Abstract: Aqueous dispersion containing a silicon-aluminum mixed oxide powder, the powder containing 0.1 to 99.9 wt. % Al2O3 and Si—O—Al-bonds. The dispersion can be produced using dispersing and/or grinding devices which a achieve an energy input of at least 200 KJ/m3. The dispersion can be used for the chemical-mechanical polishing of semiconductor substrates.
Type:
Grant
Filed:
February 21, 2002
Date of Patent:
January 30, 2007
Assignee:
Degussa AG
Inventors:
Frank Menzel, Wolfgang Lortz, Helmut Mangold