Abstract: This invention relates to the sphere of plasma electrolyte oxide coating of aluminium alloys. The method incorporates anode-cathode oxide coating in an alkaline electrolyte at a temperature of 15-50° C., using 50-60 Hz frequency alternating current. In the initial stage of the process oxide coating is carried on for 5-90 seconds at a current density of 160-180 A/dm2, then the current density is dropped to 3-30 A/dm2 and the process is continued in a regimen of spontaneous diminution of power demand without on-line adjustment of the regimen until the set coating thickness is achieved. The alkaline electrolyte used is an aqueous solution of alkaline metal hydroxide at 1-5 g/l, an alkaline metal silicate at 2-15 g/l, an alkaline metal pyrophosphate at 2-20 g/l and peroxide compounds at 2-7 g/l (in terms of H2O2—30%).

Abstract: A basket, for use in the reduction of UO2 to uranium metal and in the electrorefining of uranium metal, having a continuous annulus between inner and outer perforated cylindrical walls, with a screen adjacent to each wall. A substantially solid bottom and top plate enclose the continuous annulus defining a fuel bed. A plurality of scrapers are mounted adjacent to the outer wall extending longitudinally thereof, and there is a mechanism enabling the basket to be transported remotely.

Abstract: A metal substrate such as bare or anodized aluminum or an aluminum alloy having an inorganic white paint thermal control coating on the substrate, the coating having low solar absorptance and high infrared emittance, such as a potassium silicate binder having zinc oxide particles distributed therein, and a fluoropolymer topcoat such as polytetrafluoroethylene on the inorganic white coating, the topcoat having substantially no significant effect on the optical properties of the thermal control coating and having substantial adhesion to such coating and improved resistance to darkening under ultraviolet exposure in the outer space environment.

Abstract: A barrier electrode for the treatment of surfaces of electronically conductive or non-conductive materials with medium frequency electric discharges and a barrier electrode arrangement with one or more such barrier electrodes, wherein the barrier electrode is constructed as a tube of dielectric material with two ducts extending parallel to each other in the longitudinal direction of the tube. The duct which in the position of use faces the counter electrode is provided with a high voltage conductor and the other duct serves for supplying a temperature-influencing medium or a process gas.

Abstract: An electrochemical deposition system comprising a fixture adapted to selectively grasp and release an electrochemical process cell is provided. The system may include a lift/lower mechanism coupled to the fixture and adapted to automatically stop lowering the fixture at a process cell elevation, a rotation mechanism coupled to the fixture and adapted to automatically stop rotating the fixture when aligned with a process cell location and when aligned with a process cell exchange location. The fixture adapted to selectively grasp and release an object to be lifted may include a cam/follower coupling between a rotatable portion of the fixture and a gripping portion of the fixture. To grasp a process cell with the fixture, the rotating portion of the fixture may be rotated so as to retract the gripping portion of the fixture causing the gripping portion to close around the process cell.

Abstract: A method of manufacturing a semiconductor component includes depositing a first electrically conductive layer (675) over a substrate (270), forming a patterned plating mask (673) over the first electrically conductive layer, coupling a first plating electrode (250) to the first electrically conductive layer without puncturing the plating mask, and plating a second electrically conductive layer onto portions of the first electrically conductive layer. A plating tool for the manufacturing method includes an inner weir (220) located within an outer weir (210), an elastic member (230) over a rim (211) of the outer weir, a pressure ring (240) located over the rim of the outer weir and the elastic member, and a plurality of cathode contacts (250, 251, 252, 253) located between the pressure ring and the outer weir. The substrate is positioned between the elastic member and the pressure ring.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.

Abstract: An apparatus 245 and method are provided for electrochemically etching grooves 235 in an inner surface 215 of a hub 160 to form at least one fluid dynamic bearing. The apparatus 245 includes a cathode 250 having an electrically conductive substrate 270 with an outer surface 275 that corresponds to the inner surface 215 of the hub 160. The outer surface 275 has raised lands 280 corresponding to areas in which the grooves 235 are to be formed in the inner surface 215 of the hub 160. A layer of electrically insulating material 285 covers the outer surface 275 of the substrate 270 between the raised lands 280 to reduce etching of the inner surface 215 of the hub 160 in corresponding areas.

Abstract: An electrochemical machining process is monitored by embedding an ultrasonic sensor in an electrochemical machining tool to provide a tool assembly, placing the tool assembly in a spatial relationship with a workpiece, disposing an electrolytic fluid at least in a gap between the tool and the workpiece, connecting the tool and the workpiece to an electrical power source, generating an acoustic wave from the ultrasonic sensor to propagate through the electrolytic fluid to the workpiece and reflect back from the workpiece, and, based on the propagation and reception of the acoustic wave, calculating measurement of at least the size of the gap or the thickness of the workpiece.

Abstract: An apparatus and procedure for performing microfabrication of detailed metal structures by electroforming metal deposits within small cavities. Two primary areas of application are: the LIGA process which manufactures complex three-dimensional metal parts and the damascene process used for electroplating line and via interconnections of microelectronic devices. A porous electrode held in contact or in close proximity with a plating substrate or mold top to ensure one-dimensional and uniform current flow into all mold cavities is used. Electrolyte is pumped over the exposed surface of the porous electrode to ensure uniform ion concentrations at this external surface. The porous electrode prevents electrolyte circulation within individual mold cavities, avoiding preferential enhancement of ion transport in cavities having favorable geometries.

