Abstract: The invention relates to a novel metal mold having anti-adhesive properties comprising a base metal mold and an anti-adhesive layer comprising a fluorinated alkyl phosphoric acid derivative or a fluorinated alkyl poly-phosphoric acid derivative, including a phosphorous atom and an alkyl chain. The anti-adhesive layer is bonded directly onto a surface of the base metal mold. The base metal mold may be e.g. Nickel, and said fluorinated alkyl phosphoric acid derivative or said fluorinated alkyl poly-phosphoric acid derivative may be selected front the group consisting of phosphonic acids, phosphinic acids, phosphonates and phosphonate salts, phosphinates and phosphinate salts, or their respective oligomers, such that the phosphorous atom is coupled directly to the alkyl chain, such that the phosphorous atom is coupled directly to the alkyl chain.

Abstract: An interphase coating is formed by chemical vapor infiltration (CVI) on the fibers constituting a fiber preform, the interphase coating comprising at least an inner layer in contact with the fibers for embrittlement relief to the composite material, and an outer layer for bonding with the ceramic matrix. The fiber preform is then kept in its shape by the fibers provided with the interphase coating and is consolidated by being impregnated with a liquid composition containing a ceramic precursor, and by transforming the precursor into a ceramic matrix consolidation phase. The consolidated preform is then densified by an additional ceramic matrix phase. No support tooling is needed for forming the interphase coating by CVI or for densification after consolidation using the liquid technique.

Abstract: A method of processing a polysilazane film includes a first heat process and a subsequent second heat process performed on a target substrate with a polysilazane coating film formed thereon. The first heat process is performed by supplying water vapor into a process area within a reaction container, which accommodates the target substrate, while setting the process area at a first temperature of from 390° C. to 410° C. The second heat process is performed by supplying water vapor into the process area, while setting the process area at a second temperature of from 600° C. to 800° C.