Abstract: A laminated sheet allows circuit boards to be fabricated without any special equipment. The laminated sheet can be printed using an ordinary laser printer on a personal computer. The sheet has a conductive layer, such as copper, attached to a nonconductive flexible substrate, such as Kapton. The outer surface of the copper is coated with an ink which provides a receiving surface for toner when the laminated sheet is fed through a printer. The other side of the flexible substrate is attached to a removable layer of paper which provides support for the laminated sheet during the printing process. The paper is removed after printing and the adhesive which held the paper is used to attach the flexible substrate to a rigid substrate. Alcohol is used to remove the ink and expose the copper for etching. The alcohol does not remove the toner which acts as a mask during the etching process. The toner is removed after board fabrication.

Abstract: This invention relates to polymer film or foam coatings for the covers of absorbent articles. More particularly, this invention relates to absorbent products and processes for making in situ foamed polymer coatings which give an opaque, soft, dry and clean-appearing water-permeable cover to absorbent products such as sanitary napkins, diapers and the like.

Abstract: A unitary micro-flexure structure and a method of making the same, wherein the structure takes the form of an elongate dielectric flexure body having a mounting end and a free end, and which is adapted for cantilevered disposition, wherein the body takes a form which is constructed entirely from thin-film deposition and patterning processes involving the deposition of a metal oxide, and further wherein the body has a topography which is at least partially determined by etch-removable boundary-defining structure.

Abstract: A printed wiring board comprising a preflux film of a benzimidazole copper complex, wherein the benzimidazole copper complex is formed by (i) applying a preflux to the printed wiring board and (ii) performing an oxidizing treatment of the preflux coated wiring board sufficient to form a benzimidazole copper complex wherein said complex is substantially free of free imidazole groups from the benzimidazole preflux.

Abstract: An electromagnetic wave shielding building material is disclosed, the building material comprising an electrically conductive concrete which has electromagnetic wave shielding properties and comprises a hydraulic inorganic material and carbon fibers of 0.6-3% by weight. It is possible to easily produce the building material having good electromagnetic wave shielding functions at low cost.

Abstract: A process is disclosed for the solid phase preparation of triaxially oriented synthetic polymeric material from an orientable amorphous but crystallizable or a semicrystalline thermoplastic polymeric workpiece comprising (a) presenting the conditioned workpiece, at the entry mode of an opposing pair of solid rollers that are spaced apart a distance substantially less than the thickness of the workpiece; and (b) deforming the workpiece by compressive passage through the paired rollers at a nominal deformation ratios of at least 2 to 1. The deformation drawing is carried out between the glass transition temperature and the melting point of the polymeric material, by applying a draw tension insufficient to cause tensile failure of the workpiece. Also disclosed is a rolltruded copolymer membrane or film-like material with a triaxial orientation morphology with a periodicity consisting essentially of crystallite and amorphous materials or a periodic distribution or crystalline and intercrystalline tie regions.

Abstract: Disclosed is an ultra-thick thick film of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate. A substrate of suitable thickness is chosen to dissipate heat in the vertical or z-direction underneath a heat generating component such as a semiconductor chip. The ultra-thick films have a thickness ranging from about 2 to about 5 mils and are prepared from metal powders having average particles sizes ranging from about 1 micron to 3 microns.

Abstract: Smearing of indicia (30,36) or deterioration of a label may be eliminated in a label form that provides protection for the imaging (30,36) in a construction that includes a sheet of transparent face stock (12), a layer of transparent pressure sensitive adhesive (14) on one side of the stock sheet (12) and a sheet of transparent release liner (10) releasably adhered to the one side of the face stock sheet (12) by the adhesive (14). A die cut (18) is located in the release liner sheet (10) and defines a first removable frame section (20) and a second label defining section (22). The first section (20) surrounds the second section (22) so that when removed, a pattern of the adhesive (14) will be exposed. Reverse image printing (30) is disposed on the release liner second section (22).

Abstract: A circuit board including a circuit pattern adhered firmly to a ceramic substrate and capable of eliminating an increase in resistivity due to an influence of an external environment, particularly, a thermal influence is disclosed. The circuit board comprises a ceramic substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a bonding layer comprising Ti and at least one element selected from the group consisting of N and O, a conductor layer consisting essentially of Cu, and a protective layer comprising Ti and at least one element selected from the group consisting of N and O are stacked in the order named.

Abstract: Thin film metal interconnects employed in integrated circuit structures have a width, L, and a spatial separation or spacing, S, according to the following characteristics: interconnect width, L.gtoreq.0.1 .mu.m; interconnect spatial separation, S.gtoreq.0.2 .mu.m, interconnect thickness, T.sub.A1 .ltoreq.2L .mu.m; and interlayer insulating film thickness, T.sub.I .ltoreq.2L .mu.m. More particularly, the layout is characterized by having the ranges of 0.1.ltoreq.L.ltoreq.0.8 .mu.m and 0.2 .mu.m.ltoreq.S.ltoreq.1 .mu.m. As a result, IC signal switching speed is optimized for IC's designed in the submicron integration scale regime.

Abstract: Disclosed is a polymeric product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Also disclosed is an organic polymeric dielectric composite of organic polymeric films, as polyimide films, dispersed in and reinforcing the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Further disclosed is an electronic circuit package that is adapted to receive at least one microelectronic circuit chip, with at least one layer having a substrate of an organic polymeric dielectric composite of organic polymeric films and the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane.

Abstract: A sheet-like, foldable material is provided by laminating a very thin film-like veneer of material wood veneer to a thin backing material of paper or plastic by use of a bonding material which does not harden and can therefor be stretched and folded without causing rupture of the fibers of the wood veneer.

Abstract: An arrangement for protection of electrical equipment from electrical overstress pulses or transients using an electrical coupling to ground through a non-linear resistance having a high resistance at normal voltages and a very low resistance in response to an excessively high voltage pulse of transient, wherein the non-liner resistance is interposed between two contraposed faces of two electrodes, and at least one of said electrodes is a thin planar element whose said face is a thin edge of the planar element.

Abstract: A multilayer ceramic substrate having improved mechanical and electrical properties and suitable for use to form a hybrid integrated circuit and a process for the manufacture thereof. The multilayer ceramic substrate has at least one layer of a first conductor based on a refractory metal as an internal conductor layer and at least one layer of a Cu-based second conductor as a surface conductor layer, wherein the second conductor layer is connected to the first conductor layer through a metallic layer formed by coating with a metalloorganics paste containing one or more metals selected from the group consisting of Pt, Pd, Ni, Cu, Au, Rh, Ru, Re, Co, and Ir followed by firing in an inert or reducing atmosphere.

Abstract: The sealing strip has a main part (1') with a first sealing lip (6) for making sealing contact with a pane (7) or a filling element. The pane (7) is placed against the sealing lip (6) during assembly and rests on the top (10) of a lip (9'). A recess (13') is provided in a bridge (4') in the body of the sealing strip. The foot or base (16') is a second part (2'), which carries a second sealing lip (15') in contact with the other side of the pan (7'), fits into the recess. When the foot (16') is inserted into the recess (13'), the two sealing lips (6'15') are elastically deformed and pressed against the pane (7'). The inserted foot has a groove (19, 22) at one end in which a rib (14') engages. The foot (16') and hence the part ( 2') are thus firmly anchored in the main part (1').

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

Abstract: A hybrid substrate comprises an aluminum-based ceramic base substrate and a silicon layer provided on the base substrate.