Abstract: This invention relates to devices for separating oxygen from more complex gasses such as air which contains oxygen, and delivering the separated-oxygen at an elevated pressure for use immediately, or for storage and use later. More particularly, the invention relates to solid state electrochemical devices for separating oxygen from more complex gasses to produce the desired oxygen and delivering the oxygen at elevated pressures up to and exceeding 2000 psig.

Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

Abstract: A modular solvent extraction plant for extracting metal from a metal are is provided. It includes a stage-wise, plug flow contactor that mixes an aqueous solution and an organic solvent solution into a mixed emulsion, a reactor to further mix the solutions, a separator for breaking up the emulsion into an aqueous solution and an organic solution, and a loaded organic coalescer that removes aqueous entrainment. It may also include a raffinate coalescer that removes organic entrainment, a second stage-wise, plug flow contactor that mixes an electrolyte solution with the organic solution from the loaded organic coalescer to form a second mixed emulsion, a second reactor, a second separator for breaking up the second emulsion, and an electrolyte coalescer. An organic scrub station may be used in place of the loaded organic coalescer. The contactors, reactors, separators, and coalescers can be mounted on movable structures.

Abstract: Precise control of deposition or etching of thin films on a transparent substrate is particularly useful for electroformation of nozzles and formation control. A computer based measuring system is used to measure, in real time, a test feature such as one such nozzle. The rate of material deposition and removal is controlled based on the measured value of the test feature. In particular, a video camera and microscope are used to produce images of the test feature. During the electroplating process, metal is plated onto a conductive layer, and as the plated metal layer grows up from the conductive layer of the mandrel, the plated layer can also encroach on transparent openings produced by the absence of the mandrel conductive layer. The amount of encroachment on the transparent openings is directly related to the thickness of the plated layer.

Abstract: An electro-kinetic electro-static air conditioner includes a mechanism to clean the wire-like electrodes in the first electrode array. A length of flexible MYLAR type sheet material projects from the base of the second electrode array towards and beyond the first electrode array. The distal end of each sheet includes a slit that engages a corresponding wire-like electrode. As a user moves the second electrode array up or down within the conditioner housing, friction between slit edges and the wire-like electrode cleans the electrode surface. Another embodiment includes a bead-like member having a through opening or channel, through which the wire-like electrode passes. As the conditioner is turned upside down and rightside up, friction between the opening in the bead-like member and wire-like electrode cleans the electrode surface.

Abstract: The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, ie., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.

Abstract: A process of making an electric current rectifying device using spatially coupled bipolar electrochemical deposition includes (a) placing at least two electrically conductive substrates, which may be a source of electrically conductive material, or a separate source of electrically conductive material, together with at least one semiconductor into an environment capable of conducting electricity and containing electrodes; (b) aligning the substrates and the semiconductor with respect to the electrodes such that the electrodes are not in contact with the substrates or the semiconductor and such that the material will form a conductive structure between and in contact with the substrates and the semiconductor when an electric field is applied between the electrodes; (c) to form a first electrically conductive structure between and in contact with a first of the substrates and the semiconductor; (d) reversing the polarity of the voltage to form a second electrically conductive structure.

Abstract: A method for electroplating copper in trenches, including the steps of providing a semiconductor substrate having a trench formed therein and electrolytically depositing a first copper containing layer having an upper surface and a predetermined thickness within the trench. The first copper deposition step has a first ratio of brighteners concentration:levelers concentration. Then a second copper containing layer having an upper surface and a predetermined thickness is electrolytically deposited over the first copper containing layer. The second copper deposition step has a second ratio of brighteners concentration:levelers concentration that is less than the said first ratio of brighteners concentration:levelers concentration. The second copper containing layer upper surface having a greater planarity than the first copper containing layer upper surface due to an increased concentration of levelers relative to the brighteners in the electrolytic bath.

Abstract: The invention is a method for the fabrication of an imprint tool master. The process begins with a metallic substrate. A layer of photoresist is placed onto the metallic substrate and a image pattern mask is then aligned to the mask. The mask pattern has opaque portions that block exposure light and “open” or transparent portions which transmit exposure light. The photoresist layer is then exposed to light transmitted through the “open” portions of the first image pattern mask and the mask is then removed. A second layer of photoresist then can be placed onto the first photoresist layer and a second image pattern mask may be placed on the second layer of photoresist. The second layer of photoresist is exposed to light, as before, and the second mask removed. The photoresist layers are developed simultaneously to produce a multi-level master mandrel upon which a conductive film is formed. A tool master can now be formed onto the conductive film.

Abstract: The present invention provides an electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis and supplying a plating electric current to the work. Thus, a uniform plated film can be formed on both of the outer and inner surfaces of the work having the hole communicating with the outside such as a ring-shaped work, of which a ring-shaped bonded magnet is representative, by using the electroplating device.