Abstract: A method of soldering wherein a component or components to be soldered, such as a printed circuit board and soldered preforms, are immersed in a vapor bath to melt the solder, following which the components are withdrawn from the vapor bath. In the method according to the invention, the vapor bath is composed predominantly of perfluorotetradecahydrophenanthrene (C.sub.14 F.sub.24).
Type:
Grant
Filed:
April 30, 1984
Date of Patent:
October 29, 1985
Assignee:
I.S.C. Chemicals Limited
Inventors:
Colin R. Sargent, Keith Brierley, David E. M. Wotton, Paul L. Coe