Patents Examined by Kaan Nguyen
  • Method of covering a flower pot having bonding material thereon
    Patent number: 5704108
    Abstract: A sheet of material is formed about a flower pot having a bonding material thereon to provide a decorative cover. A portion of the sheet extending above the pot may be crimped. The crimped portion may be formed by way of a drawstring or ribbon or by way of reinforcing members in the sheet of material or by way of a shrinkable material formed in the sheet of material for example.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: January 6, 1998
    Assignee: Southpac Trust International, Inc.
    Inventor: Donald E. Weder