Patents Examined by K Vijayakumar
  • Electroless gold plated electronic components and method of producing the same
    Patent number: 6533849
    Abstract: An neutral electroless gold plating method that minimises “black band” corrosion problem in the final product. The electroless gold plating solution is provided at neutral pH in the presence of a reducing agent, a complexing agent and an accelerator to allow a gold layer of the desired thickness to be plated under manufacturing conditions The gold layer produced thereof has good bondability and solderability.
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: March 18, 2003
    Assignee: Gul Technologies Singapore LTD
    Inventor: Jing Li Fang