Abstract: A method for estimating the temperature of a steel product including a calibration step wherein the intensities at 5 wavelengths ranging from 0.9 to 2.1 ?m are recorded for several measurement condition and spectral attenuation coefficients are computed, a measurement step wherein the intensities at said 5 wavelengths are recorded and spectral attenuation coefficients are computed for several temperatures and a comparison step wherein a probability test is performed to estimate the steel product temperature.

Abstract: A room operating unit (ROU) which is integral part of a HVAC system has an operating unit providing different functionalities, a device terminal and an analog sensor unit including an electrical circuit for determining room temperature. Depending on the construction of the device, self-heating effects caused by the heat generating components of the device may affect the result of the temperature measurement, i.e., the ambient temperature of the sensor unit may be higher than room temperature. Therefore, the sensor unit comprises a compensation circuit for correcting the temperature output by the sensor unit by eliminating self-heating effects.

Abstract: A system for calculating a temperature of a fluid inside a pipe by using a heat flux, an outer surface temperature of the pipe, and a flow velocity of the fluid includes a flow meter to measure the flow velocity of the fluid flowing inside the pipe, a heat flux meter to measure the heat flux passing through an outer surface of the pipe, a thermometer to measure the outer surface temperature of the pipe, and a calculator configured to calculate an internal fluid temperature, which is the temperature of the fluid flowing inside the pipe, by using the flow velocity of the fluid measured by the flow meter, the heat flux measured by the heat flux meter, and the outer surface temperature of the pipe measured by the thermometer.

Abstract: A temperature measurement and a method for measuring the temperature of a semiconductor substrate, or semiconductor substrate, of a power switch assembly, which is delay free. The power switch assembly includes a circuit and a printed circuit board (PCB), where the circuit is mounted to the PCB. A lead frame is part of the circuit, at least one semiconductor substrate is part of the circuit and mounted to the lead frame, and a sensor is part of the circuit and mounted to the lead frame. A chamber is located between the sensor and the semiconductor substrate, such that the chamber galvanically isolates the sensor from the semiconductor substrate. The sensor detects the temperature of the semiconductor substrate.

Abstract: The present invention relates to a method and a system for determining a series of at least two temperature values of a molten metal bath with a device comprising an optical cored wire and a detector. The method according to the invention has been proven to be especially suitable for multiple repeated measurements, wherein a final end temperature of the molten metal bath shall be reached.

Abstract: In an embodiment is provided a method for measuring a vapor-liquid transition of a substance, the method including introducing a substance into a sample cell of a calorimetric block of a differential scanning calorimeter (DSC) at a first initial pressure, the system volume being constant; maintaining the substance in a vapor phase; cooling the substance at a cooling rate; and generating a thermogram. In another embodiment is provided a method for measuring a vapor-liquid transition of a substance, the method including introducing a substance into a sample cell of a calorimetric block of a DSC at a first initial pressure, the system volume being constant; maintaining the substance in a liquid phase; heating the substance at a heating rate; and generating a thermogram. In another embodiment is provided a method for measuring a vapor-liquid transition of a substance in the presence of an adsorbent.

Abstract: A power module. The power module includes a substrate and at least one power transistor arranged on a bottom side of the substrate. The power module includes at least one power connection connected to the substrate. A conductor loop for measuring temperature is arranged on an inner or outer substrate layer or a top side opposite the power transistor.

Abstract: Provided is a sensor element capable of obtaining a wide sensing region, suppressing unevenness of a temperature distribution in the sensing region, and obtaining substantially constant sensor sensitivity. A sensor element according to the present invention includes: a base; a temperature-sensitive film formed on an entire surface of the base and having an electric resistance value that changes due to a change in temperature; and wiring members connected to both ends of the temperature-sensitive film. The temperature-sensitive film includes connection regions connected to the wiring members and a pattern extending from each of the connection regions toward a center of the base, and a cross-sectional area of the pattern is smaller on the connection region sides than at the center of the base.

Abstract: Provided are a temperature sensor that performs high-speed sensing, whose cost is low, and whose layout is freely designed, the temperature sensor eliminating the need for complicated operations, and a method for manufacturing the temperature sensor. In a temperature sensor 1, terminal portions 9 of a connector portion 7 are exposed to an outside of a pipe section 2, a connector-side embedded portion 8 of the connector portion 7 is embedded in an embedding portion 4 of a side wall portion 3, an exposed portion 12 of a housing portion 11 is disposed in the pipe section 2, and an embedded base 13 of the housing portion 11 is embedded in the embedding portion 4. The housing portion 11 is made of a metal.

Abstract: A system and method provide on-line, wafer-level, die-level, or package-level thermal calibration of an integrated measurement resistor with a single temperature insertion. The system includes a measurement resistor integrated on a substrate with an unknown temperature coefficient and a temperature reference sensor thermally coupled to the measurement resistor. A measurement circuit measures an indication of a resistance of the measurement resistor. An electrically-controllable integrated heat source is operated by a controller to change a temperature of the measurement resistor and the temperature reference sensor and stores values of the resistance indication and the sensed temperature corresponding to multiple temperatures of the temperature of the measurement resistor and the temperature reference sensor.

