Abstract: A pneumatic radial ply runflat tire (200) has a tread (210), belt structure (212), a carcass (216), and an underlay (234) disposed between the belt structure and the carcass. The carcass (216) comprises two sidewalls (226), two beads (220), and one or more radial plies (222,224). The tire (200) is characterized by the underlay (234) having reinforcement cords (236) with turns aligned parallel to the tire's equatorial plane, the cords (236) exhibiting negligible modulus of elasticity (“modulus”) below a threshold elongation and high modulus above the threshold elongation. The underlay (234) stiffens the tire during runflat operation but not during normal inflated operation.
February 24, 2000
Date of Patent:
April 16, 2002
The Goodyear Tire & Rubber Company
Frank Philpott, Laurent Colantonio, Gia Van Nguyen, Alain Emile Francois Roesgen
Abstract: A radial ply pneumatic tire 30 has a unique cross sectional profile. The tires rum flange width W is greater than the tread width TW and the maximum section width SW is located radially less than 50% of the section height SH as measured from the nominal rim diameter ND.
Abstract: An embodiment of the present invention provides a method for improving the tensile strength of foundry cores and molds. More particularly, an embodiment of the present invention provides an improved binder for foundry cores and molds that include a fluoride bearing acid in combination with an inorganic silicon compound. Alternately, the improved binder may include a fluoride bearing acid in combination with a boron compound. In a preferred embodiment, a modified part 1 binder component includes a combination of hydrofluoric acid and an inorganic silicon compound.
December 8, 1999
Date of Patent:
April 2, 2002
Borden Chemical, Inc.
Robert A. Laitar, Brian K. Teeter, Kwok-tuen Tse, Leonid S. Zaretskiy
Abstract: A water-absorbing resin having superior water absorption properties, and a method for manufacturing the water-absorbing resin having superior water absorption properties in a short time, in which used waste materials are used for effective utilization of resources. To this end, a high-molecular material containing acrylonitrile, styrene and conjugated dienes as constituent units are processed with acid and/or alkali.
Abstract: This invention relates to fire retardant latex binders for non-woven fabrics. Non-woven fabrics can be manufactured using the fire retardant latex binder formulations of this invention using cotton fibers, polyester fibers, rayon fibers, nylon fibers, cellulosic fibers, fiber glass or various mixtures of such fibers. The fire retardant latex binders of this invention are particularly useful in manufacturing fiber glass furnace filters. The fire retardant latex binders of this invention are comprised of (1) water, (2) a styrene-butadiene rubber, (3) a fatty acid soap, (4) a sulfonate surfactant, (5) an ethylene oxide/propylene oxide/ethylene oxide triblock polymer, wherein the ethylene oxide/propylene oxide/ethylene oxide triblock polymer has a number average molecular weight of at least 8000, and (6) about 10 phr to about 50 phr of diammonium phosphate.
Abstract: A nanocomposite composition is disclosed which comprises clay and an effective amount of a benzoxazine monomer, oligomer, and/or polymer. In one embodiment, the presence of the benzoxazine monomer, oligomer, and/or polymer in the clay results in an at least about 5% increase in the spacing between the platelets of the clay. In another embodiment, the presence of the presence of the benzoxazine monomer, oligomer, and/or polymer in the clay results in at least about 5 wt. % of the clay being exfoliated. Also disclosed are a method for making (1) an intercalated nanocomposite clay composition which comprises clay and an effective amount of a benzoxazine monomer, oligomer, and/or polymer; (2) an exfoliated nanocomposite clay composition which comprises clay and an effective amount of a benzoxazine monomer, oligomer, and/or polymer; and (3) a method for making a nanocomposite clay composition that is both exfoliated and intercalated.
Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.