Patents Examined by Kamand Caneo
  • Circuit board for semiconductor package
    Patent number: 6469258
    Abstract: A circuit board for semiconductor package is designed to provide a complete grounding with corresponding equipment in the manufacture of the semiconductor package based on a circuit board, thereby preventing a breakdown of the circuit board or semiconductor chip caused by electrostatic charges.
    Type: Grant
    Filed: August 23, 2000
    Date of Patent: October 22, 2002
    Assignees: Amkor Technology, Inc., Amkor Technology Korea, Inc.
    Inventors: Choon Heung Lee, Won Dai Shin, Chang Hoon Ko, Won Sun Shin, Seon Goo Lee, Won Kyun Lee, Tae Hoan Jang, Jun Young Yang