Abstract: An anisotropically electroconductive connection body, in which two elements, each having electrodes on a confronting face, are connected with each other. The connection body is made up of a connecting material containing an adhesive component constituted mainly of a thermosetting resin, the connecting material being interposed between the two elements to be connected, and an extraneous portion of the connecting material protruding from the periphery of one of the elements on the other one of the elements, wherein the degree of hardening of the thermosetting resin in the connecting material in the extraneous portion is at least 60%.

Abstract: The module including an aluminum-based metal substrate (10) and at least one copper-based bar (12) constituting an equipotential connection which is fixed to the substrate via an insulating layer. A power component (16) is in direct contact with the bar via a surface area that is smaller than the area of the insulating layer. A printed circuit card (18) mounted on the bar(s) and projecting therefrom carries low heat-dissipation components of the module.