Abstract: A hot melt adhesive composition exhibiting excellent adhesive strength and which is useful as an adhesive for styrene resins contains (B) tackifier and (C) ethylene/C3-C20 &agr;-olefin/aromatic vinyl compound random copolymer and, in some embodiments also (A) base polymer, such as polyolefin, polar group-containing polymer and aromatic vinyl compound/conjugated diene copolymer. A low molecular weight polyolefin may also be included in all embodiments. The randon copolymer (C) may be prepared by polymerizing the &agr;-olefin and aromatic vinyl compound in the presence of a metallocene containing catalyst. In addition to excellent adhesive strength the hot melt adhesives have improved workability.