Patents Examined by Jospeh L. Schofer
  • Patent number: 5827911
    Abstract: Colored thermoplastic resin composition comprising a transparent thermoplastic resin and a black dye contained therein, wherein said black dye is a black dye obtained by reaction of at least one anionic surfactant selected from the group consisting of(a) sulfuric acid ester-series surfactants,(b) phosphoric acid ester-series surfactants,(c) sulfonic acid-series surfactants and(d) carboxylic acid-series surfactants, and nigrosine.
    Type: Grant
    Filed: April 22, 1997
    Date of Patent: October 27, 1998
    Assignee: Orient Chemical Industries, Ltd.
    Inventors: Akihiko Hayashi, Masataka Nishikawa
  • Patent number: 5656705
    Abstract: Inherently tacky infusible pressure-sensitive adhesive microspheres prepared by suspension polymerization of at least one water insoluble alkyl acrylate ester, the improvement which comprises conducting the polymerization in the presence of a buffer provided in an amount sufficient to maintain pH between 6 to 9.5 and in the presence of a surfactant to stabilize the product.
    Type: Grant
    Filed: November 2, 1994
    Date of Patent: August 12, 1997
    Assignee: Avery Dennison Corporation
    Inventors: Prakash Mallya, Colin C. Smith
  • Patent number: 5262501
    Abstract: Mixtures essentially comprising compounds of formula I or II ##STR1## wherein X is a hydrogen atom or vinyl, A is a divalent aromatic radical which is unsubstituted or substituted by one or more C.sub.1 -C.sub.20 alkyl groups, halogen atoms or halogen-substituted C.sub.1 -C.sub.20 alkyl groups, R.sub.1, R.sub.1 ', R.sub.2, R.sub.2 ', R.sub.3 and R.sub.3 ' are each a hydrogen atom, or R.sub.1 and R.sub.1 ', R.sub.2 and R.sub.2 ' and R.sub.3 and R.sub.3 ' are each together ethylene, R.sub.4 is C.sub.1 -C.sub.6 alkyl, phenylalkyl containing 1 to 6 carbon atoms in the alkyl moiety or is trialkylsilyl containing 1 to 6 carbon atoms in each alkyl moiety, m is 0, 1 or 2, n is 0 or an average number from 1 to 200, p is an average number from 1 to 100 and q is 0 or an average number from 1 to 100, can be cured by heating and are suitable for making laminates, especially for fabricating copper-clad circuit boards.
    Type: Grant
    Filed: May 12, 1992
    Date of Patent: November 16, 1993
    Assignee: Ciga-Geigy Corporation
    Inventors: Sheik Abdul-Cader Zahir, Cecile Pasquier, Wolfgang Scharf, Maurice Dupre
  • Patent number: 5231115
    Abstract: The invention concerns preparation of porous copolymer beads by a seeded polymerization process employing gel copolymer seed particles. The process comprises initially providing a plurality of gel-type copolymer seed particles prepared by polymerization of at least one first monovinylidene monomer and a first cross-linking monomer. A second monomer mixture comprising at least one second monovinylidene monomer, a second cross-linking monomer, and a phase-separating diluent is thereafter imbibed by the seed particles and polymerized therein. The process is characterized by selecting the first monovinylidene monomers such that the phase-separating diluent and second monovinylidene monomers are capable of being imbibed by the seed particles in an amount sufficient to form a porous copolymer. The porous copolymer beads produced have stable polymeric structures and good physical properties that render them useful in preparing ion-exchange resins and polymeric adsorbents.
    Type: Grant
    Filed: December 19, 1991
    Date of Patent: July 27, 1993
    Assignee: The Dow Chemical Company
    Inventor: William I. Harris