Patents Examined by Kamand Cunio
  • Substrate for electronic packaging, pin jig fixture
    Patent number: 6448510
    Abstract: A substrate for electronic packaging, the substrate having a discrete, generally prismatoid, initially electrically conductive valve metal solid body with one or more spaced apart, original valve metal vias each individually electrically islolated by a porous oxidized body portion therearound. A pin jig fixture for mechanically masking a metal surface, the pin jig fixture having an anodization resistant bed of pins each pin having a leading end surface for intimate juxtaposition against a metal surface to mask portions thereof.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: September 10, 2002
    Assignee: Micro Components Ltd.
    Inventors: Shimon Neftin, Uri Mirsky
  • LSI package with equal length transmission Lines
    Patent number: 6235997
    Abstract: An LSI package including an area for mounting an LSI device thereon and a plurality of lines for connecting the LSI device and external terminals. At least two of the plurality of lines, in which differential signals are transmitted and are adjacent to each other in the LSI package, have equal lengths.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: May 22, 2001
    Assignee: Fujitsu Limited
    Inventors: Kenji Asada, Yoshihiko Ikemoto, Toshio Hamano