Patents Examined by Jossef Zilberman
  • Patent number: 7370408
    Abstract: A terminal applicator (50) for attaching electrical terminals (52) to a wire includes a terminal hold down device (90) for limiting movement of the terminal during the crimping process. The hold down device (90) includes a hold down arm (92), a pair of guide rods (102), and a removable standoff (130). The guide rods (102) are carried by a reciprocating ram (68) and are arranged so that when the standoff abuts a travel limit block (148) the hold down arm remains in close proximity to the terminal while the ram (68) continues its motion to complete the crimping cycle.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: May 13, 2008
    Assignee: Tyco Electronics Corporation
    Inventors: Neil Edward Deming, David Joseph Erb, Trevis Lee Benchoff
  • Patent number: 7367108
    Abstract: A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which (at least one contact member) a plurality of contact members that contact(s) the flying leads and apply (applies) the ultrasonic vibration thereto are (is) rotatably supported.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: May 6, 2008
    Assignee: Fujitsu Limited
    Inventors: Takashi Kubota, Kenji Kobae, Kimio Nakamura
  • Patent number: 7363703
    Abstract: A sleeve-fitter includes a sleeve module, a fitting module, a control and a base module. The fitting module and control are part of the base module. In operation, a centering pin and a round hole cooperate when the sleeve module is in contact with the base module and the sleeve module can be separated from the base module by a lever. The sleeve module includes a sleeve container with a drum, a filling funnel with a cover, a support for accommodating sleeve-specific machine parts and/or tools, and a feeder rail arranged on a linear vibratory feeder. A drive arranged on the base module imparts rotational movement to the drum which then feeds sleeves onto the feeder rail. This sleeve-fitter results in short retooling times and therefore short downtimes.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: April 29, 2008
    Assignee: Komax Holding AG
    Inventor: Peter Imgrüt
  • Patent number: 7353591
    Abstract: A method for manufacturing coreless substrates is provided herein. The method first provides a base whose top and bottom sides are covered with metal layers respectively that are detachable from the base. From the two metal layers, the method then develops the bump-pad side or ball side wiring layers required by the coreless substrate simultaneously. The two metal layers along with their respective wiring layers are then separated from the base into two independent semi-products of the coreless substrate. The method then develops from the other sides of the two semi-products the laminate side wiring layers required by the coreless substrate.
    Type: Grant
    Filed: April 18, 2006
    Date of Patent: April 8, 2008
    Assignee: Kinsus Interconnect Technology Corp.
    Inventor: Tso-Hung Yeh
  • Patent number: 7343655
    Abstract: A method of fabricating a micro electromechanical switch on a substrate comprising piezoelectric layers, metal electrodes alternated with the layers and contact pads. Cross voltages are applied to the electrodes, in order to obtain an S-shaped deformation of the switch and allow contact between the contact pads. Additionally, a further electrode can be provided on a substrate where the switch is fabricated, to allow an additional electrostatic effect during movement of the piezoelectric layers to obtain contact between the contact pads. The overall dimensions of the switch are very small and the required actuation voltage is very low, when compared to existing switches.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: March 18, 2008
    Assignee: HRL Laboratories, LLC
    Inventor: Sarabjit Mehta
  • Patent number: 7340830
    Abstract: A method of manufacturing LED light string includes the steps of forming an LED light body from multiple serially connected printed circuit boards, fixing the LED light body to a base, and connecting a light-transmissible shell to the light body to form a cluster lamp; preparing a power cord, to which multiple lamp sockets are serially connected; fitting multiple cluster lamps to the lamp sockets on the power cord, so that the LED light bodies are made to emit light. A lampshade is detachably engaged with each lamp socket. The lampshade and the lamp socket may be differently designed to create romantic feeling. The number of LED light bodies on each cluster lamp and the number of cluster lamps on one LED light string may be varied as desired to increase the brightness of the light string while reduce the manufacturing cost of the LED light string.
    Type: Grant
    Filed: October 28, 2003
    Date of Patent: March 11, 2008
    Inventors: Li-Wen Liu, Wei-Jen Liu