Patents Examined by Jpseph J. Hail, III
  • Polishing pad having a grooved pattern for use in chemical mechanical polishing
    Patent number: 6645061
    Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
    Type: Grant
    Filed: November 16, 1999
    Date of Patent: November 11, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Doyle E. Bennett, Thomas H. Osterheld, Fred C. Redeker, Ginetto Addiego