Abstract: A wiring component with physical quantity sensor is provided with an electric wire, a physical quantity sensor to detect a physical quantity of the electric wire, a holding member that is composed of a molded body covering a portion in a longitudinal direction of the electric wire and has a holding hole to house the physical quantity sensor, and an attachment member attached to the holding member. The physical quantity sensor is prevented from coming out of the holding hole by the attachment member.

Abstract: There is provided a radiation temperature measurement device that accurately measures a temperature of an object being measured, and that includes two infrared detection units that detect mutually different infrared wavelength bands, a spectral characteristics data storage unit that stores spectral characteristics data showing a transmittance and a reflectance of each of the objects being measured, and a temperature calculation unit that, based on infrared ray quantities detected by each of the two infrared detection units, and on the transmittance and reflectance of each of the objects being measured, calculates the temperature of each of the objects being measured.

Abstract: An optical sensor includes a support layer, a thermoelectric conversion material portion including a first material layer and a second material layer, and a light-absorbing film. The first material layer includes a first region and a second region overlapping the light-absorbing film. The second material layer includes a third region and a fourth region overlapping the light-absorbing film. The thermoelectric conversion material portion includes transition regions electrically connecting the first region and the third region, and the second region and the fourth region, respectively, and including a halogen.

Abstract: Each of heat quantity measurement apparatuses 20a to 20c includes a snow receiving plate 22 configured that falling snow piles up thereon, a heater device 25 configured to heat the snow receiving plate until a temperature of the snow receiving plate 22 becomes predetermined target temperature exceeding 0 degrees Celsius, and a heat flux density measurement apparatus (24a to 24d) configured to measure heat flux density transmitted from below to the snow receiving plate 22. A piling snow depth measurement apparatus 14 measures a piling snow depth of snow piling up at a first location 13. A control apparatus 15 computes a quantity of heat spent to melt the snow falling on the snow receiving plate 22, and estimates a piling snow depth at second locations 12a to 12d, based on the computed quantity of heat and the piling snow depth measured by the piling snow depth measurement apparatus 14.

Abstract: A temperature-sensing device configured to monitor a temperature is disclosed. The temperature-sensing device includes: a first capacitor comprising a first oxide layer with a first thickness; a second capacitor comprising a second oxide layer with a second thickness, wherein the second thickness of the second oxide layer is different from the first thickness of the first oxide layer; and a control logic circuit, coupled to the first and second capacitors, and configured to determine whether the monitored temperature is equal to or greater than a threshold temperature based on whether at least one of the first and second oxide layers breaks down.

Abstract: The present invention generally relates to devices, systems, and methods for detecting and measuring the radiant power and emissivity of nonthermal far infrared radiation (FIR) in 3-16 ?m wavelength spectrum from the surface of a FIR-photons emitting object and, more specifically, in 8-14 ?m wavelength range.

Abstract: A temperature sensing device and a calibration method of the temperature sensing device are provided. Based on different conditions, the temperature sensing device generates a first digital sensing value and a second digital sensing value corresponding to an ambient temperature. The temperature sensing device generates a first sensing result value according to the first digital sensing value, a first compensation value, and a sensing difference value between the first digital sensing value and the second digital sensing value, and generates a second sensing result value according to the second digital sensing value, a second compensation value, and the sensing difference value. The temperature sensing device obtains an error from the first sensing result value and the second sensing result value according to a first reference value and a second reference value. The temperature sensing device calibrates the first compensation value according to the error.

Abstract: A method of operating a temperature calibrator for calibrating a temperature sensor having a calibration block into which the temperature sensor is introduced and having a heating means by which the calibration block is heated and having a cooling unit by which the calibration block is cooled and an actuator by which the cooling unit is brought into thermal conductivity contact with the calibration block during cooling and is spatially separated from the calibration block during heating while forming an air gap. The invention further relates to a temperature calibrator is also disclosed.

Abstract: The present disclosure relates to an apparatus of measuring a temperature of a battery cell, which may measure temperature values at a plurality of locations through a plurality of temperature sensors arranged at the locations below a water-cooled battery cell module, and thus may identify a temperature difference between an upper portion and a lower portion of a battery cell, which is not visually identified, as well as all temperature values at all locations below the battery cell.

Abstract: A digital temperature sensor includes a current generation circuit, an oscillation circuit, a conversion circuit and a calculation circuit. The current generation circuit generates a proportional to absolute temperature (PTAT) current and a complementary to absolute temperature (CTAT) current. The oscillation circuit generates a first clock signal having a first cyclic period based on the PTAT current and generates a second clock signal having a second cyclic period based on the CTAT current. The conversion circuit generates a first temperature code based on the first clock signal such that the first temperature code decreases as the operation temperature increases and generates a second temperature code based on the second clock signal such that the second temperature code increases as the operation temperature increases. The calculation circuit calculates a difference between the first temperature code and the second temperature code and generates a corrected temperature code based on the difference.