the rotating shaft is inserted and projecting portions formed to project in a radial direction of the tubular portion from an outer periphery of the tubular portion and arranged apart from each other in a circumferential direction of the tubular portion. The rotor core is formed by assembling the core members such that the tubular portions are arranged on one straight line and the projecting portion of the core member and the projecting portion of the other core member are adjacent to each other in a circumferential direction of the rotor core. The permanent magnet is embedded in each projecting portion of each core member.