Abstract: A multi-bit screwdriver comprises a housing with a bit chuck at the front end and bit assemblies retained within the housing. Each bit assembly has a tool bit at a front end and a contact surface at a back end. An actuator extends from each bit assembly for operative engagement by a user, for movement of the actuator and bit assembly between a forwardly extended in-use configuration whereat the bit assembly is positioned such that the tool bit extends outwardly from the housing, and the contact surface of the bit assembly is disposed in longitudinal force transmitting engagement against an abutment surface to preclude rearward movement of the bit assembly due to substantially longitudinally directed forces transmitted from the tool bit, and a retracted configuration whereat the contact surface of the bit assembly is removed in a lateral direction from the longitudinal force transmitting engagement with the abutment surface.

Abstract: A throwing wheel assembly including a rotatable wheel and one or more throwing blades each removably positionable on the face of the wheel in a throwing position, the throwing blades having holding structures projecting therefrom and the improvement comprising one or more retainers which are removably positionable in a recess provided in the wheel face and which and are adapted for removably receiving and retaining the blade holding structures.

Abstract: A selective Damascene chemical mechanical polishing (CMP) technique is used to planarize a semiconductor device to remove surface topography. The semiconductor device includes a semiconductor layer formed on a substrate, an insulating layer formed over the semiconductor layer and patterned to expose a portion of the semiconductor layer, a barrier layer formed over the insulating layer and the exposed portion of the semiconductor layer, and an electrically conductive layer formed over the barrier layer. The semiconductor device is pressed against a first rotating polishing pad that has no embedded abrasive particles to remove a portion of the conductive layer that overlies both the barrier layer and the insulating layer. The semiconductor device is then pressed against a second rotating polishing pad that has embedded abrasive particles to expose a portion of the barrier layer that overlies the insulating layer.

Abstract: A method for rejoining yarn in an open-end spinning machine in which the rejoining is effected by feeding intact fibres to the rotor but preceding the rejoining by an operation in which the sliver is cleared and the carder is cleaned by the high-vacuum suction nozzle brought into correspondence with the air intake port.